CY91F526KSDPMC-GSE2 - 32-bit 80MHz MCU 1MB Flash 144-LQFP | Infineon
部品番号: CY91F526KSDPMC-GSE2 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $17.2 | $172.00 |
| 100 | $15.4 | $1,540.00 |
| 500 | $13.85 | $6,925.00 |
| 1,000 | $12.3 | $12,300.00 |
CY91F526KSDPMC-GSE2 概要
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, working RAM, and a wide range of peripheral interfaces (timers, ADC, CAN, LIN, GPIO, etc.) into one package. In the broader semiconductor taxonomy, an MCU belongs to the embedded processor family, which sits under microcontrollers and controllers, then under integrated circuits (ICs), then under semiconductors. Automotive MCUs form a hardened sub-category designed to survive under-the-hood thermal, vibration, and EMI stress.
Key features include a high-performance FR81S 32-bit core optimized for real-time control, 1.0625 MB of embedded flash for application code and data, on-chip debug and trace, multiple CAN/LIN/SPI/UART interfaces, and 12-bit A/D converters. The 144-LQFP package provides ample I/O count for body-control modules and supports surface-mount assembly with standard lead-free reflow.
The architecture is built around the FR family CPU with tightly coupled flash and SRAM buses, deterministic interrupt handling, and hardware MAC multipliers for signal-processing workloads. The peripheral set is configurable through Cypress/Infineon peripheral manager tools, allowing pin-function remapping and DMAC transfers to offload the CPU.
Typical applications include automotive body control modules, HVAC climate controllers, instrument clusters, lighting ECUs, and industrial automation controllers. Its AEC-Q100 qualification also makes it suitable for chassis subsystems and electric powertrain auxiliaries with appropriate derating.
When designing with this part, allocate PCB area for the 144-LQFP footprint (0.5 mm pitch) and ensure the supply rails are decoupled with low-ESR ceramic capacitors placed close to the VDD/VSS pin groups. Programming is supported through the Cypress/Infineon flash toolchain; verify JTAG/SWD header population for production programming.
This page synthesizes distributor pricing, drop-in family alternatives, and design notes not always visible on the manufacturer landing page. Pricing references are stated as of 2026-10-07 and may fluctuate with supply conditions.
ドロップイン代替品: CY91F526KSDPMC-GSE2 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: CY91F526KSDPMC-GSE2 （同一形状・フットプリント） — 相違点: Core, Series, Package.
クイック比較ツール — 並列比較する代替部品を選択:
CY91F526KSDPMC-GSE1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY91F526KHEPMC-GS-F4E1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
CY91F526KSDPMC-GSE2 最大定格＆電気的特性
| Manufacturer | Infineon (formerly Cypress) |
| Series | FR81S / MB91520 (CY91520) |
| Core | FR81S 32-bit single-core |
| Core Architecture | FR ( Fujitsu RISC ) |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 1.0625 MB (1,088 KB / 1.0625M x 8) |
| パッケージ | 144-LQFP (20x20 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +125 C (AEC-Q100 automotive) |
| Communication Interfaces | CAN, UART, I2C, SPI (peripheral manager configurable) |
| ADC | 12-bit A/D converter(s) integrated |
| AEC-Q100 Grade | Automotive qualified |
| MSLレベル | 3 (per JEDEC J-STD-020) |
| RoHS ステータス | Compliant |
| Lead-Free / Halogen-Free | Lead-free finish (per JEDEC J-STD-709) |
CY91F526KSDPMC-GSE2 144-lqfp (20x20 mm, 0.5 mm pitch) ピン配置ガイド
CY91F526KSDPMC-GSE2 (144-lqfp (20x20 mm, 0.5 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: CY91F526KSDPMC-GSE2.
詳細は データシート をご参照ください。
主な用途
CY91F526KSDPMC-GSE2 の用途: 6 件s: Automotive Body Control Module, HVAC Climate Controller, Instrument Cluster, Automotive Lighting ECU, Industrial Automation Controller, Chassis Sub-System ECU.
Automotive Body Control Module
The CY91F526KSDPMC-GSE2 fits BCM applications because it combines a 32-bit FR81S core at 80 MHz with 1.0625 MB of flash - enough headroom for door-zone, lighting, and wiper control firmware. Its 144-LQFP exposes ample GPIO for body-domain switch and relay drivers. AEC-Q100 qualification and -40C to +125C operation suit cabin and under-hood BCM placement, while CAN/LIN peripherals communicate with the vehicle network.
おすすめ
HVAC Climate Controller
For HVAC ECUs, the CY91F526KSDPMC-GSE2 supplies the deterministic real-time performance needed for blower speed, blend-door, and seat-heater control loops. The 12-bit ADC accurately reads cabin temperature and humidity sensors, while 1.0625 MB flash stores calibration tables for multi-zone climate strategies. AEC-Q100 qualification ensures reliable performance across cabin temperature extremes.
おすすめ
Instrument Cluster
Instrument clusters benefit from the CY91F526KSDPMC-GSE2's 80 MHz FR81S core, which drives stepper-motor gauges and segment LCDs while running CAN diagnostics in parallel. The 1.0625 MB flash holds multi-language cluster firmware, gauge curves, and telltale bitmaps. The 144-LQFP exposes enough pins for stepper drivers, switch matrix, and dual-LIN to the body network.
おすすめ
Automotive Lighting ECU
Headlamp and ambient-lighting ECUs use the CY91F526KSDPMC-GSE2 for matrix-LED dimming, DRL sequencing, and fault diagnostics. The 80 MHz core handles PWM generation and LIN-commanded lighting commands with deterministic jitter, while 1.0625 MB flash stores fade profiles per market. AEC-Q100 plus -40C to +125C rating covers exterior headlamp modules with thermal headroom.
おすすめ
Industrial Automation Controller
Industrial PLCs and motion sub-controllers adopt the CY91F526KSDPMC-GSE2 when AEC-Q100 headroom and FR81S deterministic interrupt latency are required. 1.0625 MB flash runs IEC 61131-3 logic plus custom motion code. The 144-LQFP provides GPIO and CAN/Ethernet expansion for distributed I/O networks, and -40C to +125C operation handles cabinet thermal stress.
おすすめ
Chassis Sub-System ECU
Brake, steering, and suspension sub-ECUs can leverage the CY91F526KSDPMC-GSE2's AEC-Q100 qualification and fast interrupt handling for sensor-fusion pre-processing. The 80 MHz FR81S core executes sensor-read cycles in microseconds, while 1.0625 MB flash holds calibration data. Note: this is a non-safety sub-controller role; safety-critical ASIL-D functions require an additional lockstep MCU.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: CY91F526KSDPMC-GSE2 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | CY91F526KSDPMC-GSE1 | CY91F526KHEPMC-GS-F4E1 |
|---|---|---|---|
| Brand | Infineon | Infineon | Infineon |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Core Architecture | FR81S 32-bit single-core | FR81S 32-bit single-core | FR81S 32-bit single-core |
| Maximum Clock | 80 MHz | 80 MHz | 80 MHz |
| Flash Size | 1.0625 MB | 1.0625 MB | 1.0625 MB |
| AEC-Q100 Grade | Automotive qualified | Automotive qualified | Automotive qualified |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C |
| Pin-to-Pin Compatibility | Reference | Yes (drop-in, same PMC 144-LQFP) | Yes (drop-in, same PMC 144-LQFP family) |
主な差別化要因
- AEC-Q100 automotive qualification with 1.0625 MB flash （vs Generic industrial 32-bit MCU)
- Drop-in stepping variants in same 144-LQFP package （vs Other automotive MCU families)
- FR81S core with deterministic real-time interrupt latency （vs Cortex-M class automotive MCUs)
設計ノート
The 144-LQFP at 0.5 mm pitch demands a 4-layer PCB with 0.2 mm via diameter and 0.4 mm pads for reliable assembly. Place decoupling capacitors (100 nF X7R) within 2 mm of each VDD/VSS pair. Stitch the ground plane generously under the package and tie the thermal pad to a copper pour to lower junction temperature under high I/O toggling loads.
Provide a clean 5V (or 3.3V) rail with bulk electrolytic plus ceramic decoupling. The CY91F526KSDPMC-GSE2 draws significant inrush during flash programming; ensure your supply can deliver at least 200 mA peak. Add a 10 uF + 100 nF combo on each analog supply pin to keep the 12-bit ADC noise floor low.
Do not assume the GSE1 and GSE2 stepping variants are firmware-identical: silicon stepping changes occasionally touch errata, watchdog timing, or peripheral revisions. Re-validate the BSP / startup code when migrating between steppings, even though the package and pinout are identical. Also confirm JTAG/SWD header pin mapping matches your programmer before first board bring-up.
コンプライアンス情報
AEC-Q100 qualified per Infineon product page. RoHS compliant. Halogen-free status not explicitly stated in available data and marked as unknown.
