DSPIC33EP16GS202-I/M6 - 70 MIPS Digital Power DSC | Microchip
MPN: DSPIC33EP16GS202-I/M6 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.48 | $3.48 |
| 10 | $3.13 | $31.30 |
| 100 | $2.79 | $279.00 |
| 500 | $2.44 | $1,220.00 |
| 1,000 | $2.1 | $2,100.00 |
DSPIC33EP16GS202-I/M6 Overview
A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and deterministic interrupt handling of a microcontroller. In the power-management hierarchy, the dsPIC33EP16GS202 sits in Microchip's digital-power-optimized dsPIC33EP GS family: MCU/DSC -> digital signal controller -> power conversion controller -> embedded control semiconductor. This makes it a purpose-built replacement for analog loop controllers in switched-mode power conversion.
Key features include an interconnected high-speed PWM module purpose-built for power-supply topologies, a high-speed 12-bit ADC with sample rates suited to current-loop control, on-chip comparators, a programmable gain amplifier (PGA), and on-chip DAC references. Connectivity covers I2C, SPI, and UART, with 21 general-purpose I/O. The device operates from a 3.0V to 3.6V single supply and is rated from -40C to +85C.
Architecturally, the 16-bit Harvard core with DSP instruction extensions executes MAC and other multiply-accumulate operations in a single cycle, enabling execution of Proportional-Integral-Derivative (PID) compensation loops at switching frequencies in the hundreds of kilohertz. The interconnected PWM supports phase-shifted, complementary, and current-mode topologies with fast analog comparators wired directly to PWM fault inputs for cycle-by-cycle current limiting.
Typical applications include switch-mode power supplies (SMPS), interleaved power factor correction (PFC), digital LED drivers, and solar/battery charger power stages. Per Microchip's product page, the part is In Production and targeted at Digital Power SMPS with High Speed ADC and DAC support.
Design consideration: use any matched PGECx/PGEDx pair for ICSP programming; for example, if PGEC2 is used for ICSPCLK, ICSPDAT must use PGED2.
This page synthesizes distributor listings, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP16GS202-I/M6 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC33EP32GS202-I/M6
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP16GS202-I/MM
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33EP16GS502-I/M6
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP16GS202T-I/M6
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33EP16GS202-I/M6 Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC Harvard |
| Max CPU Speed | 70 MIPS (140 MHz internal) |
| Flash Program Memory | 16 KB (16K x 8) |
| Operating Voltage | 3.0 V to 3.6 V |
| Supply Voltage (nominal) | 3.3 V |
| Package | 28-UQFN (4x4 mm) with Exposed Pad |
| I/O Count | 21 |
| Communication Interfaces | I2C, SPI, UART |
| Specialized Peripherals | High-speed PWM, High-speed ADC, DAC, PGA, Comparators |
| Target Application | Digital Power / SMPS |
| Operating Temperature | -40C to +85C |
| Mounting Type | Surface Mount |
| Programming Interface | ICSP (PGECx/PGEDx pairs) |
| Functionality Classification | Digital Signal Controller (DSC) with Functional Safety (FuSa) support class |
| Lifecycle Status | In Production |
| RoHS Status | Compliant |
DSPIC33EP16GS202-I/M6 28-uqfn (4x4 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP16GS202-I/M6 (28-uqfn (4x4 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP16GS202-I/M6.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP16GS202-I/M6 is suitable for 6 applications: Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), Digital LED Drivers, Battery Chargers and Solar Power Conversion, Embedded Industrial Control and Sensing, Motor and Actuator Control (Compact Drives).
Switch-Mode Power Supplies (SMPS)
The DSPIC33EP16GS202-I/M6 is purpose-built for digitally controlled SMPS: its interconnected high-speed PWM module, high-speed ADC, DAC, PGA, and comparators close current- and voltage-loop compensation entirely in firmware. The 70 MIPS core with single-cycle MAC executes PID loops at switching frequencies in the hundreds of kilohertz, while direct comparator-to-PWM connections deliver cycle-by-cycle cycle current limiting without CPU intervention. On-chip DAC references set programmable trip thresholds, and the PGA amplifies shunt-current signals ahead of the high-speed ADC, reducing external component count. Microchip lists Digital Power SMPS with High Speed ADC and DAC as the device's headline application domain, and the part is In Production for this market. Design trade-off: firmware-based control adds software validation effort compared with fixed analog controllers, but enables programmable soft-start, mode switching, and telemetry in the same silicon.
Recommended
Interleaved Power Factor Correction (PFC)
Microchip provides a dedicated interleaved PFC reference design for SMPS dsPIC DSCs, and the GS202 fits this topology directly. Interleaved PFC requires precisely phase-shifted PWM channels, fast average- or peak-current sensing, and a front-end control loop tracking a rectified sinusoid at twice line frequency - capabilities delivered by the interconnected high-speed PWM's phase-shift registers, the high-speed ADC with programmable sampling instants, and the 70 MIPS DSP core running loop compensation. The on-chip comparators provide hardware over-current protection per switching cycle, an essential safety layer in PFC stages that handle line-level energy. The 3.0V to 3.6V supply and 21 I/O support gate-drive interface and housekeeping signals in a compact 4x4 mm footprint. Trade-off: high-voltage sensing still requires external conditioning, as the ADC input range is bounded by the 3.6V rail.
Recommended
Digital LED Drivers
High-brightness LED illumination demands constant-current regulation with fast transient response, dimming, and protection - all natively handled by the DSPIC33EP16GS202-I/M6. Its high-speed PWM generates precise buck/boost gate drive, the high-speed ADC samples shunt current each cycle, and the on-chip DAC plus comparators implement hardware current limiting ahead of firmware response. The 70 MIPS core supports firmware dimming algorithms (PWM, CCR, or hybrid) plus communication-based dimming via UART, I2C, or SPI for networked lighting. The 4x4 mm UQFN exposed-pad package fits compact LED-driver boards with good thermal spreading through the exposed pad. Trade-off versus dedicated LED-driver ICs: the DSC adds cost, but consolidates power control, dimming logic, and digital communication in one programmable device, cutting BOM diversity for multi-topology lighting platforms.
Recommended
Battery Chargers and Solar Power Conversion
Solar charge controllers and multi-chemistry battery chargers need multi-stage charging profiles, MPPT algorithms, and layered safety protection - a workload that suits the GS202's mixed DSP/peripheral architecture. The 70 MIPS core executes MPPT search algorithms and coulomb-counting math with DSP efficiency, while the interconnected PWM, ADC, comparators, and PGA handle the high-frequency power conversion stage and hardware-level over-current/over-voltage trips. Multiple UART/SPI/I2C ports support host communication, display interfaces, and telemetry logging. The -40C to +85C industrial rating covers outdoor and vehicle-mounted installations. Trade-off: solar-side sensing beyond the 3.6V ADC range requires external dividers and isolation, adding design effort versus integrated solar SoCs, but the programmable architecture supports many battery chemistries and panel configurations on a single hardware platform.
Recommended
Embedded Industrial Control and Sensing
Beyond power conversion, the GS202's 21 I/O, I2C/SPI/UART interfaces, and DSP-grade math make it a compact industrial controller for sensor conditioning and actuator control. The PGA plus high-speed ADC digitize small differential signals directly - e.g., load cells or shunts - while single-cycle MAC instructions run filtering and FFT-based diagnostics in firmware. The deterministic 16-bit Harvard architecture provides predictable interrupt latency for time-critical control tasks, and ICSP supports field updates of the 16 KB Flash through any matched PGECx/PGEDx pair. The -40C to +85C rating and small 4x4 mm UQFN suit dense industrial boards and distributed I/O nodes. Trade-off: 16 KB Flash constrains complex protocol stacks; if larger firmware footprints are needed, migrate to the pin-compatible DSPIC33EP32GS202-I/M6 without PCB changes.
Recommended
Motor and Actuator Control (Compact Drives)
Small brushless DC, stepper, and DC motor drives benefit from the GS202's combination of complementary high-speed PWM outputs, fast current-loop ADC sampling, and hardware comparators for cycle-by-cycle over-current protection. The 70 MIPS core runs field-oriented-control (FOC) or sensorless observer math with DSP efficiency, enabling compact single-chip drives for fans, pumps, and small robotics. The 3.0V to 3.6V logic domain interfaces cleanly with gate-driver ICs, and the 21 I/O provide Hall/encoder inputs plus UART-based host control. Trade-off: for full three-phase FOC with richer peripherals and memory headroom, Microchip's dsPIC33EP MC-family parts (e.g., DSPIC33EP128MC202 with 128 KB Flash) are more typical; the GS202 is best where drive complexity is moderate and digital-power peripherals are already on the BOM design.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP16GS202-I/M6 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32GS202-I/M6 | DSPIC33EP16GS202-I/MM | DSPIC33EP16GS502-I/M6 | DSPIC33EP16GS202T-I/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) EP | 28-UQFN (4x4 mm) EP - same | 28-QFN variant - same die | 28-UQFN (4x4 mm) EP - same | 28-UQFN (4x4 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 16 KB | 32 KB | 16 KB | 32 KB (GS502 family) | 16 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Digital-Power Peripherals (PWM/ADC/DAC/PGA) | Yes - interconnected high-speed PWM, high-speed ADC, DAC, PGA | Yes - identical peripheral set | Yes - identical peripheral set | Yes - identical peripheral set | Yes - identical peripheral set |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Format | Tube | Tube | Tube | Tube | Tape & Reel |
Key Differentiators
- Interconnected digital-power analog subsystem (vs DSPIC33EP128MC202T-E/MM)
- Firmware headroom upgrade without PCB rework (vs DSPIC33EP32GS202-I/M6)
- Highest integration density in a 4x4 mm footprint (vs DSPIC33EP16GS202-I/MM)
Design Notes
ICSP pairing is the most frequent bring-up failure on this family: the GS202 provides more than one PGECx/PGEDx pair, and the clock/data pins must be used as a matched pair - if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2 (per Microchip Flash Programming Specification 70005192b). Do not mix pairs across the debug connector, and keep series resistors on PGD/PGC lines to isolate target circuitry during programming.
The device operates only from a 3.0V to 3.6V supply. Place a 0.1 uF ceramic decoupling capacitor at each VDD pin as close as possible to the package, plus a bulk 4.7-10 uF capacitor near the rail entry. Digital-power layouts should separate the gate-drive return path from the analog ADC reference ground, tying them at a single star point; the exposed pad of the 28-UQFN (4x4 mm) must be soldered to a grounded copper pour for both thermal dissipation and grounding integrity.
Route high-speed PWM outputs away from the PGA/ADC input traces; comparator-to-PWM current-limit paths are nanosecond-sensitive, so keep shunt-sense traces short, differential, and Kelvin-connected to the shunt resistor. The 4x4 mm UQFN 0.5 mm-pitch land pattern requires solder-mask-defined or NSMD pads per the Microchip datasheet footprint - verify land-pattern coordinates against the latest datasheet revision, especially if migrating between /M6 and /MM package variants.
16 KB Flash is small by modern MCU standards. Budget program memory before committing to the GS202: protocol stacks, LCD libraries, and float math can consume it quickly. If firmware exceeds budget, the pin-compatible DSPIC33EP32GS202-I/M6 (32 KB Flash) upgrades capacity without PCB changes - plan the footprint for the larger part even if populating the 16 KB version initially.
Compliance Information
RoHS compliant per JLCPCB listing. Lifecycle status In Production per Microchip official product page. Full REACH/halogen declarations available from Microchip product page documentation.
