DSPIC33EP16GS502-I/MX - 16-Bit 70 MIPS Digital Power DSC | Microchip
部品番号: DSPIC33EP16GS502-I/MX ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.98 | $3.98 |
| 10 | $3.62 | $36.20 |
| 100 | $3.25 | $325.00 |
| 500 | $2.96 | $1,480.00 |
| 1,000 | $2.68 | $2,680.00 |
DSPIC33EP16GS502-I/MX 概要
A digital signal controller is a hybrid device that combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33EP GS family sits at the heart of switch-mode power supply (SMPS) control loops, replacing analog controllers with firmware-defined, digitally compensated power conversion.
Key features include the 70 MIPS dsPIC33E core, 16KB self-programming flash, and Functional Safety (FuSa) capability. Connectivity spans I2C, SPI, UART/USART, IrDA and LINbus, enabling communication with system supervisors, hosts and battery-management front ends. The interconnected high-speed PWM peripheral targets frequencies and resolutions required by digital power converters.
Technically, the GS50x family couples the ADC and PGA directly to the PWM through dedicated interconnects, so current- and voltage-loop samples can trigger PWM updates with minimal CPU latency - a critical property for peak-current-mode and multiphase topologies where loop delay erodes phase margin.
Typical applications include AC-DC and DC-DC power supplies, interleaved power factor correction (PFC), LED drivers, and battery chargers. Microchip reference designs, such as the interleaved PFC evaluation for SMPS dsPIC controllers, demonstrate these use cases directly.
Design consideration: budget 2KB of RAM carefully - digital compensators and communication buffers compete for it, so use fixed-point 1.15 DSP math and avoid large buffering schemes.
This page synthesizes verified distributor data, family datasheet context, drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet. Pricing shown is as of 2026-09-24.
ドロップイン代替品: DSPIC33EP16GS502-I/MX — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP16GS502-I/MX （同一形状・フットプリント） — 相違点: Package, Communication Interfaces, Core Architecture, Operating Temperature, Core.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP16GS502-I/MM
✅ ドロップイン✓ 在庫あり
$2.45 / 個
データシートを見る →DSPIC33EP32GS502-I/MX
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS502-I/MX
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP16GS202-I/M6
✅ ドロップイン✓ 在庫あり
$2.1 / 個
データシートを見る →DSPIC33EP32GS202-I/M6
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.18 / 個
データシートを見る →DSPIC33EP16GS502-I/MX 最大定格＆電気的特性
| Core | dsPIC33E 16-bit |
| Core Speed | 70 MIPS |
| Program Memory (Flash) | 16KB (16K x 8) |
| RAM | 2KB |
| Product Family | dsPIC33EP GS50x Digital Power (SMPS, High Speed ADC, DAC) |
| Communication Interfaces | I2C, SPI, UART/USART, IrDA, LINbus |
| Analog Peripherals | High-speed ADC, PGA, comparators, DAC |
| Digital Power Peripherals | Interconnected high-speed PWM |
| Functional Safety | FuSa capable |
| パッケージ | 28-UQFN (6x6 mm) |
| 実装タイプ | Surface Mount |
| Temperature Grade | I (industrial) |
| Debug/Programming | ICSP via PGECx/PGEDx pairs; MPLAB SNAP supported |
| ライフサイクル状態 | In Production |
DSPIC33EP16GS502-I/MX 28-uqfn (6x6 mm) ピン配置ガイド
DSPIC33EP16GS502-I/MX (28-uqfn (6x6 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP16GS502-I/MX.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP16GS502-I/MX の用途: 6 件s: Digital Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), Digital LED Drivers, Battery Chargers and BMS Front Ends, Industrial Motor Control and Power Monitoring, Embedded Control with Communications.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33EP16GS502 was architected specifically for digital power conversion: its interconnected high-speed PWM, high-speed ADC and PGA form a short, deterministic feedback path from current-sense sample to PWM duty update, minimizing loop delay that would otherwise erode phase margin in voltage- and current-mode converters. In a 300 kHz synchronous buck, the high-speed PWM provides the duty resolution needed for tight output regulation while the DSC core executes fixed-point PID compensators at 70 MIPS. Firmware-defined control also enables soft-start profiles, adaptive dead-time, and mode switching (CCM/DCM) without analog redesign. This is the flagship use case named on Microchip's product page for the GS50x family.
おすすめ
Interleaved Power Factor Correction (PFC)
Microchip provides a dedicated reference design for interleaved PFC built on SMPS dsPIC digital signal controllers of this family, validating the GS502 for this topology. Interleaved PFC requires two or more PWM channels operating with precise phase offsets - the interconnected high-speed PWM generates phase-shifted rails directly in hardware. The high-speed ADC samples input current and bus voltage each switching cycle, and the 70 MIPS core runs the current-shaping loop so line current tracks voltage for high power factor. Firmware implementation also simplifies handling of brownout, burst mode and inrush limiting versus discrete analog controllers, all within the 16KB flash budget.
おすすめ
Digital LED Drivers
High-power LED lighting demands precise current regulation with dimming control and protection, which the GS502 delivers using its interconnected PWM and fast comparator subsystem. The high-speed PWM drives buck or boost LED stages at fixed frequency while the ADC monitors LED current through the PGA's selectable gain, allowing a single sense resistor range to cover multiple LED string configurations. Comparators provide cycle-by-cycle overcurrent protection in hardware, reacting within the same switching period without CPU intervention. The 16-bit core at 70 MIPS simultaneously implements dimming curves (PWM, analog, or hybrid) and communicates with lighting controllers over I2C or UART.
おすすめ
Battery Chargers and BMS Front Ends
Battery charging profiles (CC/CV/trickle, termination detection, thermal foldback) map naturally onto the GS502's mixed signal peripherals. The high-speed ADC with PGA reads pack current and cell voltage with gain matched to the sense network, comparators flag fault thresholds in hardware, and the high-speed PWM controls the charging power stage with frequency and duty under firmware control. LINbus and UART connectivity suit automotive-adjacent charger nodes, while I2C interfaces to fuel gauges and security ICs. The 2KB RAM accommodates charge-state machines and safety logs, and the FuSa capability supports chargers where functional safety arguments are required.
おすすめ
Industrial Motor Control and Power Monitoring
Beyond pure power conversion, the 70 MIPS dsPIC33E core with DSP multiply-accumulate instructions executes FOC-oriented math and RMS/power calculations for monitoring nodes on industrial equipment. The high-speed PWM drives low-power motor stages, fans or actuators, while ADC channels sample shunt or hall signals through the PGA. UART, I2C and SPI allow integration into factory fieldbus gateways, and IrDA/LIN support suits wired service interfaces. The industrial temperature grade (-I suffix) targets factory-floor environments. For designs that later need more code space for protocol stacks, the pin-compatible GS502 flash-upgraded siblings make migration a reflow-free, firmware-only change.
おすすめ
Embedded Control with Communications
With I2C, SPI, UART/USART, IrDA and LINbus on board, the GS502 also serves as a compact embedded controller where conversion and communication coexist: solar charge controllers reporting over UART, digital dimmers on I2C buses, or LIN-connected actuators. The 16KB flash holds both a small RTOS-free control loop and a communication handler, and 2KB RAM buffers packet traffic. In-circuit programming via any matched PGECx/PGEDx pair (used together) enables field firmware updates without removing the board, per Microchip developer documentation. SEGGER tooling support adds an alternative debugging ecosystem for teams already standardized on J-Link-class equipment.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP16GS502-I/MX — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP16GS502-I/MM | DSPIC33EP32GS502-I/MX | DSPIC33EP64GS502-I/MX | DSPIC33EP16GS202-I/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6) | 28-QFN-S (6x6) - same 6x6 footprint, package code differs | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 16KB | 16KB | 32KB | 64KB | 16KB |
| High-Speed Analog Subsystem (ADC/PGA) | GS50x high-speed ADC + PGA + comparators | Same (GS50x) | Same (GS50x) | Same (GS50x) | GS202 reduced analog performance |
| Communication Interfaces | I2C, SPI, UART/USART, IrDA, LINbus | Same | Same | Same | Same |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | In Production (Active) | Active | Active | Active | Active |
主な差別化要因
- Flagship GS50x analog subsystem for digital power （vs DSPIC33EP16GS202-I/M6)
- Lowest-cost entry to the GS50x digital power family （vs DSPIC33EP32GS502-I/MX)
- UQFN package sourcing option （vs DSPIC33EP16GS502-I/MM)
設計ノート
The MX order code denotes the 28-pin UQFN (6x6 mm) package; the MM order code denotes the 28-QFN-S (6x6). Before qualifying the MM as a second source, verify the exposed-pad and land-pattern dimensions in the dsPIC33EPXXGS50X family datasheet (Microchip 70005127d.pdf) against your footprint, as UQFN and QFN-S pad geometries can differ slightly. Place the high-frequency decoupling capacitor within 2-3 mm of each VDD pin and route the analog ground for the high-speed ADC/PGA separately from the power-switching ground, tying them at a single star point.
Programming pitfall: the dsPIC33EP16GS502 provides multiple PGECx/PGEDx clock/data pairs for ICSP, and per Microchip developer documentation any pair may be used but must be used together - pairing PGEC2 with PGED1 fails silently during programming. Bring one full PGEC/PGED pair plus MCLR to a programming header on every production PCB. Also budget the 2KB RAM conservatively: digital compensator state, PWM task queues and UART/I2C buffers all draw from the same pool; overflow typically manifests as stack corruption rather than a clean build error.
In digital power layouts, the path from current-shunt to the high-speed ADC input should be kept short and routed as a kelvin connection directly to the sense resistor to preserve sample accuracy; the PGA gain setting should be chosen so expected current spans a large fraction of ADC range for best signal-to-noise. Route PWM outputs away from ADC inputs and use the hardware comparator interconnect (rather than CPU polling) for cycle-by-cycle overcurrent protection so fault response is independent of firmware latency. Estimated: keeping ADC traces under 20 mm on a 4-layer board materially reduces switching-noise pickup.
コンプライアンス情報
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