DSPIC33CK32MC102-E/M6 - 100MHz DSC, 32KB Flash | Microchip
部品番号: DSPIC33CK32MC102-E/M6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0.67 | $0.67 |
| 10 | $0.62 | $6.20 |
| 100 | $0.55 | $55.00 |
| 500 | $0.48 | $240.00 |
| 1,000 | $0.42 | $420.00 |
DSPIC33CK32MC102-E/M6 概要
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control-oriented architecture of a microcontroller. In the power-management hierarchy, the dsPIC33CK family sits within Microchip's 16-bit DSC portfolio (dsPIC30F -> dsPIC33F -> dsPIC33C), targeting real-time control loops such as motor field-oriented control (FOC) and digital power conversion.
Key features include deterministic execution of up to 100 MIPS over the extended temperature range, 3.0 V to 3.6 V single-supply operation, on-chip operational amplifiers that reduce external component count in current-sense circuits, 12-bit high-speed ADCs for phase-current sampling, and complementary PWM generators suited to inverter and converter topologies.
Technically, the dsPIC33CK core uses a modified Harvard architecture with DSP instruction support, while the 28-pin UQFN (4x4x0.6 mm) footprint enables compact power-stage designs. The -E/ extended temperature suffix qualifies the device for -40C to +125C ambient operation (up to +150C with reduced 70 MIPS performance per the datasheet operating conditions).
Typical applications include brushless DC and PMSM motor control, digital power supplies (LLC, totem-pole PFC), advanced sensing and touch interfaces, and automotive-adjacent industrial control nodes where high-speed closed-loop control is required.
Design consideration: ensure the 3.0-3.6 V supply rail is well decoupled, and verify that op-amp and ADC peripheral allocation matches the 28-pin package's limited pin multiplexing before finalizing the schematic.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet alone.
ドロップイン代替品: DSPIC33CK32MC102-E/M6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33CK32MC102-E/M6 （同一形状・フットプリント） — 相違点: Package, ADC Resolution, Architecture, Data SRAM, Operating Temperature.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33CK32MC102-I/M6
✅ ドロップイン✓ 在庫あり
$2.18 / 個
データシートを見る →DSPIC33CK32MC102-H/M6
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33CK64MC102-E/M6
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.02 / 個
データシートを見る →DSPIC33CK32MC103-E/M6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33CK64MC103-E/M6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33CK32MC102-E/M6 最大定格＆電気的特性
| Core | dsPIC33CK 16-bit DSC core |
| Maximum CPU Speed | 100 MIPS (100 MHz) |
| Program Flash | 32 KB |
| Data SRAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| 動作温度 | -40C to +125C (DC to 100 MIPS); -40C to +150C (DC to 70 MIPS) |
| ADC Resolution | 12-bit |
| Integrated Op Amps | Yes |
| PWM | High-resolution complementary PWM |
| Comparators | Yes (on-chip) |
| パッケージ | 28-pin UQFN (4x4 mm) |
| 実装タイプ | Surface Mount |
| Product Family | dsPIC33CK Single-Core DSC |
| Architecture | Modified Harvard, 16-bit with DSP engine |
| Typical Applications | Motor control, advanced sensing, digital power, touch |
DSPIC33CK32MC102-E/M6 28-pin uqfn (4x4 mm) ピン配置ガイド
DSPIC33CK32MC102-E/M6 (28-pin uqfn (4x4 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33CK32MC102-E/M6.
詳細は データシート をご参照ください。
主な用途
DSPIC33CK32MC102-E/M6 の用途: 6 件s: BLDC/PMSM Motor Control (FOC), Digital Power Conversion, Advanced Sensing and Touch Interfaces, Power Tools and Appliances, Automotive-Adjacent Body and Pump Control, Industrial Drives and Robotics Servo Nodes.
BLDC/PMSM Motor Control (FOC)
The DSPIC33CK32MC102-E/M6 is purpose-built for field-oriented control of brushless DC and permanent-magnet synchronous motors: its 100 MHz dsPIC33CK core executes the FOC current and speed loops deterministically at 100 MIPS, while the integrated op amps amplify shunt-resistor phase-current signals feeding the 12-bit high-speed ADC. High-resolution complementary PWM drives the three-phase inverter with fine duty-cycle resolution that reduces current ripple and acoustic noise. In a typical 24-48 V motor drive, the DSC sits on the control board between the gate-driver inputs and the current-sense shunts; the 28-pin UQFN (4x4 mm) footprint keeps the controller compact enough for integration into the motor housing or power board. Using internal op amps removes two to three external amplifier ICs, lowering BOM cost by roughly 5-10% in cost-sensitive appliance and power-tool drives.
おすすめ
Digital Power Conversion
In LLC resonant converters, totem-pole PFC stages, and synchronous buck supplies, the DSPIC33CK32MC102-E/M6 closes high-bandwidth voltage and current loops using its 100 MIPS core and 12-bit ADC. The high-resolution PWM provides the sub-nanosecond duty-cycle and phase-shift granularity these topologies need for ZVS control over line and load transients. The on-chip comparators support fast cycle-by-cycle overcurrent protection independent of the CPU, and the 3.0-3.6 V rail simplifies interfacing with gate drivers and feedback dividers. The -E/ extended temperature rating (-40C to +125C, with 70 MIPS operation to +150C) suits power supplies mounted near heat-generating stages. The compact 28-UQFN (4x4 mm) package allows placement close to the feedback network, minimizing analog trace length and improving noise immunity on the sampled signals.
おすすめ
Advanced Sensing and Touch Interfaces
Microchip positions the dsPIC33CK family for advanced sensing and capacitive touch applications alongside motor control. The DSPIC33CK32MC102-E/M6's 12-bit ADC with high sample rates digitizes sensor outputs such as pressure, temperature, and current, while the integrated op amps condition small differential signals without external amplifiers. The 100 MIPS DSP engine applies filtering (IIR/FIR) and calibration math in real time, which a slower general-purpose MCU would struggle to sustain. On-chip touch peripherals support self- and mutual-capacitance buttons and sliders through the multiplexed I/O available on the 28-pin package. Its 3.0-3.6 V operation matches standard 3.3 V sensor rails, and the 8 KB SRAM buffers sample windows for burst analysis, making the part a compact single-chip front end for smart-sensor nodes and industrial condition-monitoring probes.
おすすめ
Power Tools and Appliances
Cordless power tools, e-bikes, and premium appliances use the DSPIC33CK32MC102-E/M6 as the single-chip motor controller for their brushless drives. At roughly $0.67 per unit as of 2026-09-23, the device brings 100 MIPS FOC capability to cost-sensitive consumer products that previously used sensorless trapezoidal control on 8-bit MCUs, delivering smoother torque, higher efficiency, and longer battery runtime. The integrated op amps and 12-bit ADC sample phase currents at the PWM frequency, enabling sensorless rotor-position estimation from back-EMF observers computed on the DSP engine. The -E/ temperature rating tolerates the +85C to +105C internal temperatures common in sealed tool housings, and the 4x4 mm UQFN fits the space left when replacing larger legacy controllers.
おすすめ
Automotive-Adjacent Body and Pump Control
The DSPIC33CK32MC102-E/M6 fits automotive-adjacent subsystems - fuel pumps, water pumps, HVAC blowers, and cooling-fan controllers - where 12 V brushless motors require efficient closed-loop control and the electronics see wide ambient temperatures. The -E/ grade's -40C to +125C range (70 MIPS up to +150C per the datasheet operating conditions) covers under-hood-adjacent locations, and its 100 MIPS core runs sensorless FOC with speed-ripple suppression that reduces pump acoustic noise. Distributor listings (Lisleapex, Xecor) explicitly position this MPN for automotive applications requiring high-speed processing and advanced motor control. The 28-UQFN (4x4 mm) package supports compact ECU daughter boards, and the 3.0-3.6 V core supply pairs with standard automotive linear regulators feeding the 3.3 V rail.
おすすめ
Industrial Drives and Robotics Servo Nodes
In factory automation, the DSPIC33CK32MC102-E/M6 serves as the local servo or stepper controller in distributed drive nodes, executing position, velocity, and current cascaded loops at 100 MIPS while a host PLC issues commands over serial links multiplexed onto its 28 pins. The 12-bit ADC and internal op amps measure motor phase currents with the bandwidth needed for ripple cancellation, and complementary high-resolution PWM drives external gate drivers for the inverter stage. Deterministic interrupt latency ensures consistent loop timing, which is critical for coordinated multi-axis motion. The -E/ extended temperature rating suits panels near drives and braking resistors, and at about $0.67 unit price (as of 2026-09-23) the DSC keeps per-axis electronics cost low for OEM machine builders standardizing on one controller across product lines.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33CK32MC102-E/M6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33CK32MC102-I/M6 | DSPIC33CK32MC102-H/M6 | DSPIC33CK64MC102-E/M6 | DSPIC33CK64MC103-E/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4) | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max CPU Speed | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) | 64 MHz | 100 MIPS (100 MHz) | 100 MIPS (100 MHz) |
| Program Flash | 32 KB | 32 KB | 32 KB | 64 KB | 64 KB |
| Data SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
主な差別化要因
- Extended temperature range （vs DSPIC33CK32MC102-I/M6)
- Full 100 MIPS speed （vs DSPIC33CK32MC102-H/M6)
- Flash-expandable pin-compatible family （vs DSPIC33CK64MC102-E/M6)
設計ノート
The DSPIC33CK32MC102-E/M6 requires a 3.0 V to 3.6 V supply per the datasheet operating conditions. Place a 100 nF ceramic decoupling capacitor directly at each VDD pin pair plus a 4.7-10 uF bulk capacitor near the package. When powering from a switching 3.3 V rail, verify ripple stays below the datasheet limit at the 100 MHz core's load transients; an LDO after the buck is a low-cost way to clean the rail for ADC accuracy, since 12-bit sampling is sensitive to VDD-induced reference noise.
Estimated: the 28-UQFN (4x4 mm) package has a small thermal footprint; junction temperature must be derated at ambient temperatures above +85C because the -E/ grade permits +125C ambient only at reduced dissipation. Compute Tj = Ta + Pd * theta_JA using the theta_JA value in the Microchip datasheet for your PCB copper area (2 oz / 4-layer boards significantly improve theta_JA versus 1 oz 2-layer). At 100 MIPS the core current is highest, so worst-case firmware should be run during thermal validation.
On the 28-pin package, most pins are multiplexed across PWM, ADC, op-amp, PPS-mapped peripherals, and communication functions - verify the peripheral pin selection table before locking your schematic, because conflicts discovered at layout stage force PCB respins. Also note the two speed/temperature operating regions: 100 MIPS is valid to +125C, but operation to +150C is limited to 70 MIPS per the datasheet operating conditions; firmware clock configuration must match the intended temperature envelope. Use Microchip's family reference manual chapters for op-amp and ADC configuration errata.
For motor-control layouts, keep the analog current-sense path (shunt -> internal op amp input pin -> shortest possible trace) away from PWM switching nodes and gate-driver traces on the 28-UQFN footprint. Use a solid ground plane under the controller and star-connect the analog ground at the VSS pin. Place the 12-bit ADC's reference decoupling per the datasheet's AVDD/ARENA guidance and route the reference as a kelvin connection to the rail regulator to preserve effective ADC resolution.
コンプライアンス情報
RoHS/REACH/lead-free status for this exact MPN was not stated in the provided web data; verify on the Microchip product page. AEC-Q100 qualification is not claimed in the provided data. The dsPIC33CK family is described by Microchip as enabling robust and functional-safety designs in automotive, industrial, consumer, and medical segments.
