DSPIC30F3012-30I/ML - 16-Bit 30MIPs DSC, 24KB Flash | Microchip
部品番号: DSPIC30F3012-30I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $9.5 | $9.50 |
| 10 | $8.85 | $88.50 |
| 100 | $7.95 | $795.00 |
| 500 | $7.2 | $3,600.00 |
| 1,000 | $6.55 | $6,550.00 |
DSPIC30F3012-30I/ML 概要
A Digital Signal Controller is a hybrid device that merges a microcontroller's deterministic peripherals and C-friendly programming model with a DSP's single-cycle MAC engine, dual 40-bit accumulators, and barrel shifter. DSCs sit in the hierarchy between microcontrollers (slow control loops, no MAC) and full DSP processors (high MAC throughput, no general peripherals). The dsPIC30F family is Microchip's entry-level DSC line, optimized for cost-sensitive embedded signal processing such as motor control, power conversion, and sensor conditioning.
The DSPIC30F3012 features 24 KB of Flash program memory organized as 8K x 24 words, 2 KB of RAM (1K x 16), and a 17-bit x 17-bit single-cycle hardware multiplier. On-chip peripherals include a 12-bit 200 Ksps Analog-to-Digital Converter (A/D) with up to 8 input channels, multiple timers, an Input Capture module, an Output Compare/PWM module, a UART, an SPI port, an I2C port, and a Controller Area Network (CAN) module. Self-reprogrammable Flash and robust code protection support field upgrades and IP security.
Architecturally, the device uses a modified Harvard bus with separate program and data paths, enabling simultaneous instruction fetch and data access. The 24-bit instruction word is a key dsPIC30F trait: it provides compact encoding of DSP operations (MAC, ED, EDAC) that a 16-bit MCU cannot express in one cycle. Operating current is typically 70 mA at 5V/30 MHz and falls below 1 uA in Sleep mode.
Typical applications include BLDC and PMSM motor control (sensored and sensorless FOC), uninterruptible power supplies, digital power conversion, automotive sensor interfacing, and industrial control loops. The 30 MIPS headroom comfortably runs FOC algorithms at 10-20 kHz PWM with margin for housekeeping tasks.
When designing with the DSPIC30F3012, ensure the exposed pad (EP) on the QFN-44 package is soldered to a sufficient copper pour to meet the thermal resistance of 29 C/W. Decoupling requires a 0.1 uF ceramic on each VDD/AVDD pair placed within 3 mm of the pin. Use the MPLAB XC-DSC compiler for code development and the MPLAB ICD 3 or REAL ICE for in-circuit debug.
This page consolidates distributor pricing for the DSPIC30F3012-30I/ML, dsPIC30F family drop-in alternatives (including the site-published DSPIC30F3012-20I/P and DSPIC30F3012-20E/ML variants), and practical design notes not assembled in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC30F3012-30I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC30F3012-30I/ML （同一形状・フットプリント） — 相違点: Package, ADC, Operating Temperature, Core Architecture, Timers.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC30F3012-20I/ML
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC30F3012-20E/ML
✅ ドロップイン✓ 在庫あり
$5.42 / 個
データシートを見る →DSPIC30F3011T-30I/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC30F3012-30I/ML 最大定格＆電気的特性
| Core | dsPIC30F 16-bit DSC |
| Instruction Set | 16-bit data, 24-bit instruction (modified Harvard) |
| Maximum CPU Speed | 30 MIPS at 30 MHz |
| Operating Voltage | 2.5 V to 5.5 V |
| Program Flash Memory | 24 KB (8K x 24 words) |
| RAM | 2 KB (1K x 16) |
| EEPROM | 1 KB |
| Hardware Multiplier | 17-bit x 17-bit single-cycle |
| Accumulators | Dual 40-bit |
| ADC | 12-bit, 200 Ksps, up to 8 input channels |
| Timers | 5 x 16-bit |
| Input Capture | 4 channels |
| Output Compare / PWM | 4 channels |
| Communication | 1x UART, 1x SPI, 1x I2C, 1x CAN |
| パッケージ | 44-pin QFN (8x8 mm, ML) with exposed pad |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (Industrial, "I") |
| Thermal Resistance (theta-JA) | 29 C/W (with exposed pad soldered) |
| Typical Operating Current | 70 mA at 5V / 30 MHz |
| Sleep Current | < 1 uA typical |
| RoHS ステータス | Compliant |
| MSLレベル | 3 |
DSPIC30F3012-30I/ML ピン構成
| ピン 1 | SDA/RG3 — I2C data / port G bit 3 |
| ピン 2 | SCL/RG2 — I2C clock / port G bit 2 |
| ピン 3 | MCLR — Master clear reset (active low) |
| ピン 4 | AN0/RA0 — Analog input 0 / port A bit 0 |
| ピン 5 | AN1/RA1 — Analog input 1 / port A bit 1 |
| ピン 6 | AN2/RA2 — Analog input 2 / port A bit 2 |
| ピン 7 | AN3/RA3 — Analog input 3 / port A bit 3 |
| ピン 8 | AVDD — Analog supply voltage |
| ピン 9 | AVSS — Analog ground |
| ピン 10 | AN4/RB0 — Analog input 4 / port B bit 0 |
| ピン 11 | AN5/RB1 — Analog input 5 / port B bit 1 |
| ピン 12 | AN6/RB2 — Analog input 6 / port B bit 2 |
| ピン 13 | AN7/RB3 — Analog input 7 / port B bit 3 |
| ピン 14 | VDD — Digital supply voltage |
| ピン 15 | VSS — Digital ground |
| ピン 16 | OSC1/CLKI/RA4 — Crystal input / external clock / port A bit 4 |
| ピン 17 | OSC2/CLKO/RA5 — Crystal output / clock output / port A bit 5 |
| ピン 18 | IC1/RD8 — Input capture 1 / port D bit 8 |
| ピン 19 | IC2/RD9 — Input capture 2 / port D bit 9 |
| ピン 20 | IC3/RD10 — Input capture 3 / port D bit 10 |
| ピン 21 | IC4/RD11 — Input capture 4 / port D bit 11 |
| ピン 22 | OC1/RD0 — Output compare 1 / port D bit 0 |
| ピン 23 | OC2/RD1 — Output compare 2 / port D bit 1 |
| ピン 24 | OC3/RD2 — Output compare 3 / port D bit 2 |
| ピン 25 | OC4/RD3 — Output compare 4 / port D bit 3 |
| ピン 26 | C1RX/RF0 — CAN1 receive / port F bit 0 |
| ピン 27 | C1TX/RF1 — CAN1 transmit / port F bit 1 |
| ピン 28 | U1RX/RF2 — UART1 receive / port F bit 2 |
| ピン 29 | U1TX/RF3 — UART1 transmit / port F bit 3 |
| ピン 30 | SCK1/RF6 — SPI1 clock / port F bit 6 |
| ピン 31 | SDO1/RF7 — SPI1 data out / port F bit 7 |
| ピン 32 | SDI1/RF8 — SPI1 data in / port F bit 8 |
| ピン 33 | T1CK/RC1 — Timer1 clock / port C bit 1 |
| ピン 34 | T2CK/RC2 — Timer2 clock / port C bit 2 |
| ピン 35 | T3CK/RC3 — Timer3 clock / port C bit 3 |
| ピン 36 | T4CK/RC4 — Timer4 clock / port C bit 4 |
| ピン 37 | INT0/RD4 — External interrupt 0 / port D bit 4 |
| ピン 38 | INT1/RD5 — External interrupt 1 / port D bit 5 |
| ピン 39 | INT2/RE8 — External interrupt 2 / port E bit 8 |
| ピン 40 | FLTA/RE9 — PWM fault input A / port E bit 9 |
| ピン 41 | RE0 — Port E bit 0 |
| ピン 42 | RE1 — Port E bit 1 |
| ピン 43 | RE2 — Port E bit 2 |
| ピン 44 | RE3 — Port E bit 3 |
主な用途
DSPIC30F3012-30I/ML の用途: 6 件s: BLDC / PMSM Motor Control (Sensored FOC), Uninterruptible Power Supply (UPS) and Inverter Control, Automotive Sensor Interface and Body Controllers, Industrial Sensor Conditioning and 4-20 mA Loop Transmitters, Digital Power Conversion (DC-DC and PFC), Audio Processing and Active Noise Cancellation.
BLDC / PMSM Motor Control (Sensored FOC)
The DSPIC30F3012-30I/ML's 30 MIPS C-friendly core runs sensorless or Hall-sensored Field-Oriented Control on BLDC and PMSM motors at PWM frequencies up to 20 kHz, leaving headroom for speed/current PI loops, Clarke/Park transforms, and inverse Park/SVPWM. Its 12-bit 200 Ksps ADC samples two phase currents plus DC-bus voltage within the 50 us PWM period with margin for trigger latency. The 17-bit x 17-bit single-cycle MAC executes a Park transform in roughly 30 cycles, and the dedicated 4-channel Output Compare/PWM module generates complementary 3-phase signals with programmable dead time. Unlike a generic Cortex-M0, the single-cycle MAC keeps the ISR well under the PWM period, avoiding torque ripple.
おすすめ
Uninterruptible Power Supply (UPS) and Inverter Control
In a double-conversion UPS, the DSPIC30F3012-30I/ML executes the digital control loop for the PFC stage and the DC-AC inverter. Its 30 MIPS throughput handles average-current-mode control, RMS voltage computation, and battery state-of-charge monitoring in real time at 16 kHz switching frequency. The 12-bit ADC synchronizes to the PWM trigger for sub-microsecond sample timing, and the on-chip CAN module reports telemetry to a system controller. The 44-QFN package with exposed pad sustains continuous operation at 70 mA typical / 5V with the recommended 1 square-inch copper thermal pour.
おすすめ
Automotive Sensor Interface and Body Controllers
おすすめ
Industrial Sensor Conditioning and 4-20 mA Loop Transmitters
In a 4-20 mA current-loop transmitter, the DSPIC30F3012-30I/ML acquires a bridge or thermocouple signal via its 12-bit ADC, applies digital linearization and cold-junction compensation, then drives a 16-bit PWM output that a precision op-amp converts to loop current. Its DSP MAC accelerates polynomial compensation routines that a 16-bit MCU would handle slowly in software. The 2.5V-5.5V supply works directly from a loop-powered 24V rail after a low-dropout regulator, and the CAN module adds optional HART-style digital diagnostics over the same loop.
おすすめ
Digital Power Conversion (DC-DC and PFC)
The DSPIC30F3012-30I/ML executes average-current-mode control for PFC boost converters and voltage-mode control for synchronous buck regulators. At 30 MIPS it sustains a 50-100 kHz control loop with proportional-integral compensation, input voltage feed-forward, and brown-out protection. The 12-bit ADC samples inductor current and output voltage synchronously with the PWM, and the 4-channel Output Compare/PWM module generates leading-edge-modulated gate drives with programmable dead time. Although it does not include the dsPIC33F family's high-speed PWM and 10-bit DAC, the DSPIC30F3012 remains adequate for sub-100 kHz converters under 1 kW.
おすすめ
Audio Processing and Active Noise Cancellation
Audio applications benefit from the DSPIC30F3012-30I/ML's single-cycle MAC and dual 40-bit accumulators, which implement FIR and IIR filters, biquad stages, and basic ANC algorithms at 48 kHz sample rate. The 24 KB Flash accommodates a 100-tap FIR plus housekeeping, and the 2 KB RAM buffers a stereo 16-bit audio stream. I2S can be implemented via the SPI module with DMA-like double-buffered transfers. The 30 MIPS throughput delivers approximately 600 cycles per sample, sufficient for a small feedforward ANC algorithm on a headphone or hearing-aid prototype.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC30F3012-30I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC30F3012-20I/ML | DSPIC30F3012-20E/ML |
|---|---|---|---|
| Package | 44-pin QFN (8x8 mm, ML) with EP | 44-pin QFN (8x8 mm, ML) with EP - same | 44-pin QFN (8x8 mm, ML) with EP - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same |
| Maximum CPU Speed | 30 MIPS at 30 MHz | 20 MIPS at 20 MHz (-33%) | 20 MIPS at 20 MHz (-33%) |
| Program Flash Memory | 24 KB | 24 KB - same | 24 KB - same |
| RAM | 2 KB | 2 KB - same | 2 KB - same |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +125C (Extended, +40C vs target) |
| Hardware Multiplier | 17-bit x 17-bit single-cycle MAC | 17-bit x 17-bit single-cycle MAC - same | 17-bit x 17-bit single-cycle MAC - same |
| ADC | 12-bit, 200 Ksps, 8 channels | 12-bit, 200 Ksps, 8 channels - same | 12-bit, 200 Ksps, 8 channels - same |
| CAN Module | CAN 2.0B (1 channel) | CAN 2.0B (1 channel) - same | CAN 2.0B (1 channel) - same |
主な差別化要因
- Highest CPU speed in the DSPIC30F3012 QFN-44 family （vs DSPIC30F3012-20I/ML)
- Integrated hardware CAN 2.0B controller （vs DSPIC30F3010-30I/ML)
- Industrial temperature range for cost-sensitive projects （vs DSPIC30F3012-20E/ML)
設計ノート
The 44-pin QFN (ML) package exposes a central thermal pad on the underside that must be soldered to a PCB ground plane for both electrical return and heat dissipation. With theta-JA of 29 C/W (with the EP soldered), the device dissipates approximately 350 mW at typical 5V/30 MHz operation (70 mA) and reaches a 10 C temperature rise above ambient without additional cooling. Estimate: input power 5V x 70 mA = 350 mW; dT = 0.35 W x 29 C/W = 10.15 C. Recommended copper pour: at least 1 square inch (645 mm^2) of 1 oz copper on the top layer, plus thermal vias to an internal ground plane.
Decouple each VDD/AVDD pin with a 0.1 uF X7R ceramic placed within 3 mm of the package pin. Add a bulk 10 uF tantalum or polymer capacitor near the supply pins to support the 70 mA active current transients. Keep the AVDD trace short and isolated from digital switching currents; use a ferrite bead or filter resistor between VDD and AVDD if the digital rail is noisy. The exposed pad must connect to a clean ground pour with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for thermal performance.
Do not confuse the DSPIC30F3012-30I/ML with the DSPIC30F3012-30I/P (40-pin PDIP). The /ML package is a 44-pin QFN, the /P package is a 40-pin PDIP, and the two parts do NOT share a PCB footprint. Also note that the industrial (-40C to +85C) and extended (-40C to +125C) grades differ only in temperature rating - same die, same package. Programming voltage on MCLR is 13V typical for high-voltage ICSP; the on-chip regulator does NOT require an external programming voltage supply during normal run-time operation.
When sampling high-impedance analog sources with the 12-bit ADC, add an external buffer op-amp (such as MCP6001 or MCP6N11) within 10 mm of the analog input pin. The ADC sample-and-hold capacitance (typically 4.5 pF) draws transient current that can introduce settling error if the source impedance exceeds 5 kohm. For 12-bit accuracy (1 LSB at 5V = 1.22 mV), the input settling error must remain below 0.5 LSB, which requires source impedance below approximately 2 kohm at the default 200 Ksps sample rate.
コンプライアンス情報
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; AEC-Q100 variants are available in the same family under separate part numbers. Lead-free matte-tin finish; MSL-3 floor life per JEDEC J-STD-020.
