DSPIC33CK64MC102-E/M6 - 100MHz 16-bit DSC 64KB Flash | Microchip
MPN: DSPIC33CK64MC102-E/M6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.71 | $371.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $3.02 | $3,020.00 |
DSPIC33CK64MC102-E/M6 Overview
A Digital Signal Controller combines the computational throughput of a DSP with the peripheral integration and deterministic interrupt handling of a microcontroller. In the power-management hierarchy of embedded systems, DSCs sit between general-purpose MCUs and dedicated DSPs, making them the standard choice for closed-loop control systems that need fast math plus rich analog peripherals on one silicon die.
Key differentiating features include three integrated operational amplifiers (op-amps) that can offset and amplify shunt-resistor signals internally, one analog comparator, high-speed 12-bit ADCs capable of sampling up to 3.5 Msps for current-loop control, and high-resolution PWM peripherals with fine edge resolution - the classic peripheral set for digital power conversion and motor control. The Flash ECC and Fault Injection testing features support functional-safety-oriented designs, while Memory Built-in Self-Test (MBIST) protects the SRAM.
Architecturally, the modified Harvard dsPIC33CK core executes DSP instructions (MAC, DSP engine with dual operand fetch) alongside C-friendly addressing modes, and four DMA channels move ADC results to RAM without CPU intervention, keeping loop latency deterministic even at 100 MIPS. The device operates from a 3.0 V to 3.6 V single supply; above +125C the maximum speed derates to 70 MIPS, with operation specified up to +150C.
Typical applications include digital power supplies (totem-pole PFC, LLC converters), brushless DC and PMSM motor control (FOC), battery charging, LED drivers, touch sensing, and advanced sensing nodes.
Design consideration: the E-temperature variant allows full 100 MIPS operation only up to +125C; verify your worst-case junction temperature against the 70 MIPS derating curve above that point before fixing the clock plan.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, optimized for AI-powered component selection.
Drop-in alternatives for DSPIC33CK64MC102-E/M6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK64MC102-E/M6 (same form factor and footprint) — differing in Data SRAM, Operating Temperature, Package, PWM, Program Flash.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK64MC102-I/M6
✅ Drop-In✓ In Stock
$0.42 / Unit
View Datasheet →DSPIC33CK64MC102-H/M6
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK32MC102-E/M6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.42 / Unit
View Datasheet →DSPIC33CK32MC102-I/M6
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.18 / Unit
View Datasheet →DSPIC33CK64MC102-E/M6 Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz (up to 100 MIPS) |
| Program Flash | 64 KB (with ECC and Fault Injection testing) |
| Data SRAM | 8 KB (with MBIST) |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C at DC to 100 MIPS; up to +150C at DC to 70 MIPS |
| Package | 28-pin UQFN (4x4 mm), code /M6 |
| Integrated Op-Amps | 3 |
| Analog Comparators | 1 |
| ADC | 12-bit high-speed ADC(s) |
| PWM | High-resolution PWM peripherals |
| DMA Channels | 4 |
| External Interrupts | 4 |
| Serial I/O Interfaces | 3 |
| Timers | 3 |
| Core Architecture | Modified Harvard, fixed-point DSP, CMOS |
| Mounting Type | Surface Mount |
| Temperature Grade Suffix | E (extended) |
DSPIC33CK64MC102-E/M6 28-pin uqfn (4x4 mm), code /m6 Pin Configuration Guide
Pin configuration for DSPIC33CK64MC102-E/M6 (28-pin uqfn (4x4 mm), code /m6 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK64MC102-E/M6.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK64MC102-E/M6 is suitable for 6 applications: Digital Power Supplies (PFC / LLC), BLDC / PMSM Motor Control (FOC), Battery Charging Systems, Touch Sensing Interfaces, LED Lighting Drivers, Industrial Sensing and Control Nodes.
Digital Power Supplies (PFC / LLC)
The DSPIC33CK64MC102-E/M6 fits digital power conversion because its 100 MHz core closes current loops at 100 MIPS while three integrated op-amps condition shunt signals without external amplifiers, and the 12-bit high-speed ADC samples inductor current with the low latency required by peak or average current-mode control. In a totem-pole PFC or LLC stage, the high-resolution PWM generates fine-edge gate waveforms for the switching FETs, and the on-chip comparator provides cycle-by-cycle overcurrent protection independent of software. Placing the controller between the shunt network and the gate drivers removes analog compensation drift and enables firmware-tunable loop coefficients; the trade-off versus a pure analog controller is firmware development effort, offset by ECC-protected Flash and MBIST-tested SRAM for field reliability. Recommended companions include gate drivers and low-ESR bulk capacitors rated for the switching frequency.
Recommended
BLDC / PMSM Motor Control (FOC)
Field-oriented control demands fast, deterministic math and precise current sampling - exactly the profile of the DSPIC33CK64MC102-E/M6. Its modified-Harvard DSP engine executes Park/Clarke transforms and PI loops at up to 100 MIPS, while the three integrated op-amps amplify the low-voltage outputs of phase-current shunts and route them internally to the 12-bit high-speed ADC, shortening the analog path and cutting BOM cost by eliminating external op-amp packages. The high-resolution PWM drives a three-phase inverter with fine edge placement that reduces current ripple and audible noise, and one on-chip comparator supports hardware overcurrent trip. Operating from a 3.0-3.6 V rail, the E-grade variant sustains -40C to +125C at full speed, covering industrial drive environments. Consider the MP-family devices below when dual simultaneous ADC sampling or more PWM channels are required.
Recommended
Battery Charging Systems
Smart chargers for Li-ion and LiFePO4 cells benefit from the DSPIC33CK64MC102-E/M6's combination of 12-bit ADC accuracy, integrated op-amps for current sensing, and high-resolution PWM controlling a synchronous buck power stage. The 100 MHz core implements CC/CV/trickle state machines plus coulomb counting in firmware, while hardware comparators guard against overcurrent faults in nanoseconds, independent of the CPU. The 4 DMA channels stream ADC results to the 8 KB SRAM for logging without CPU loading, and ECC on the 64 KB Flash protects the charging algorithm from bit corruption over long field deployments. Because charger firmware is safety-relevant, MBIST on SRAM adds another integrity check at boot. The extended temperature grade supports automotive-adjacent and outdoor charger enclosures where -40C cold cranking and +125C ambient pockets occur.
Recommended
Touch Sensing Interfaces
Microchip explicitly positions the dsPIC33CK64MC10X family for touch applications, and the DSPIC33CK64MC102-E/M6 executes capacitive touch acquisition using the 12-bit ADC scanning charge-transfer channels while the 100 MHz core runs the Microchip touch libraries for drift compensation and multi-key decoding. Because the DSP engine handles signal filtering (IIR/FIR) in software, external touch controller ICs can be removed, saving board area on appliance panels, keypads, and human-machine interfaces. The E-grade temperature rating to +125C full speed (70 MIPS to +150C) suits cooktop and industrial panel environments where heat near the touch surface is unavoidable. The 28-pin UQFN (4x4 mm) keeps the sensing MCU close to electrode patterns, shortening traces and improving signal-to-noise; robust 3.0-3.6 V operation tolerates supply sag from nearby power electronics.
Recommended
LED Lighting Drivers
High-current LED drivers need precise current regulation and dimming resolution; the DSPIC33CK64MC102-E/M6 delivers both with its high-resolution PWM (fine edge control enables flicker-free deep dimming) and 12-bit ADC feedback of LED current via the integrated op-amps. The 100 MHz core runs average-current-mode control loops for buck or boost LED stages and implements thermal foldback using on-chip analog sensing channels, protecting fixtures in sealed enclosures. One on-chip comparator provides hardware short-circuit protection for the LED string. The extended temperature range supports enclosed luminaires, horticultural lighting, and automotive-adjacent lighting where ambient temperatures approach +125C. Using a DSC instead of a fixed-function LED driver IC also enables tunable-white and multi-channel color mixing algorithms in firmware without changing hardware.
Recommended
Industrial Sensing and Control Nodes
For advanced sensing nodes - pressure bridges, thermocouple front ends, industrial transmitters - the DSPIC33CK64MC102-E/M6 integrates the analog building blocks that would otherwise occupy separate ICs: three op-amps for signal conditioning, 12-bit high-speed ADCs for digitization, and the DSP engine for linearization, filtering, and FFT-based diagnostics at up to 100 MIPS. The 64 KB ECC-protected Flash stores calibration tables and communication stacks (the 3 serial I/O interfaces support UART/SPI/I2C to PLC networks), while 4 DMA channels move sensor data into the 8 KB MBIST-tested SRAM. MBIST and Fault Injection support Functional-Safety-oriented validation for sensor modules feeding safety systems. The E-grade extends operation to +150C (at 70 MIPS), enabling sensing near motors, engines, and process heaters without local cooling.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK64MC102-E/M6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK64MC102-I/M6 | DSPIC33CK64MC102-H/M6 | DSPIC33CK32MC102-E/M6 |
|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) /M6 | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Program Flash | 64 KB (ECC) | 64 KB (ECC) | 64 KB (ECC) | 32 KB (ECC) |
| Data SRAM | 8 KB (MBIST) | 8 KB (MBIST) | 8 KB (MBIST) | 8 KB (MBIST) |
| Integrated Op-Amps | 3 | 3 | 3 | 3 |
| DMA Channels | 4 | 4 | 4 | 4 |
Key Differentiators
- Extended temperature grade with 70 MIPS operation to +150C (vs DSPIC33CK64MC102-I/M6)
- Three integrated op-amps cut external BOM (vs Generic non-op-amp MCUs (e.g., PIC16LF1518))
- Full 64 KB ECC Flash in the same footprint as 32 KB siblings (vs DSPIC33CK32MC102-E/M6)
Design Notes
Power the DSPIC33CK64MC102-E/M6 from a clean 3.0-3.6 V rail; the ADC reference and integrated op-amp output swing are bounded by VDD. Decouple each VDD pin with a 100 nF ceramic placed within 2 mm of the pin, plus 4.7-10 uF bulk near the package. In motor-control boards where the MCU shares a supply with gate drivers, add an RC filter or dedicated LDO for the 3.3 V rail - dV/dt-coupled spikes on VDD are a leading cause of ADC misreads and spurious comparator trips in 100 MIPS control loops.
Estimated: the E-grade part sustains 100 MIPS only to +125C junction; above that the datasheet derates to 70 MIPS up to +150C. For a target Tj of +125C in a +85C ambient enclosure, allowable self-heating is 40C; with the small UQFN-28 (4x4 mm) theta_JA typically on the order of 50-70 C/W on a minimal 2-layer board, budget less than roughly 0.6-0.8 W and pour a solid ground plane under the exposed pad. Measure Tj via the internal die-temperature channel rather than assuming ambient.
The /M6 UQFN (4x4 mm) uses 0.5 mm pitch pads and a center exposed pad that must be soldered to ground for both thermal and signal-integrity reasons; specify an NSMD pad pattern and enough stencil aperture on the thermal pad to avoid voids. Expose the ICSP/ICD pins (MCLR, PGD, PGC, VDD, GND) on a 5-pin tagged header - in-circuit debugging the 4x4 mm UQFN directly is impractical. Keep shunt traces to the op-amp inputs Kelvin-routed and differential to exploit the integrated amplifiers fully.
Do not assume the -E and -I variants are identical firmware images: clock and analog calibration values differ per grade and are factory-set, so always rebuild with the correct device header. Verify that your worst-case operating point stays at or below +125C if you rely on 100 MIPS; code that schedules ADC sampling from the instruction clock will change timing when the derated 70 MIPS region is entered. Finally, the M6 package pinout differs from SPDIP (/SP) and SOIC (/SO) family members - never port a layout between them without a full pinout check.
Compliance Information
RoHS compliance per standard Microchip/distributor classification for the dsPIC33CK family; obtain formal REACH and conflict-minerals declarations from Microchip's compliance portal.
