DSPIC33EP32GS202-I/M6 - 16-bit 70 MIPS DSC 32KB Flash | Microchip
部品番号: DSPIC33EP32GS202-I/M6 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.08 | $30.80 |
| 100 | $2.74 | $274.00 |
| 500 | $2.46 | $1,230.00 |
| 1,000 | $2.18 | $2,180.00 |
DSPIC33EP32GS202-I/M6 概要
A digital signal controller combines the computational throughput of a 16-bit MCU with the DSP engine of a digital signal processor. Within the power-management hierarchy, the dsPIC33EP GS series sits between general-purpose microcontrollers and dedicated digital power ASICs, providing closed-loop control of switch-mode power supplies (SMPS), power factor correction (PFC), and motor drives on a single programmable chip.
Key features include the high-performance 16-bit dsPIC33EP core running at 70 MIPS (140 MHz instruction clock), 32 KB (32K x 8) self-programming Flash with ECC, on-chip high-speed PWM peripherals tailored for digital power conversion, advanced analog integration including high-speed ADC and DAC resources, and communication interfaces I2C, SPI, and UART. Up to 21 general-purpose I/O lines are available, and multiple PGECx/PGEDx pin pairs support In-Circuit Serial Programming (ICSP) and in-circuit debugging via MPLAB tools such as MPLAB SNAP.
Architecturally, the dsPIC33EP core integrates DSP multiply-accumulate instructions, a barrel shifter, and dual operand fetch, enabling tight control loops such as voltage-mode and current-mode compensation at switching frequencies of hundreds of kHz. The GS-series-specific analog subsystem - including comparator, op-amp, and high-speed ADC blocks - was designed expressly for digital SMPS, distinguishing it from the GP and MC variants of the same die family.
Typical applications include digital power supplies and SMPS controllers, interleaved power factor correction stages (as demonstrated by Microchip's Interleaved PFC reference design), LED drivers, and battery charging systems. The 4x4 mm UQFN footprint suits compact power-conversion boards where board area is at a premium.
Design consideration: all VDD/VSS pairs and the exposed pad must be properly decoupled and grounded, and PGECx/PGEDx pairs must be routed as matched pairs for reliable ICSP programming and debugging.
This page synthesizes distributor pricing context, same-family drop-in alternatives, and practical design notes not found together on the manufacturer datasheet alone.
ドロップイン代替品: DSPIC33EP32GS202-I/M6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP32GS202-I/M6 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Core Architecture, Product Family, Program Memory (Flash).
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP16GS202-I/M6
✅ ドロップイン✓ 在庫あり
$2.1 / 個
データシートを見る →DSPIC33EP32GS202-E/M6
✅ ドロップイン✓ 在庫あり
$3.05 / 個
データシートを見る →DSPIC33EP32GP202-I/M6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32MC202-I/M6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP64GS202-I/M6
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32GS202-I/M6 最大定格＆電気的特性
| Core | dsPIC33EP 16-bit DSC core |
| Performance | 70 MIPS (140 MHz instruction clock) |
| Flash Memory | 32 KB (32K x 8) |
| SRAM | 2 KB |
| 電源電圧 | 3.3 V |
| 動作温度 | -40C to +85C |
| パッケージ | 28-UQFN (4x4 mm) exposed pad |
| ピン数 | 28 |
| I/O Count | 21 |
| Communication Interfaces | I2C, SPI, UART |
| Peripheral Set | High-speed PWM, high-speed ADC, DAC (digital power peripherals) |
| Debug/Programming | ICSP via PGECx/PGEDx pairs, MPLAB SNAP compatible |
| Application Focus | Digital power / SMPS |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
DSPIC33EP32GS202-I/M6 28-uqfn (4x4 mm) exposed pad ピン配置ガイド
DSPIC33EP32GS202-I/M6 (28-uqfn (4x4 mm) exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP32GS202-I/M6.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP32GS202-I/M6 の用途: 6 件s: Digital Switch-Mode Power Supply (SMPS), Interleaved Power Factor Correction (PFC), Digital LED Driver and Lighting Power, Battery Charging Systems, Embedded Control and General DSP Processing, Industrial Automation and Monitoring Nodes.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33EP32GS202-I/M6 closes digital feedback loops in buck, boost, flyback, and half-bridge converters. Its 70 MIPS dsPIC33EP core executes PID and 2P2Z compensator firmware within single switching cycles, while the high-speed PWM module generates complementary outputs with programmable dead time for synchronous rectification. The high-speed ADC samples current and voltage per PWM cycle, enabling peak or average current-mode control without analog error amplifiers. Placing control in firmware allows output-set programmability, soft-start shaping, and adaptive dead-time optimization across load ranges. Because the die integrates the digital-power analog complex, external loop components shrink to sensing dividers and filters, cutting BOM count versus fully analog controllers.
おすすめ
Interleaved Power Factor Correction (PFC)
Microchip's Interleaved PFC reference design demonstrates the dsPIC33EP GS family controlling multiple parallel boost stages with phase-shifted PWM channels - a topology this controller was explicitly designed for. The 70 MIPS core interleaves two current-loop computations per switching period, and the high-speed ADC's simultaneous sampling keeps phase-current sharing balanced across legs. Firmware-based control adapts duty and phase offset to load, achieving high power factor and low THD across universal AC input conditions. Using the 28-UQFN (4x4 mm) M6 package keeps the controller footprint minimal on dense AC-DC boards, while 32 KB Flash leaves headroom for power-metering and protection firmware alongside the core PFC loops.
おすすめ
Digital LED Driver and Lighting Power
Constant-current LED drivers benefit from the DSPIC33EP32GS202-I/M6's per-cycle current regulation and firmware-controlled dimming. The high-speed PWM generates the converter switching waveform while a second PWM channel produces dimming strobes, all phase-locked on one die. The 70 MIPS core runs average-current-mode loops for tight LED current accuracy, and firmware scheduling implements PWM dimming ratios that analog dimming cannot match at low brightness. The 3.3 V, 28-UQFN (4x4 mm) package suits compact retrofit lamp and luminaire driver boards, and the -40C to +85C industrial grade covers enclosed fixtures. 32 KB Flash holds DALI or DMX-style communication stacks on top of the control loop.
おすすめ
Battery Charging Systems
Multi-chemistry battery chargers use the DSPIC33EP32GS202-I/M6 to run CC/CV charge profiles, termination detection, and protection entirely in firmware. The high-speed ADC monitors battery voltage, current, and die/board temperature on a per-cycle basis; the 70 MIPS core executes the state machine and safety checks between PWM updates. Charge parameters adapt in software to chemistry and cell count without hardware changes, and the digital loop enforces precise current taper during CV phase. The 28-UQFN (4x4 mm) exposed-pad package provides thermal spreading on the charger PCB. I2C and UART interfaces report charge status to system hosts or fuel-gauge ICs over standard buses.
おすすめ
Embedded Control and General DSP Processing
Beyond power conversion, the DSPIC33EP32GS202-I/M6 serves as a compact 16-bit embedded controller where DSP instructions matter: digital filtering, sensor signal processing, and spectrum analysis. The dsPIC33EP core's hardware MAC and dual-fetch architecture execute FIR/IIR filters far faster than software-only 16-bit MCUs, while I2C, SPI, and UART interfaces connect to sensors, displays, and hosts. Up to 21 GPIO lines handle mixed digital I/O, and multiple PGECx/PGEDx pairs enable in-field firmware updates via ICSP with MPLAB SNAP. At 3.3 V and -40C to +85C, it fits industrial monitoring nodes; 32 KB Flash with ECC supports code integrity in noise-prone environments.
おすすめ
Industrial Automation and Monitoring Nodes
In factory automation, the DSPIC33EP32GS202-I/M6 acts as a local control and conversion node: driving actuator power stages, conditioning analog sensor channels through its ADC/DAC complex, and communicating over UART or I2C to PLC backbones. The 70 MIPS throughput keeps deterministic control-loop deadlines even while servicing communications, and the industrial -40C to +85C grade tolerates cabinet and rooftop temperatures. The 28-UQFN (4x4 mm) package supports dense I/O daughter cards. Firmware-based control lets one PCB serve multiple actuator types by reflashing the 32 KB Flash, reducing SKU proliferation in modular machine designs, with ECC protecting code integrity against electrical noise on factory floors.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP32GS202-I/M6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP16GS202-I/M6 | DSPIC33EP32GS202-E/M6 | DSPIC33EP32GP202-I/M6 | DSPIC33EP32MC202-I/M6 | DSPIC33EP64GS202-I/M6 |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) exposed pad | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 32 KB | 16 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
| Peripheral Focus | Digital power (SMPS): high-speed PWM/ADC/DAC | Digital power (same GS peripheral set) | Digital power (same GS peripheral set) | General purpose peripherals | Motor control peripherals | Digital power (same GS peripheral set) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Drop-in Compatibility | Reference | Yes - identical pinout, -50% Flash | Yes - identical, extended temp | Yes footprint; peripheral set differs | Yes footprint; peripheral set differs | Yes - identical pinout, +100% Flash |
主な差別化要因
- Purpose-built digital-power analog complex （vs DSPIC33EP32GP202-I/M6)
- Same footprint with 2x or 0.5x memory options （vs DSPIC33EP64GS202-I/M6 / DSPIC33EP16GS202-I/M6)
- Extended temperature option on identical die （vs DSPIC33EP32GS202-E/M6)
設計ノート
Connect ALL VDD and VSS pins and solder the UQFN exposed pad to a solid ground plane - Microchip's programming specification (70005192B) explicitly requires all VDD/VSS pins connected during ICSP, and the exposed pad is the primary thermal and ground return path for the 4x4 mm UQFN. Decouple each VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus bulk 4.7-10 uF near the supply entry. A single via fence stitching the exposed pad to the ground plane reduces ground bounce for high-speed ADC sampling.
The device has multiple PGECx/PGEDx pairs for ICSP; you must use pins from the SAME pair for ICSPCLK and ICSPDAT (for example PGEC2 with PGED2). Mixing pairs is a frequent bring-up failure. Keep PGED/PGEC traces short, match their lengths, and include series 100-ohm resistors with a programming header even in production boards so MPLAB SNAP retains debug access. Do not repurpose the active pair for high-current I/O that could disturb programming thresholds.
For digital SMPS use, route the PWM outputs away from the ADC input channels to prevent switching-edge coupling into sampled current signals; synchronize ADC sampling to PWM via the peripheral trigger rather than free-running sampling to avoid switching-noise aliasing. Estimated: with a 3.3 V supply and typical active current in the tens-of-mA class for a 70 MIPS dsPIC33EP, the 4x4 UQFN junction rise stays low (<10 C/W-power product even on modest copper), so thermal design effort should focus on nearby power stages, not the controller itself.
コンプライアンス情報
RoHS compliant and lead-free per distributor listings (OnlineComponents, Hotenda) for this MPN. REACH, halogen-free, and conflict-minerals declarations were not stated in the provided data - consult Microchip's official environmental compliance resources.
