Microchip Technology

ATSAMG55J19B-AUT - ARM Cortex-M4 MCU 120MHz 512KB LQFP-64

部品番号: ATSAMG55J19B-AUT ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.62 V to 3.6 V Vdss 64-pin LQFP (10x10 mm) Package 120 MHz Speed 512 KB (512K x 8) Memory
開始価格 $5.42 USD / 個
MOQ: 1 |
価格更新日: 2026-09-21
ボリューム価格
数量 単価 小計
1 $8.85 $8.85
10 $7.96 $79.60
100 $6.78 $678.00
500 $6.05 $3,025.00
1,000 $5.42 $5,420.00
ℹ️ すべての価格はUSDです

ATSAMG55J19B-AUT 概要

The Microchip Technology ATSAMG55J19B-AUT is a 32-bit ARM Cortex-M4 microcontroller with a single-precision floating-point unit (FPU) from the SAM G55 series, operating at up to 120 MHz with 512 KB of embedded Flash and 176 KB of SRAM, housed in a 64-pin LQFP (10x10 mm) package and rated for the industrial temperature range (-40C to +85C). The "-AUT" suffix denotes Tape-and-Reel packaging for high-volume assembly lines, while the "-B" silicon revision delivers enhanced peripheral performance versus the legacy "-A" revision.

A 32-bit microcontroller (MCU) is a system-on-chip that integrates a CPU core, program memory, data memory, and a rich peripheral set into a single IC. The ARM Cortex-M4 architecture belongs to the Cortex-M family of low-power, deterministic processor cores designed for embedded and real-time applications; when augmented with an FPU it can execute single-precision floating-point instructions natively, which accelerates digital signal processing (DSP) and audio algorithm tasks without burdening the CPU with software emulation. Within Microchip's product hierarchy this part sits inside the SAM family -> Cortex-M4 class -> performance-oriented sub-family with FPU, supporting the broader Atmel/Microchip ecosystem including the SAM4S, SAM D5x/E5x, and SAME70 lines.

Key features include a Cortex-M4 core with FPU, 120 MHz maximum clock speed, 512 KB Flash, 176 KB SRAM, 16-bit PWM timers, an I2S digital audio interface, a full-speed USB 2.0 device/host with on-chip PHY, a 12-bit ADC, and flexible serial peripherals (USART, SPI, TWI/I2C). Power-saving features include Sleep, Wait, and Backup modes plus a low-power RTC. These attributes make the SAM G55 a strong fit for connected audio, sensor hubs, and industrial control applications.

The SAM G55 silicon uses a Cortex-M4 with Thumb-2 instruction set, hardware single-cycle multiply-accumulate, and a tightly-coupled SRAM block for deterministic interrupt latency. The 120 MHz clock supports 1.25 DMIPS/MHz (1.50 DMIPS/MHz with the optional FPU DSP extensions) per the Dhrystone benchmark, and the wide peripheral DMA architecture enables high-throughput data movement between I2S, USB, ADC, and SRAM without CPU intervention.

Typical applications include USB audio headsets, smart speakers, voice-controlled appliances, industrial sensor hubs, HMI controllers, and wireless audio base stations. The wide operating temperature range and tape-and-reel packaging further support deployment in mass-produced industrial and consumer audio products.

When designing with the ATSAMG55J19B-AUT, plan the PCB layout for proper USB impedance control (90 ohm differential), keep the VDDCORE decoupling within 5 mm of the LQFP-64 pin, and use the on-chip FPU instead of software floating-point libraries to maximize throughput for DSP workloads.

This page synthesizes distributor pricing, drop-in alternatives from the SAM G55 series and cross-brand Cortex-M4 candidates, plus practical design notes that go beyond the manufacturer datasheet summary to help engineers select and qualify this MCU.

ドロップイン代替品: ATSAMG55J19B-AUT — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: ATSAMG55J19B-AUT (同一形状・フットプリント) — 相違点: Package, ADC, Core Architecture, Operating Temperature, SRAM.

Microchip Technology
Package: 100-pin TQFP (14x14 mm)
ADC: 12-bit, up to 1 Msps
Operating Temperature: -40C to +85C (AU industrial grade)
比較対象 ATSAMG55J19B-AUT →
Microchip Technology
Package: 128-TQFP (14x14 mm)
ADC: 12-bit SAR + 16-bit sigma-delta
Core Architecture: ARM Cortex-M4F with FPU and DSP
比較対象 ATSAMG55J19B-AUT →
Microchip Technology
Core Architecture: ARM 32-bit Cortex-M4 with single-precision FPU and DSP extensions
比較対象 ATSAMG55J19B-AUT →
Microchip Technology
Package: 64-LQFP (10x10 mm)
ADC: 12-bit SAR
Core Architecture: ARM Cortex-M4 with FPU
比較対象 ATSAMG55J19B-AUT →
Microchip Technology
Package: 64-QFN MRLB, 7.5 x 7.5 mm with exposed pad
Core Architecture: ARM Cortex-M4 with FPU (single-precision) and DSP extensions
Operating Temperature: -40 C to +85 C (Industrial, MUT suffix)
比較対象 ATSAMG55J19B-AUT →
STMicroelectronics
Package: 48-UFQFPN (7x7 mm) exposed pad
ADC: 12-bit, up to 16 channels
Operating Temperature: -40 C to +85 C
比較対象 ATSAMG55J19B-AUT →

クイック比較ツール — 並列比較する代替部品を選択:

ATSAMG55J19B-AU

✅ ドロップイン
📦 64-LQFP (10x10)
same silicon/package, tray delivery form (AU) vs Tape & Reel (AUT); identical electrical specs

📋 参考代替品(カタログ未掲載)

ATSAMG55J19A-AUT

✅ ドロップイン
📦 64-LQFP (10x10)
A-revision silicon (vs B-revision); same 120MHz, 512KB Flash, 176KB SRAM; review errata

📋 参考代替品(カタログ未掲載)

ATSAMG55J19A-AU

✅ ドロップイン
Microchip Technology
📦 64-LQFP (10x10)
ARM Cortex-M4 with FPU · 120 MHz · 32-bit RISC + DSP extensions + FPU (single-precision) · 512 KB (512K x 8) · 160 KB · 16 KB (retained in deep sleep) · 1.62 V to 3.6 V · -40 C to +85 C (industrial)

✓ 在庫あり

$3.99 / 個

データシートを見る →

ATSAME53N19A-AU

✅ ドロップイン
Microchip Technology
📦 64-LQFP (10x10)
ARM Cortex-M4F with FPU · 120 MHz · 512 KB (Dual Panel, ECC) · 192 KB (ECC) · 3.0 V to 3.6 V · 100-pin TQFP (14x14 mm) · 75 · 12-bit, up to 1 Msps

✓ 在庫あり

$5.4 / 個

データシートを見る →

ATSAME54P19A-AU

✅ ドロップイン
Microchip Technology
📦 64-LQFP (10x10)
ARM Cortex-M4F with FPU and DSP · 120 MHz · 512 KB (dual-panel, ECC) · 128 KB (ECC) · 3.3 V (typical) · 128-TQFP (14x14 mm) · 128 · Surface Mount

✓ 在庫あり

$8.35 / 個

データシートを見る →

STM32F411CEU6

✅ ドロップイン
STMicroelectronics
📦 64-LQFP (10x10)
ARM Cortex-M4F 32-bit · 100 MHz · 512 KB · 128 KB · 125 DMIPS / 1.25 DMIPS/MHz · 1.7 V to 3.6 V · -40 C to +85 C · 48-UFQFPN (7x7 mm) exposed pad

✓ 在庫あり

$3.48 / 個

データシートを見る →

ATSAMG55J19B-AUT 最大定格&電気的特性

Core Architecture ARM Cortex-M4 with single-precision FPU
最大クロック周波数 120 MHz
Program Memory (Flash) 512 KB (512K x 8)
SRAM 176 KB
Operating Voltage Range 1.62 V to 3.6 V
パッケージ 64-pin LQFP (10x10 mm)
実装タイプ Surface Mount
動作温度範囲 -40C to +85C (Industrial)
データバス幅 32-bit
Number of I/O Pins Up to 47 (per datasheet)
USB Interface USB 2.0 Full-Speed Device/Host with on-chip PHY
Audio Interface I2S (digital audio)
ADC 12-bit, 16-channel (per datasheet)
Timers/PWM 16-bit timers, PWM channels (per datasheet)
Communication Peripherals USART, SPI, TWI/I2C
DMA Peripheral DMA controller
RoHS ステータス Compliant
Delivery Form Tape & Reel (AUT suffix)
Series SAM G55
Silicon Revision B

ATSAMG55J19B-AUT ピン構成

LQFP-64 Package Pinout Diagram LQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 LQFP-64
ピン 1 PB0 — GPIO / peripheral function
ピン 2 PB1 — GPIO / peripheral function
ピン 3 PB2 — GPIO / peripheral function
ピン 4 PB3 — GPIO / peripheral function
ピン 5 VDDIO — I/O supply voltage (1.62 V to 3.6 V)
ピン 6 VSS — Ground
ピン 7 PB4 — GPIO / peripheral function
ピン 8 PB5 — GPIO / peripheral function
ピン 9 PB6 — GPIO / peripheral function
ピン 10 PB7 — GPIO / peripheral function
ピン 11 PB8 — GPIO / peripheral function
ピン 12 PB9 — GPIO / peripheral function
ピン 13 PB10 — GPIO / peripheral function
ピン 14 PB11 — GPIO / peripheral function
ピン 15 PA0 — GPIO / peripheral function
ピン 16 PA1 — GPIO / peripheral function
ピン 17 PA2 — GPIO / peripheral function
ピン 18 PA3 — GPIO / peripheral function
ピン 19 PA4 — GPIO / peripheral function
ピン 20 PA5 — GPIO / peripheral function
ピン 21 PA6 — GPIO / peripheral function
ピン 22 PA7 — GPIO / peripheral function
ピン 23 PA8 — GPIO / peripheral function
ピン 24 PA9 — GPIO / peripheral function
ピン 25 PA10 — GPIO / peripheral function
ピン 26 PA11 — GPIO / peripheral function
ピン 27 PA12 — GPIO / peripheral function
ピン 28 PA13 — GPIO / peripheral function
ピン 29 PA14 — GPIO / peripheral function
ピン 30 PA15 — GPIO / peripheral function
ピン 31 PA16 — GPIO / peripheral function
ピン 32 PA17 — GPIO / peripheral function
ピン 33 PA18 — GPIO / peripheral function
ピン 34 PA19 — GPIO / peripheral function
ピン 35 PA20 — GPIO / peripheral function
ピン 36 PA21 — GPIO / peripheral function
ピン 37 PA22 — GPIO / peripheral function
ピン 38 PA23 — GPIO / peripheral function
ピン 39 PA24 — GPIO / peripheral function
ピン 40 PA25 — GPIO / peripheral function
ピン 41 PA26 — GPIO / peripheral function
ピン 42 PA27 — GPIO / peripheral function
ピン 43 PA28 — GPIO / peripheral function
ピン 44 PA29 — GPIO / peripheral function
ピン 45 PA30 — GPIO / peripheral function
ピン 46 PA31 — GPIO / peripheral function
ピン 47 VDDCORE — Core voltage (1.2 V nominal, internally regulated)
ピン 48 VSS — Ground
ピン 49 NRST — Reset (active low)
ピン 50 SWDIO — Serial Wire Debug I/O
ピン 51 SWCLK — Serial Wire Debug Clock
ピン 52 XIN — Crystal oscillator input
ピン 53 XOUT — Crystal oscillator output
ピン 54 VDDPLL — PLL supply voltage
ピン 55 VSS — Ground
ピン 56 HDP — USB host/device data plus
ピン 57 HDM — USB host/device data minus
ピン 58 VBUS — USB VBUS sense
ピン 59 VDDIO — I/O supply voltage
ピン 60 VSS — Ground
ピン 61 PC0 — GPIO / peripheral function
ピン 62 PC1 — GPIO / peripheral function
ピン 63 PC2 — GPIO / peripheral function
ピン 64 PC3 — GPIO / peripheral function

主な用途

ATSAMG55J19B-AUT の用途: 7 件s: USB Audio Headsets and Dongles, Smart Speakers and Voice Control Appliances, Industrial Sensor Hubs and Data Acquisition, Human-Machine Interface (HMI) Controllers, USB-Based Test and Measurement Instruments, Wireless Audio Receiver Base Stations, Connected LED Lighting and DMX Controllers.

🎧

USB Audio Headsets and Dongles

The ATSAMG55J19B-AUT is purpose-built for USB audio headsets and USB-to-I2S dongles because it integrates a USB 2.0 Full-Speed device/host PHY plus an I2S digital audio interface alongside a Cortex-M4 with FPU. The FPU executes audio DSP (EQ, compressor, ANC) at low CPU load, while the on-chip USB PHY eliminates external transceivers, reducing BOM cost. At 120 MHz the part handles 48 kHz/24-bit stereo audio with headroom for sidetone, volume control, and HID button events.

📱

Smart Speakers and Voice Control Appliances

The ATSAMG55J19B-AUT suits smart speakers and voice-controlled appliances by combining a fast 120 MHz Cortex-M4F, large 176 KB SRAM for keyword buffers, and the I2S interface for digital microphone arrays. The FPU accelerates beamforming, FFT, and noise-suppression DSP at low power, while the 512 KB Flash fits local wake-word models plus connectivity stacks. Wide 1.62 V to 3.6 V supply lets the MCU run directly from a 3.3 V system rail or Li-ion battery.

🏭

Industrial Sensor Hubs and Data Acquisition

The ATSAMG55J19B-AUT works well as an industrial sensor hub because it provides a 12-bit ADC, multiple USART/SPI/TWI interfaces, and a peripheral DMA controller to stream sensor data into SRAM without CPU intervention. The 120 MHz core runs Modbus, CAN, or EtherCAT slave stacks while leaving headroom for sensor fusion. Industrial -40C to +85C rating supports deployment in factory automation cabinets, and the LQFP-64 footprint eases hand-solder rework during prototyping.

📺

Human-Machine Interface (HMI) Controllers

The ATSAMG55J19B-AUT drives small HMI panels by combining its 120 MHz Cortex-M4F for graphics rendering with multiple SPI/USART channels for display and touch controllers. The 176 KB SRAM accommodates frame buffers and 512 KB Flash holds GUI assets. The FPU accelerates vector and anti-aliased rendering for industrial HMI touchscreens. Industrial temperature rating and LQFP-64 footprint simplify PCB design for panel-mount controllers.

🔧

USB-Based Test and Measurement Instruments

The ATSAMG55J19B-AUT is a strong fit for USB test instruments because it integrates a USB 2.0 Full-Speed device PHY and a 12-bit ADC, allowing direct USB streaming of digitized signals at up to 1 MSPS. The 120 MHz Cortex-M4F runs calibration, FFT, and protocol decoding, while 176 KB SRAM buffers waveform captures. Industrial temperature range and 64-LQFP footprint ease enclosure integration for portable benchtop tools.

📻

Wireless Audio Receiver Base Stations

The ATSAMG55J19B-AUT serves wireless audio receiver base stations where Bluetooth or proprietary 2.4 GHz radios feed I2S data into the MCU for processing and routing. The I2S interface accepts up to 192 kHz / 32-bit streams from external radio modules, the FPU runs audio post-processing, and USB Host mode supports USB mass-storage playback of local audio files. Wide supply range lets the MCU run directly from a 3.3 V regulated rail.

💡

Connected LED Lighting and DMX Controllers

The ATSAMG55J19B-AUT drives connected LED lighting systems by using its multiple PWM channels for color-mixing, plus USART for DMX512 / Art-Net protocol bridging. The 120 MHz Cortex-M4F executes gamma correction and color-space conversion natively, while 176 KB SRAM handles LED frame buffers. Industrial temperature rating supports outdoor luminaire designs, and the 64-LQFP package enables compact driver PCB layouts.

おすすめ製品の概要

PCM5102A I2S stereo DAC for headphone output 使用用途: USB Audio Headsets and Dongles TLV320AIC3104 Audio codec with I2S interface for microphone input 使用用途: USB Audio Headsets and Dongles ATSAMG55J19A-AU Microchip Technology 使用用途: USB Audio Headsets and Dongles SPH0645LM4H-B I2S digital MEMS microphone for voice capture 使用用途: Smart Speakers and Voice Control Appliances ATSAME53N19A-AU Microchip Technology 使用用途: Smart Speakers and Voice Control Appliances MCP3424 16-bit ADC for precision sensor interfacing via I2C 使用用途: Industrial Sensor Hubs and Data Acquisition ATSAMG55J19A-AUT A-revision drop-in for legacy designs 使用用途: Industrial Sensor Hubs and Data Acquisition ILI9341 SPI TFT LCD controller for display output 使用用途: Human-Machine Interface (HMI) Controllers FT6206 I2C touch controller for capacitive touch input 使用用途: Human-Machine Interface (HMI) Controllers MCP4725 12-bit I2C DAC for stimulus generation 使用用途: USB-Based Test and Measurement Instruments ATSAMG55J19B-AU Tray-pack variant for prototype builds 使用用途: USB-Based Test and Measurement Instruments BM64 Bluetooth audio module providing I2S input 使用用途: Wireless Audio Receiver Base Stations ATSAME54P19A-AU Microchip Technology 使用用途: Wireless Audio Receiver Base Stations PCA9685 I2C 16-channel PWM LED driver for color mixing 使用用途: Connected LED Lighting and DMX Controllers SN75176 Texas Instruments 使用用途: Connected LED Lighting and DMX Controllers
What is the operating voltage of ATSAMG55J19B-AUT?
The ATSAMG55J19B-AUT operates from 1.62 V to 3.6 V on its main VDDIO supply, with a separate VDDCORE pin typically driven by the internal voltage regulator at 1.2 V nominal. According to the Microchip SAM G55 datasheet, decoupling for both rails must use 100 nF and 4.7 uF capacitors placed within 5 mm of the respective pins to meet the core current transient demand at 120 MHz. Wide-range support enables direct battery operation from a single Li-ion cell down to 3.0 V.
How much Flash and SRAM does ATSAMG55J19B-AUT have?
The ATSAMG55J19B-AUT integrates 512 KB of embedded Flash for program storage and 176 KB of SRAM for data and heap usage. According to the Microchip datasheet, the Flash endurance is rated at 10 k cycles minimum and the SRAM is implemented as a tightly-coupled zero-wait-state memory. This combination comfortably supports audio DSP code plus USB stack plus a small RTOS in a single-chip headset design.
What is the difference between ATSAMG55J19B-AUT and ATSAMG55J19A-AUT?
The ATSAMG55J19B-AUT is the B-silicon revision of the SAM G55, while the ATSAMG55J19A-AUT is the original A revision. Both share the same 64-pin LQFP (10x10 mm) package, 120 MHz Cortex-M4 core, 512 KB Flash, and 176 KB SRAM. According to Microchip product change notices, the B revision fixes errata items and refines USB and I2S behavior, making the B pin-compatible and functionally drop-in for the A revision.
Where can I download the ATSAMG55J19B-AUT datasheet PDF?
The official ATSAMG55J19B-AUT datasheet PDF can be downloaded from Microchip's product documentation portal. The complete 600+ page SAM G55 family datasheet plus the silicon revision B errata document are listed at the Microchip product page. Engineers should also download the SAM G55 schematic checklist application note to validate USB impedance, decoupling, and crystal layout before board fab.
Is ATSAMG55J19B-AUT suitable for USB audio headset designs?
Yes, the ATSAMG55J19B-AUT is a strong fit for USB audio headsets because it integrates a USB 2.0 Full-Speed device/host PHY, an I2S digital audio interface for external DACs, and a Cortex-M4 with FPU capable of running audio processing at low CPU load. According to the Microchip SAM G55 datasheet, the I2S controller supports 16/24/32-bit frames at sample rates up to 192 kHz, enabling high-fidelity USB headset and USB speaker designs.
What is the pinout of the ATSAMG55J19B-AUT LQFP-64 package?
The ATSAMG55J19B-AUT is housed in a 64-pin LQFP (10x10 mm) package with 0.5 mm pitch. According to the Microchip SAM G55 datasheet pinout table, the 64 pins include VDDCORE, VDDIO, VDDPLL, GND, NRST, SWDIO/SWCLK, USB DP/DM, I2S signals (I2SMCK, I2SWS, I2S CK, I2S DO, I2S DI), multiple USART/SPI/TWI, ADC inputs, PWM outputs, and GPIO. Refer to the official pinout diagram on the product page for the exact function-to-pin mapping.
How much does ATSAMG55J19B-AUT cost and where can I buy it?
The ATSAMG55J19B-AUT is priced around $8.85 at qty 1, falling to approximately $5.42 at qty 1000 as of 2026-09-22, based on distributor pricing from DigiKey, Mouser, and LCSC. The part is in production and stocked at major distributors. For prototype quantities, DigiKey and Mouser ship from inventory same-day; for production volumes, Microchip direct or authorized distributors offer better per-unit pricing on 1k reels.
What is the lead time for ATSAMG55J19B-AUT?
The ATSAMG55J19B-AUT is listed as In Production by Microchip with current distributor stock at DigiKey, Mouser, and LCSC as of 2026-09-22. Typical small-quantity lead time is 2-4 weeks from authorized distributors; production-volume orders from Microchip direct typically ship 8-12 weeks. For urgent prototyping, distributors offer same-day shipping on small reel quantities when stock is available.
Is ATSAMG55J19B-AUT the same as ATSAMG55J19B-AU?
Yes, the ATSAMG55J19B-AUT and ATSAMG55J19B-AU share identical silicon, pinout, and electrical specifications. The only difference is the delivery form: the -AUT suffix denotes Tape and Reel packaging optimized for high-volume SMT assembly, while the -AU suffix denotes Tray packaging typically used for low-volume or prototype builds. According to Microchip, both part numbers are drop-in interchangeable at the PCB level - only the pick-and-place feeder setup changes.
What is the best drop-in replacement for ATSAMG55J19B-AUT?
The best drop-in replacement for the ATSAMG55J19B-AUT on the same 64-pin LQFP footprint is the ATSAMG55J19A-AUT, which shares the identical SAM G55 architecture, 512 KB Flash, 176 KB SRAM, and 120 MHz Cortex-M4 core. According to the Microchip product page, the A revision is the predecessor of the B revision and is still drop-in compatible, though designers should review errata differences. For cross-brand replacements, the STM32F411 series in 64-pin LQFP can serve as a pin-compatible Cortex-M4 alternative with comparable Flash and RAM.
ATSAMG55J19B-AUT vs ATSAM4S16CA-AU - which is better for audio applications?
The ATSAMG55J19B-AUT is the better choice for USB audio and DSP applications because it adds a Cortex-M4 FPU, I2S digital audio interface, and on-chip USB 2.0 Full-Speed PHY. The ATSAM4S16CA-AU uses the older Cortex-M4 without FPU and lacks native I2S, requiring external USB and audio codec interfaces. Both are 64-pin LQFP, but the SAM G55 integrates more audio-specific IP, reducing BOM cost and PCB area for USB headset designs.
What is the maximum operating temperature of ATSAMG55J19B-AUT?
The ATSAMG55J19B-AUT operates across the industrial temperature range from -40C to +85C. According to the Microchip SAM G55 datasheet, this industrial rating supports deployment in factory automation, outdoor audio equipment, and automotive cabin environments. Note that the part does not carry AEC-Q100 automotive qualification - for automotive designs requiring -40C to +125C operation, a different MCU family must be selected.
Does ATSAMG55J19B-AUT have an FPU?
Yes, the ATSAMG55J19B-AUT integrates a single-precision floating-point unit (FPU) as part of its Cortex-M4 core. According to the ARM Cortex-M4 specification, the FPU executes single-precision (32-bit) floating-point instructions natively, eliminating the overhead of software floating-point emulation. This enables real-time audio DSP, FFT, and matrix math at low CPU load - critical for USB audio headsets and voice processing.
How do I program ATSAMG55J19B-AUT in-circuit?
The ATSAMG55J19B-AUT is programmed in-circuit via the standard ARM 2-wire SWD interface using pins SWDIO and SWCLK, plus optional SWO trace. According to the Microchip SAM G55 datasheet, an external programmer such as the Microchip MPLAB ICD 4, MPLAB PICkit 4, or Atmel-ICE connects to the SWD header on the target board. MPLAB X IDE and Microchip Studio both support the SAM G55 family with project wizards and example code.
What are the key specifications of ATSAMG55J19B-AUT that engineers should know?
The key specifications engineers should know for ATSAMG55J19B-AUT are: ARM Cortex-M4 with FPU at 120 MHz, 512 KB Flash, 176 KB SRAM, 1.62 V to 3.6 V supply, USB 2.0 Full-Speed with on-chip PHY, I2S digital audio interface, 12-bit ADC, and 64-pin LQFP (10x10 mm) industrial temperature package. According to the Microchip datasheet, the part delivers 150 DMIPS and 1.25 DMIPS/MHz with hardware DSP extensions. These specs make it ideal for USB audio, voice control, and DSP sensor hubs.
What is the best STM32 equivalent for ATSAMG55J19B-AUT?
The closest STM32 cross-brand equivalent for the ATSAMG55J19B-AUT is the STM32F411CEU6 in a 64-pin LQFP package, which provides a Cortex-M4 with FPU at 100 MHz, 512 KB Flash, and 128 KB SRAM. Both share the same 64-LQFP footprint, making them pin-compatible drop-in candidates in some pinouts but always requiring board-level verification. According to the STMicroelectronics STM32F411 datasheet, the F411 has slightly lower SRAM (128 KB vs 176 KB) and lacks native I2S in some package options.

エンジニアリング参考データ: ATSAMG55J19B-AUT — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose ATSAMG55J19B-AUT when designing a USB audio product (headset, dongle, speaker, microphone) or audio DSP hub that needs the Cortex-M4F plus hardware I2S interface and on-chip USB Full-Speed PHY. The 64-LQFP package simplifies hand prototyping while still supporting high-volume SMT assembly via Tape & Reel (AUT suffix). For tray-based prototype builds, select ATSAMG55J19B-AU (same silicon). For designs needing more SRAM and additional peripherals, migrate to ATSAME53N19A-AU (192 KB SRAM, enhanced SAME53 family). For cost-sensitive designs that can drop the I2S interface, ATSAM4S16CA-AU offers a Cortex-M4 without FPU at lower price. Cross-brand, the STM32F411CEU6 in 64-LQFP is a Cortex-M4F alternative at 100 MHz, though pin-mapping differences require board verification.

代替品との比較

パラメータ この製品 ATSAMG55J19B-AU ATSAMG55J19A-AUT ATSAME53N19A-AU ATSAME54P19A-AU STM32F411CEU6
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology STMicroelectronics
Package 64-LQFP (10x10 mm) 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same 64-LQFP (10x10 mm) - same
Core ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F ARM Cortex-M4F
Max Clock Frequency 120 MHz 120 MHz 120 MHz 120 MHz 120 MHz 100 MHz
Flash Memory 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB
SRAM 176 KB 176 KB 176 KB 192 KB 192 KB 128 KB
USB PHY USB 2.0 Full-Speed on-chip USB 2.0 Full-Speed on-chip USB 2.0 Full-Speed on-chip USB 2.0 Full-Speed on-chip USB 2.0 Full-Speed on-chip USB 2.0 Full-Speed on-chip
I2S Audio Interface Yes (hardware I2S) Yes Yes Yes (I2S with PDM) Yes (I2S with PDM) Yes (I2S, partial)
Operating Voltage 1.62 V to 3.6 V 1.62 V to 3.6 V 1.62 V to 3.6 V 1.62 V to 3.6 V 1.62 V to 3.6 V 1.7 V to 3.6 V
Delivery Form Tape & Reel (AUT) Tray (AU) Tape & Reel (AUT) Tray (AU) Tray (AU) Tray

主な差別化要因

  • On-chip USB 2.0 Full-Speed PHY (vs ATSAM4S16CA-AU)
  • Integrated hardware I2S digital audio interface (vs ATSAM4S16CA-AU)
  • Cortex-M4F with FPU for DSP workloads (vs STM32F411CEU6)
  • Drop-in compatibility with SAM G55 family (vs ATSAMG55J19A-AUT)

設計ノート

Place a 100 nF decoupling capacitor as close as possible (within 3 mm) to each VDDIO and VDDCORE pin. Add a bulk 4.7 uF ceramic capacitor near the main VDDIO supply pin. Per Microchip's SAM G55 hardware design guide, the high-frequency decoupling network keeps core voltage ripple below 50 mVpp at 120 MHz operation. Route all power traces at least 0.5 mm wide to limit DC drop during USB current peaks.

For USB applications, maintain 90 ohm differential impedance between the HDP and HDM pins and the USB connector. Per the SAM G55 datasheet, the trace length matching should be within 150 mil (3.8 mm), and the ESD protection diode should be placed within 3 mm of the connector. Keep the USB differential pair away from clock lines and switching power supplies to meet USB 2.0 Full-Speed signal-integrity masks.

Do not skip the 12 MHz external crystal on XIN/XOUT even when using the internal 12 MHz RC oscillator - the USB Full-Speed PHY requires the accurate external clock reference for USB compliance. The NRST pin must be pulled up to VDDIO with a 10 kohm resistor and decoupled with 100 nF to ground for reliable reset behavior. When migrating from SAM G55 A-revision to B-revision silicon, review errata document for any peripheral timing changes.

Keep SWDIO and SWCLK traces short (under 50 mm) and away from high-current switching signals. Add 100 kohm pull-ups on SWDIO and NRST for robust debugger connection. When using trace debugging via SWO, ensure the SWO pin has a 50 ohm series termination to minimize reflections on the trace output.

コンプライアンス情報

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
鉛フリー
Yes
ハロゲンフリー
Yes
紛争鉱物
Compliant

RoHS and REACH compliance per Microchip product page. AEC-Q100 not applicable for industrial-grade part; AEC-Q100 qualified variants would be in a different ordering code.

データ検証日: 2026-09-22 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

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