DSPIC33EP32GP503-I/TL - 16-bit 70 MIPS DSC 32KB Flash | Microchip
部品番号: DSPIC33EP32GP503-I/TL ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP32GP503-I/TL 概要
A digital signal controller is a hybrid device class that merges the deterministic control structure of a microcontroller with the mathematical throughput of a DSP. Within the power-management hierarchy of embedded systems, a DSC such as the dsPIC33EP family sits between general-purpose MCUs and dedicated DSPs, making it a power-management and control IC suited for closed-loop systems that need both fast math and rich peripherals. The dsPIC33EP series belongs to Microchip's 16-bit architecture lineage, succeeding the dsPIC33F generation with higher MIPS and lower active current.
Key features include a 70 MIPS dsPIC33E core, hardware CAN 2.0B, multiple UART/IrDA/SPI/I2C communication channels, high-speed PWM outputs, integrated op amps and advanced analog peripherals, and Peripheral Trigger Generator (PTG) for autonomous task scheduling. The industrial-grade -I temperature option guarantees operation from -40C to +85C.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, enabling single-cycle MAC operations for filtering and control-loop mathematics. Flash-based program memory supports In-Circuit Serial Programming (ICSP) and self-programming, while dual PGEC/PGED pin pairs provide flexible debug and programming access.
Typical applications include digital power supplies and power factor correction, motor control (BLDC, PMSM, stepper), and industrial automation nodes requiring CAN bus connectivity. The 5x5 mm QFN-style footprint suits compact, thermally demanding boards.
Design consideration: connect all VDD/VSS pairs, use any matched PGECx/PGEDx pair consistently for ICSP, and place 0.1 uF decoupling at every supply pin; the exposed pad must be soldered for thermal and ground integrity.
This page synthesizes distributor listings, family cross-references, and drop-in alternative analysis not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP32GP503-I/TL — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP32GP503-I/TL （同一形状・フットプリント） — 相違点: Package, Core, Performance, RAM, Communication Interfaces.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP32GP503-H/TL
✅ ドロップイン📋 参考代替品（カタログ未掲載）
DSPIC33EP64GP503-I/TL
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.51 / 個
データシートを見る →DSPIC33EP128GP503-I/TL
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32MC503-I/TL
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →DSPIC33EP32GP503-I/TL 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC33E |
| Maximum Core Frequency | 70 MHz |
| Performance | 70 MIPS |
| Flash Program Memory | 32 KB (10.7K x 24) |
| RAM | 4 KB |
| 電源電圧 | 3.3 V |
| 動作温度範囲 | -40C to +85C (I grade) |
| パッケージ | 36-VTLA (5x5 mm) exposed pad |
| 実装タイプ | Surface Mount |
| Communication Interfaces | I2C, SPI, UART, USART, IrDA, CAN |
| CAN Module | CAN 2.0B hardware |
| Special Peripherals | High-Speed PWM, Op Amps, Advanced Analog, CTMU, PTG |
| Programming / Debug | ICSP via PGECx/PGEDx pairs |
| ライフサイクル状態 | In Production |
| Packaging | Rail/Tube, 73 units per package |
| データバス幅 | 16 bit |
DSPIC33EP32GP503-I/TL 36-vtla (5x5 mm) exposed pad ピン配置ガイド
DSPIC33EP32GP503-I/TL (36-vtla (5x5 mm) exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP32GP503-I/TL.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP32GP503-I/TL の用途: 6 件s: Digital Power Supplies and PFC, Brushless DC and PMSM Motor Control, Industrial Automation and CAN Nodes, Power Metering and Measurement, Automotive and e-Mobility Subsystems (non-safety), Embedded Sensing and IoT Edge Nodes.
Digital Power Supplies and PFC
The DSPIC33EP32GP503-I/TL fits digital power conversion because its 70 MIPS core executes voltage and current control loops at switching-relevant rates while the high-speed PWM module generates precisely timed gate signals with nanosecond-class resolution. Integrated op amps amplify shunt current-sense signals internally, and the Peripheral Trigger Generator synchronizes ADC sampling to the PWM period so feedback is captured exactly where the control loop needs it, eliminating software jitter. Placed as the controller in an LLC, buck, or boost stage, it replaces analog compensation networks with firmware, enabling adaptive gains, soft-start profiles, and fault logging. The 3.3 V supply, CAN port for supervisory telemetry, and -40C to +85C industrial range align with telecom rectifier and server PSU requirements.
おすすめ
Brushless DC and PMSM Motor Control
For BLDC and PMSM drives, the DSPIC33EP32GP503-I/TL provides the 70 MIPS throughput needed for field-oriented control, executing Clarke/Park transforms and PI current loops in a single PWM period at typical 20-50 kHz switching frequencies. The high-speed PWM module supports complementary outputs with dead-time insertion and fault shutdown inputs, while internal op amps condition low-side shunt currents without external amplifier ICs. Six PWM channels drive a standard three-phase inverter, and the CAN interface links the drive to a factory automation backbone. The 36-pin VTLA 5x5 mm footprint with exposed pad gives an efficient thermal path in compact drive boards; the DSP33EP32MC503 companion variant offers the same pinout with motor-control-tuned peripherals.
おすすめ
Industrial Automation and CAN Nodes
In industrial automation, the DSPIC33EP32GP503-I/TL serves as an intelligent sensor or actuator node where its hardware CAN 2.0B module provides deterministic, noise-immune communication up to 1 Mbps on DeviceNet-style or proprietary factory buses. The 70 MIPS core leaves ample headroom for protocol stacks alongside local control logic, and UART/SPI/I2C channels bridge legacy RS-485 gateways, memory devices, and peripherals. Its 32 KB Flash hosts protocol firmware plus application logic for typical node programs, and the Peripheral Trigger Generator automates time-critical I/O tasks. The -40C to +85C industrial rating and surface-mount 5x5 mm package suit DIN-rail module and machine-mounted electronics designs requiring long service life.
おすすめ
Power Metering and Measurement
The DSPIC33EP32GP503-I/TL suits energy metering and instrumentation front ends because the dsPIC33E core executes single-cycle multiply-accumulate operations for RMS computation, FFT-based harmonic analysis, and digital filtering of sampled voltage and current channels. Advanced analog peripherals and the CTMU (Charge Time Measurement Unit) support precision timing and capacitive sensing functions, while the ADC synchronized through the PTG maintains coherent sampling essential to accurate power-factor readings. Processed results export over UART to a display or over CAN/Modbus-style links to SCADA. Operating from a single 3.3 V rail in the thermally efficient 36-VTLA package, the controller consolidates metrology computation and communication in one 16-bit device rated -40C to +85C.
おすすめ
Automotive and e-Mobility Subsystems (non-safety)
Although the -I grade is not AEC-Q100 qualified, the DSPIC33EP32GP503-I/TL architecture is the same family used across automotive auxiliary systems, making it appropriate for non-safety vehicular subsystems within its -40C to +85C envelope, such as pump controllers, actuator modules, and telemetry gateways. The hardware CAN 2.0B module speaks native automotive network protocols at 1 Mbps, the high-speed PWM drives valve or motor loads, and integrated op amps reduce bill-of-material count in current-sense circuits. The 5x5 mm exposed-pad VTLA package withstands vibration-reliant solder-joint designs better than leaded packages. For temperature grades beyond +85C or formal automotive qualification, move to the -E (extended) or automotive-ordering variants of the same family pinout.
おすすめ
Embedded Sensing and IoT Edge Nodes
As a sensing edge node, the DSPIC33EP32GP503-I/TL combines 70 MIPS of local signal processing with multiple serial links (I2C, SPI, UART/IrDA) to aggregate sensors and forward conditioned data upstream. The DSP engine performs on-node filtering and thresholding so only meaningful events travel the network, reducing bus traffic; I2C and SPI ports connect humidity, pressure, and memory devices directly. Its 32 KB Flash holds a compact application plus communication firmware, and the PTG automates periodic acquisition without CPU babysitting. In the 5x5 mm QFN-family package, the controller fits compact sensor housings, and the exposed pad simplifies grounding in metal-enclosed industrial IoT installations.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP32GP503-I/TL — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP32GP503-H/TL | DSPIC33EP64GP503-I/TL | DSPIC33EP128GP503-I/TL | DSPIC33EP32MC503-I/TL |
|---|---|---|---|---|---|
| Package | 36-VTLA (5x5 mm) exposed pad | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS / 70 MHz, 16-bit | 70 MIPS / 70 MHz, 16-bit | 70 MIPS / 70 MHz, 16-bit | 70 MIPS / 70 MHz, 16-bit | 70 MIPS / 70 MHz, 16-bit |
| Flash Program Memory | 32 KB (10.7K x 24) | 32 KB (10.7K x 24) | 64 KB | 128 KB | 32 KB (10.7K x 24) |
| RAM | 4 KB | 4 KB | 8 KB | 16 KB | 4 KB |
| Temperature Grade | -40C to +85C (I) | per -H ordering code flow | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
| Peripheral Emphasis | General purpose (GP) | General purpose (GP) | General purpose (GP) | General purpose (GP) | Motor control (MC) |
主な差別化要因
- Baseline program memory of the 36-pin family at lowest cost （vs DSPIC33EP64GP503-I/TL)
- Identical die with alternate screening flow （vs DSPIC33EP32GP503-H/TL)
- General-purpose analog versus motor-control peripheral mix （vs DSPIC33EP32MC503-I/TL)
- RAM scaling option without board change （vs DSPIC33EP128GP503-I/TL)
設計ノート
Solder the exposed pad of the 36-VTLA package to a grounded copper pour. On dsPIC33E QFN-style packages the backside pad is the primary thermal and low-inductance ground connection; an unsoldered pad degrades both thermal performance and EMI behavior. Use a stencil with roughly 50-70% paste coverage on the pad and thermal vias (0.3 mm drill, filled or tented) to the ground plane. Per NorthernSoftware programming notes, all VDD and VSS pins must be connected - never assume internal pin bonding covers an unused supply pair.
Decouple every VDD pin with a 0.1 uF ceramic placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the device. dsPIC33E parts at 70 MHz draw transient core currents during Flash fetch bursts; inadequate local decoupling shows up as sporadic oscillator glitches or Flash write errors during self-programming. Keep the VCAP/VDDCORE capacitor (value per datasheet) on its own low-ESR path - this pin regulates the internal core rail and is sensitive to series inductance. Estimated: keep VDD rail impedance below 0.5 ohm at 100 MHz for clean core-supply ripple.
ICSP pairing is the most common bring-up failure: the device offers multiple PGECx/PGEDx pairs and the programmer config must use the same numbered pair for ICSPCLK and ICSPDAT (PGEC2 with PGED2, PGEC1 with PGED1, etc.). Mixing pairs prevents device detection. Also configure peripheral pin select (PPS) mappings before enabling UART/CAN pins, and remember CONFIG words set at Flash programming time - wrong oscillator config words are the leading cause of a 'dead' first-board build.
On CAN networks, route CANTX/CANRX differentially-clean to the transceiver, keep stubs on the bus below 30 cm, and terminate both ends at 120 ohm. For high-speed PWM driving power stages, gate-drive traces should stay under 5 cm or use driver ICs close to the FETs; at 70 MIPS the PWM edges are fast enough that ringing couples back into ADC inputs. Shield or physically separate analog sense traces from PWM and CAN lines, referencing them to a quiet analog ground island tied to the exposed pad at one point.
コンプライアンス情報
Compliance data was not present in the verified web data. Confirm RoHS/REACH/lead-free status on the Microchip product page or request the material declaration before regulatory submissions. The -I ordering grade is industrial temperature, not AEC-Q100 automotive qualified.
