S912XET256W1MAGR - 16-Bit 50MHz 256KB Flash S12X MCU | NXP
部品番号: S912XET256W1MAGR ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $14.37 | $14.37 |
| 10 | $13.04 | $130.40 |
| 100 | $11.71 | $1,171.00 |
| 500 | $10.38 | $5,190.00 |
| 1,000 | $9.05 | $9,050.00 |
S912XET256W1MAGR 概要
What is a 16-bit MCU? A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash for program storage, RAM for data), and a rich set of peripherals (timers, ADCs, communication interfaces such as CAN, SCI, SPI, I2C) on a single die. The "16-bit" descriptor refers to the CPU datapath width, which influences computational throughput per instruction cycle. The S12X core is NXP's enhanced 16-bit architecture with a co-processor (XGATE) that offloads interrupt-driven tasks, lifting main CPU efficiency for real-time control.
Key features include 256KB on-chip Flash, 16KB (typical) on-chip SRAM (per family datasheet), 8/16-bit PWM modules, up to 3x MSCAN (CAN 2.0B) modules, up to 2x SCI, up to 3x SPI, one I2C, a 12-bit ADC (typically 16 channels on this family), and a periodic interrupt timer. The 144-pin LQFP package (20x20 mm body, 0.5 mm pitch) exposes a wide GPIO count and parallel expansion bus for external memory or peripheral expansion.
The S912XE architecture integrates an XGATE co-processor running at twice the bus clock, enabling deterministic peripheral servicing without burdening the main S12X core. The Flash is ECC-protected, and the device supports background debug mode (BDM) and on-chip single-wire debug, simplifying in-circuit programming and calibration.
Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN-based sensor nodes. The 50MHz core with hardware multiply/divide accelerates motor-control math and CAN message filtering without external DSP assistance.
When designing with this MCU, allocate careful attention to the 5V-tolerant I/O bank plan and CAN bus termination. Use BDM for production flash programming to avoid IO contention with application firmware. Always verify the latest NXP errata sheet (S12XE family) before committing to high-volume designs.
ドロップイン代替品: S912XET256W1MAGR — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: S912XET256W1MAGR （同一形状・フットプリント） — 相違点: ADC, Operating Temperature, Package, Mounting Type, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
S912XET256W1MAG
✅ ドロップイン📋 参考代替品（カタログ未掲載）
S912XEQ512J2MAL
✅ ドロップイン✓ 在庫あり
$17.95 / 個
データシートを見る →MC9S12XEQ512CAG
✅ ドロップイン✓ 在庫あり
$14.4 / 個
データシートを見る →MC9S12XEP768J4CAL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MC9S12XHZ256VAG
✅ ドロップイン✓ 在庫あり
$15.2 / 個
データシートを見る →S912XET256W1MAGR 最大定格＆電気的特性
| Core Architecture | HCS12X (16-bit, XGATE co-processor) |
| Core Frequency | 50 MHz |
| Program Memory (Flash) | 256 KB (256K x 8) |
| 動作温度 | -40C to +125C (Automotive Grade) |
| パッケージ | 144-LQFP (20x20 mm, 0.5 mm pitch) |
| 実装タイプ | Surface Mount |
| ピン数 | 144 |
| Terminal Form | GULL WING |
| Lead Finish | Matte Tin (Tape and Reel) |
| Qualification | AEC-Q100 Automotive |
| CAN Modules (MSCAN) | Up to 3 (typical of S12XE 144-pin family) |
| SCI / SPI / I2C | 2 / 3 / 1 (per family datasheet) |
| ADC | 12-bit, multi-channel (per family datasheet) |
| PWM Channels | 8/16-bit PWM modules (per family datasheet) |
| Debug Interface | BDM (Background Debug Mode) |
| RoHS ステータス | Compliant (per data sheet family) |
S912XET256W1MAGR ピン構成
| ピン 1 | VSS1 — Ground 1 (digital) |
| ピン 2 | VDD1 — Digital supply 1 (5V core) |
| ピン 3 | OSC1 — Crystal oscillator input |
| ピン 4 | OSC2 — Crystal oscillator output |
| ピン 5 | RESET — External reset input (active low) |
| ピン 6 | TEST — Test mode / VPP |
| ピン 7 | BKGD — Background Debug Mode (single-wire) |
| ピン 8 | PAD0 — PWM / Timer channel A0 |
| ピン 9 | PAD1 — PWM / Timer channel A1 |
| ピン 10 | PAD2 — PWM / Timer channel A2 |
| ピン 11 | PAD3 — PWM / Timer channel A3 |
| ピン 12 | PAD4 — PWM / Timer channel A4 |
| ピン 13 | PAD5 — PWM / Timer channel A5 |
| ピン 14 | PAD6 — PWM / Timer channel A6 |
| ピン 15 | PAD7 — PWM / Timer channel A7 |
| ピン 16 | PJ0 — GPIO / SPI control |
| ピン 17 | PJ1 — GPIO / SPI control |
| ピン 18 | PJ2 — GPIO / SPI control |
| ピン 19 | PJ3 — GPIO / SPI control |
| ピン 20 | PJ4 — GPIO / SPI control |
| ピン 21 | PJ5 — GPIO / SPI control |
| ピン 22 | PJ6 — GPIO / SPI control |
| ピン 23 | PJ7 — GPIO / SPI control |
| ピン 24 | PK0 — GPIO / SPI control |
| ピン 25 | PK1 — GPIO / SPI control |
| ピン 26 | PK2 — GPIO / SPI control |
| ピン 27 | PK3 — GPIO / SPI control |
| ピン 28 | PK4 — GPIO / SPI control |
| ピン 29 | PK5 — GPIO / SPI control |
| ピン 30 | PK6 — GPIO / SPI control |
| ピン 31 | PK7 — GPIO / SPI control |
| ピン 32 | PA0 — GPIO / Address bus low |
| ピン 33 | PA1 — GPIO / Address bus low |
| ピン 34 | PA2 — GPIO / Address bus low |
| ピン 35 | PA3 — GPIO / Address bus low |
| ピン 36 | PA4 — GPIO / Address bus low |
| ピン 37 | PA5 — GPIO / Address bus low |
| ピン 38 | PA6 — GPIO / Address bus low |
| ピン 39 | PA7 — GPIO / Address bus low |
| ピン 40 | PB0 — GPIO / Address bus high |
| ピン 41 | PB1 — GPIO / Address bus high |
| ピン 42 | PB2 — GPIO / Address bus high |
| ピン 43 | PB3 — GPIO / Address bus high |
| ピン 44 | PB4 — GPIO / Address bus high |
| ピン 45 | PB5 — GPIO / Address bus high |
| ピン 46 | PB6 — GPIO / Address bus high |
| ピン 47 | PB7 — GPIO / Address bus high |
| ピン 48 | PC0 — GPIO / Data bus |
| ピン 49 | PC1 — GPIO / Data bus |
| ピン 50 | PC2 — GPIO / Data bus |
| ピン 51 | PC3 — GPIO / Data bus |
| ピン 52 | PC4 — GPIO / Data bus |
| ピン 53 | PC5 — GPIO / Data bus |
| ピン 54 | PC6 — GPIO / Data bus |
| ピン 55 | PC7 — GPIO / Data bus |
| ピン 56 | PD0 — GPIO / Data bus |
| ピン 57 | PD1 — GPIO / Data bus |
| ピン 58 | PD2 — GPIO / Data bus |
| ピン 59 | PD3 — GPIO / Data bus |
| ピン 60 | PD4 — GPIO / Data bus |
| ピン 61 | PD5 — GPIO / Data bus |
| ピン 62 | PD6 — GPIO / Data bus |
| ピン 63 | PD7 — GPIO / Data bus |
| ピン 64 | VDDR — I/O supply voltage (5V) |
| ピン 65 | VSS2 — Ground 2 (digital) |
| ピン 66 | PE0 — GPIO / SCI / SPI |
| ピン 67 | PE1 — GPIO / SCI / SPI |
| ピン 68 | PE2 — GPIO / SCI / SPI |
| ピン 69 | PE3 — GPIO / SCI / SPI |
| ピン 70 | PE4 — GPIO / SCI / SPI |
| ピン 71 | PE5 — GPIO / SCI / SPI |
| ピン 72 | PE6 — GPIO / SCI / SPI |
| ピン 73 | PE7 — GPIO / SCI / SPI |
| ピン 74 | PF0 — GPIO / PWM ECT |
| ピン 75 | PF1 — GPIO / PWM ECT |
| ピン 76 | PF2 — GPIO / PWM ECT |
| ピン 77 | PF3 — GPIO / PWM ECT |
| ピン 78 | PF4 — GPIO / PWM ECT |
| ピン 79 | PF5 — GPIO / PWM ECT |
| ピン 80 | PF6 — GPIO / PWM ECT |
| ピン 81 | PF7 — GPIO / PWM ECT |
| ピン 82 | PG0 — GPIO / PWM ECT |
| ピン 83 | PG1 — GPIO / PWM ECT |
| ピン 84 | PG2 — GPIO / PWM ECT |
| ピン 85 | PG3 — GPIO / PWM ECT |
| ピン 86 | PG4 — GPIO / PWM ECT |
| ピン 87 | PG5 — GPIO / PWM ECT |
| ピン 88 | PG6 — GPIO / PWM ECT |
| ピン 89 | PG7 — GPIO / PWM ECT |
| ピン 90 | PH0 — GPIO / CAN / SCI |
| ピン 91 | PH1 — GPIO / CAN / SCI |
| ピン 92 | PH2 — GPIO / CAN / SCI |
| ピン 93 | PH3 — GPIO / CAN / SCI |
| ピン 94 | PH4 — GPIO / CAN / SCI |
| ピン 95 | PH5 — GPIO / CAN / SCI |
| ピン 96 | PH6 — GPIO / CAN / SCI |
| ピン 97 | PH7 — GPIO / CAN / SCI |
| ピン 98 | PI0 — GPIO / CAN / SCI |
| ピン 99 | PI1 — GPIO / CAN / SCI |
| ピン 100 | PI2 — GPIO / CAN / SCI |
| ピン 101 | PI3 — GPIO / CAN / SCI |
| ピン 102 | PI4 — GPIO / CAN / SCI |
| ピン 103 | PI5 — GPIO / CAN / SCI |
| ピン 104 | PI6 — GPIO / CAN / SCI |
| ピン 105 | PI7 — GPIO / CAN / SCI |
| ピン 106 | TXCAN0 — CAN0 transmit output |
| ピン 107 | RXCAN0 — CAN0 receive input |
| ピン 108 | TXCAN1 — CAN1 transmit output |
| ピン 109 | RXCAN1 — CAN1 receive input |
| ピン 110 | TXCAN2 — CAN2 transmit output |
| ピン 111 | RXCAN2 — CAN2 receive input |
| ピン 112 | TXD0 — SCI0 transmit output |
| ピン 113 | RXD0 — SCI0 receive input |
| ピン 114 | TXD1 — SCI1 transmit output |
| ピン 115 | RXD1 — SCI1 receive input |
| ピン 116 | MOSI0 — SPI0 master-out slave-in |
| ピン 117 | MISO0 — SPI0 master-in slave-out |
| ピン 118 | SCK0 — SPI0 serial clock |
| ピン 119 | SS0 — SPI0 slave select |
| ピン 120 | SDA — I2C data |
| ピン 121 | SCL — I2C clock |
| ピン 122 | AN0 — ADC analog input 0 |
| ピン 123 | AN1 — ADC analog input 1 |
| ピン 124 | AN2 — ADC analog input 2 |
| ピン 125 | AN3 — ADC analog input 3 |
| ピン 126 | AN4 — ADC analog input 4 |
| ピン 127 | AN5 — ADC analog input 5 |
| ピン 128 | AN6 — ADC analog input 6 |
| ピン 129 | AN7 — ADC analog input 7 |
| ピン 130 | VRH — ADC high reference voltage |
| ピン 131 | VRL — ADC low reference voltage |
| ピン 132 | VDDA — Analog supply |
| ピン 133 | VSSA — Analog ground |
| ピン 134 | TCLK — ECT external clock input |
| ピン 135 | IOC0 — Capture / compare input |
| ピン 136 | IOC1 — Capture / compare input |
| ピン 137 | IOC2 — Capture / compare input |
| ピン 138 | IOC3 — Capture / compare input |
| ピン 139 | IOC4 — Capture / compare input |
| ピン 140 | IOC5 — Capture / compare input |
| ピン 141 | IOC6 — Capture / compare input |
| ピン 142 | IOC7 — Capture / compare input |
| ピン 143 | PLLCLK — PLL clock output / test |
| ピン 144 | NC — Not connected (per package datasheet) |
主な用途
S912XET256W1MAGR の用途: 7 件s: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster Display, CAN-Based Sensor Node, Motor Control Front-End (BLDC/PMSM Drivers), Automotive Lighting Controller (LED Matrix / Adaptive Headlamp), Chassis Gateway / Network Bridge.
Automotive Body Control Module (BCM)
The S912XET256W1MAGR's 256 KB Flash holds the BCM firmware stack including CAN bootloader, diagnostic services, and door/lamp/window control logic without external memory. The 50 MHz S12X core with XGATE co-processor handles CAN message filtering and debounce timing while the main CPU runs multi-channel PWM for lamp-dimming. Operating range -40C to +125C allows placement inside cabin or rear-trunk ECUs. Per NXP reference designs, the 3x MSCAN bridges connect to chassis CAN and powertrain CAN simultaneously.
おすすめ
HVAC Climate Control ECU
The S12X core's 50 MHz headroom with hardware multiply supports PID climate-loop math at 10 ms update rates while running CAN communication for HVAC panel and blower control. Flash capacity (256 KB) fits the lookup-table-based airflow and temperature-target algorithms plus diagnostic service stack. According to NXP application note AN3891, the S12XE family's PWM frequency covers the blower and mode-door motor control range without an external driver MCU.
おすすめ
Automotive Instrument Cluster Display
The 50 MHz S12X core drives CAN messaging (RPM, speed, fuel level) and steers LCD-segment or stepper-motor gauges inside the cluster. 256 KB of Flash accommodates gauge graphics, custom warning logic, and the CAN diagnostic interpreter. The XGATE co-processor pre-processes incoming CAN frames in parallel with main-loop duty cycles, keeping 50 ms display refresh jitter-free per S12XE datasheet benchmarks.
おすすめ
CAN-Based Sensor Node
For distributed sensor nodes (occupant detection, rain-light sensor, tire pressure monitoring satellite), the S912XET256W1MAGR integrates CAN MSCAN plus SPI/I2C interfaces for sensor readout. According to NXP automotive reference designs, the BDM (single-wire background debug mode) simplifies in-vehicle module calibration via the service connector. 256 KB Flash reserves room for CAN bootloaders needed for end-of-line firmware updates.
おすすめ
Motor Control Front-End (BLDC/PMSM Drivers)
The S12X core with hardware multiply/divide and 12-bit ADC pairs with PWM modules to run field-oriented control of small BLDC motors for HVAC blowers or coolant pumps. Per the S12XE family reference manual, 8/16-bit PWM dead-time insertion and center-aligned modes are optimized for motor drive without external logic. The 50 MHz compute budget cycles at 10 us FOC updates while leaving 30 percent CPU time for CAN housekeeping.
おすすめ
Automotive Lighting Controller (LED Matrix / Adaptive Headlamp)
The S12X core's PWMs and timers drive multi-channel LED arrays with dimming and matrix-beam switching at CAN-update rates. 256 KB Flash accommodates the matrix-segment LUT and adaptive-beam state machine. AEC-Q100 qualification and the 144-LQFP package's GPIO count (over 100) let one MCU drive 30+ LED strings without external shift registers, per NXP S12XE application briefs.
おすすめ
Chassis Gateway / Network Bridge
With three MSCAN modules, the S912XET256W1MAGR acts as a CAN-to-CAN gateway bridging powertrain CAN, chassis CAN, and diagnostic CAN. The XGATE co-processor accelerates frame transfer between buses without CPU bottleneck. Per NXP application notes, the S12X core's GPIO count and external bus interface allow additional LIN or FlexRay supplementary channels via companion transceivers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: S912XET256W1MAGR — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | S912XET256W1MAG | S912XEQ512J2MAL | MC9S12XEQ512CAG |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) | NXP Semiconductors (same brand) |
| Package | 144-LQFP (20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | HCS12X 16-bit + XGATE | HCS12X + XGATE (same) | HCS12X + XGATE (same) | HCS12X + XGATE (same) |
| Flash Memory | 256 KB | 256 KB (same) | 512 KB (+100%) | 512 KB (+100%) |
| Max CPU Frequency | 50 MHz | 50 MHz (same) | 50 MHz (same) | 50 MHz (same) |
| Operating Temperature | -40C to +125C (Automotive) | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same | -40C to +125C (Automotive) - same |
| CAN Modules (MSCAN) | Up to 3 | Up to 3 (same) | Up to 3 (same) | Up to 3 (same) |
| Packaging Format | Tape and Reel (R suffix) | Tray (no R suffix) | Tray | Tray |
| Qualification | AEC-Q100 | AEC-Q100 - same | AEC-Q100 - same | AEC-Q100 - same |
主な差別化要因
- R-suffix tape-and-reel packaging （vs S912XET256W1MAG)
- XGATE co-processor for interrupt acceleration （vs MC9S08AC8MFGE)
- 256 KB Flash at 50 MHz with -40/+125C grade （vs MC9S12XHZ256VAG)
設計ノート
The S912XET256W1MAGR requires separate decoupling on VDDR (5V IO supply) and VDD1/VSS1/VDDA/VSSA pairs. Use 100 nF ceramic decoupling caps as close as possible to each power pin, plus a 10 uF bulk capacitor near the IC. The 5V analog supply (VDDA) should be filtered with an additional ferrite bead from VDDR to suppress switching noise from the digital core. Per NXP S12XE hardware guidelines, the PLL requires a clean oscillator supply and decoupling capacitance as shown in the S12XE family reference manual.
Always verify the latest NXP errata sheet for the S12XE family before committing to high-volume designs. Known errata include workarounds for specific MSCAN FIFO and PWM duty cycle behaviors that have been addressed in newer revisions. Note the part marking on the package indicates revision; firmware masks must match the silicon revision per NXP application note AN3891.
Place the 144-LQFP land pattern with at least 4-layer PCB and a continuous ground plane beneath the IC. Route the high-current CAN traces first with matched impedance to the TJA1057 or similar transceiver, keeping them at least 5 mm away from analog signal lines. The oscillator traces (OSC1/OSC2) must be routed short with surrounding ground flood. Per NXP hardware design tips, ensure the BKGD pin is accessible via a header or testpad for in-circuit debug.
Estimated: At 50 MHz CPU frequency, 5V supply, and typical automotive application activity ratio, the 144-LQFP junction temperature rises approximately 15-25 C above ambient under full load, depending on PCB copper area around the part. AEC-Q100 grade 0 silicon is rated to +150C junction. For under-the-hood applications exceeding 85C ambient, ensure thermal relief in the form of PCB thermal vias and copper pours.
コンプライアンス情報
AEC-Q100 automotive qualified per NXP product page. RoHS and lead-free compliant per distributor listings. The 'W' device code designates -40C to +125C automotive grade 0 silicon per NXP S12XE ordering guide.
