DSPIC33EP64GS502T-E/2N - 16-bit 60 MIPS DSC 64KB Flash | Microchip
部品番号: DSPIC33EP64GS502T-E/2N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.22 | $52.20 |
| 100 | $4.64 | $464.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.73 | $3,730.00 |
DSPIC33EP64GS502T-E/2N 概要
A digital signal controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, the dsPIC33EP GS family sits at the intersection of MCU control flow and DSP-intensive control-loop execution, making it a single-chip alternative to MCU-plus-DSP two-chip solutions in switch-mode power supplies.
Key features include the interconnected high-Speed PWM module purpose-built for multi-loop SMPS topologies, a high-speed analog-to-digital converter, programmable gain amplifiers (PGA), and analog comparators that close control loops without external components. The -E temperature grade covers -40C to +125C ambient, and the AEC-Q100 qualification plus FuSa support allows use in safety-relevant automotive power stages.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP instruction extensions (MAC, multiply-divide) and hardware division, enabling deterministic execution of proportional-integral control loops at switching frequencies well into the hundreds of kilohertz. The interconnected PWM, ADC and comparators can trigger each other autonomously, offloading cycle-by-cycle current limiting from software.
Typical applications include AC-DC power supplies, interleaved power factor correction (PFC), DC-DC converters, solar micro-inverters, battery chargers, and LED drivers. Microchip reference designs such as the Interleaved PFC (350W, universal input) are built directly on this controller family.
Design consideration: the exposed pad of the UQFN package is the primary thermal and ground path - connect it to a solid ground plane with multiple vias; without it, thermal and EMI performance degrade significantly.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout/package data, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EP64GS502T-E/2N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EP64GS502T-E/2N （同一形状・フットプリント） — 相違点: Core Architecture, Package, Packaging, Functional Safety Support, Maximum CPU Speed.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EP64GS502-E/2N
✅ ドロップイン✓ 在庫あり
$3.1 / 個
データシートを見る →DSPIC33EP64GS502I-E/2N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EP32GS502-E/2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.5 / 個
データシートを見る →DSPIC33EP64GS502T-E/2N 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC33EP RISC with DSP extensions |
| Maximum CPU Speed | 60 MIPS |
| Program Memory (Flash) | 64KB (64K x 8) |
| 電源電圧 | 3.3 V |
| パッケージ | 28-UQFN (6x6 mm) with exposed pad |
| Qualification | AEC-Q100 automotive |
| Functional Safety Support | Yes (FuSa) |
| 動作温度範囲 | -40C to +125C (E grade) |
| Specialty Features | Interconnected High-Speed PWM, ADC, PGA, Comparators for SMPS/digital power |
| Application Target | SMPS and digital power conversion |
| 実装タイプ | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| RoHS ステータス | Compliant |
DSPIC33EP64GS502T-E/2N 28-uqfn (6x6 mm) with exposed pad ピン配置ガイド
DSPIC33EP64GS502T-E/2N (28-uqfn (6x6 mm) with exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EP64GS502T-E/2N.
詳細は データシート をご参照ください。
主な用途
DSPIC33EP64GS502T-E/2N の用途: 6 件s: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters, Solar Micro-Inverters, Battery Chargers, LED Drivers.
AC-DC Power Supplies
The DSPIC33EP64GS502T-E/2N is a natural fit for digitally controlled AC-DC power supplies because its interconnected high-Speed PWM, high-speed ADC, programmable gain amplifiers, and analog comparators allow voltage-mode, current-mode, and multi-loop control to be executed by a single 60 MIPS core. The hardware interconnects handle cycle-by-cycle current limiting and fast fault shutdown without software latency, which is essential for meeting hold-up and transient-response requirements. Placed as the sole controller, it replaces an analog PWM controller plus a supervisory MCU, reducing BOM count. The -40C to +125C E grade and AEC-Q100 qualification extend its use into automotive and industrial PSU environments where consumer-grade controllers cannot be qualified.
おすすめ
Interleaved Power Factor Correction (PFC)
Microchip's 350W universal-input Interleaved PFC reference design is built directly on the dsPIC33EP64GS502, demonstrating the part's suitability for two-phase interleaved boost PFC stages. The interconnected high-Speed PWM module generates phase-shifted interleaved drive with programmable phase relationship, while the high-speed ADC samples inductor currents synchronized to each PWM cycle so both phases can share current equally. The analog comparators implement cycle-by-cycle overcurrent protection in hardware. Running at 60 MIPS leaves ample headroom for the outer voltage loop plus power-metering math. The 3.3V supply, 64KB Flash, and AEC-Q100 qualification make it viable from consumer PSU front-ends through automotive on-board charger PFC stages without changing controllers.
おすすめ
DC-DC Converters
For synchronous buck, boost, and buck-boost converters, the DSPIC33EP64GS502T-E/2N offers deterministic loop closure at high switching frequency. The 60 MIPS core executes proportional-integral compensation math in a few microseconds, while the ADC with programmable gain amplifiers digitizes feedback signals directly, eliminating external signal-conditioning op-amps in 3.3V-referenced systems. Hardware comparators trip the PWM outputs within nanoseconds of an overcurrent event - a level of protection speed software alone cannot achieve. Designers typically run the power stage at 100-500 kHz with the ADC triggered by the PWM module for jitter-free sampling. The 28-UQFN (6x6 mm) exposed pad keeps the controller footprint minimal on dense converter boards.
おすすめ
Solar Micro-Inverters
Solar micro-inverters demand simultaneous MPPT (maximum power point tracking), grid-synchronization, and DC-AC inversion control from one low-cost, high-reliability controller. The DSPIC33EP64GS502T-E/2N handles this with its interconnected high-Speed PWM generating the inverter switching pattern, the high-speed ADC sampling panel voltage/current for MPPT algorithms, and the DSP MAC instructions accelerating the control-loop and waveform math at 60 MIPS. The -40C to +125C temperature grade suits rooftop enclosures that see extreme ambient swings, and AEC-Q100 robustness translates into field reliability. The 64KB Flash accommodates MPPT, grid monitoring, and anti-islanding code concurrently, and the FuSa support assists with grid-code compliance documentation.
おすすめ
Battery Chargers
Multi-chemistry battery chargers require staged charging (pre-charge, constant current, constant voltage, termination) with precise current and voltage regulation plus safety supervision. The DSPIC33EP64GS502T-E/2N implements the CC/CV loops in firmware using its 60 MIPS core and high-speed ADC, while the comparators provide independent hardware overcurrent and overvoltage cutoffs that operate even if firmware misbehaves - a valuable defense-in-depth for lithium charging safety. The interconnected PWM drives synchronous buck charging stages at high frequency for small magnetics. AEC-Q100 qualification supports automotive on-board charger sub-modules, and Functional Safety support simplifies safety analyses. The 28-UQFN 6x6 package fits compact charger PCBs in vehicle and portable applications.
おすすめ
LED Drivers
High-power and automotive LED drivers benefit from the DSPIC33EP64GS502T-E/2N's precise, fast current control. The high-Speed PWM supports both fixed-frequency current regulation and burst-dimmable architectures, while the high-speed ADC with PGA reads current-sense signals at low voltage for accurate constant-current loops. Hardware comparators enable cycle-by-cycle LED string overcurrent protection, critical because LED failures are often short-circuit events. Its 60 MIPS core simultaneously runs dimming curves, temperature derating (using on-chip or external temperature sensing), and fault logging. The -40C to +125C grade and AEC-Q100 qualification make it suitable for automotive exterior lighting where thermal cycling and qualification requirements exclude consumer controllers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EP64GS502T-E/2N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EP64GS502-E/2N | DSPIC33EP64GS502I-E/2N | DSPIC33EP32GS502-E/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm), exposed pad | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64KB | 64KB | 64KB | 32KB (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Packaging Format | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tape & Reel (T) |
主な差別化要因
- Full 64KB Flash headroom in the same footprint （vs DSPIC33EP32GS502-E/2N)
- Extended -40C to +125C temperature grade （vs DSPIC33EP64GS502I-E/2N)
- Identical drop-in supply flexibility between reel and tube （vs DSPIC33EP64GS502-E/2N)
設計ノート
The exposed pad on the underside of the 28-UQFN (6x6 mm) package is the primary ground and thermal path. Connect it to a solid ground plane through an array of at least 4-9 thermal vias (0.3 mm drill, filled or tented). Omitting this connection is the single most common layout error with UQFN dsPIC parts - it degrades thermal performance, ground integrity for the ADC, and EMI behavior simultaneously. Follow the Microchip UQFN landing-pattern recommendation in the datasheet mechanical drawing exactly; the 6x6 UQFN has fine pitch that demands accurate stencil design (reduce stencil aperture ratio on the center pad to ~50-70% to avoid solder voiding).
Decouple VDD with a 0.1 uF ceramic capacitor placed within 2 mm of each VDD pin, plus one bulk 4.7-10 uF capacitor per supply rail. dsPIC33EP cores at 60 MIPS draw transient current on every clock edge; long, inductive traces cause VDD droop that manifests as spurious resets or ADC noise. If using the internal voltage regulator, follow the datasheet recommendation for the VCAP regulator output capacitor precisely - the wrong capacitance or ESR causes brown-out during Flash writes. Estimated: core transient currents are sub-100 mA, so a single solid ground plane is sufficient for most digital power converter layouts.
Peripheral Pin Select (PPS) on dsPIC33EP devices means default pin functions differ from generic PIC conventions - always map UART, SPI, and PWM pins explicitly in code and verify against the datasheet pin table, not against a previous project. Second pitfall: in digital power designs, keep PWM output traces short and away from ADC input nets; switching-node coupling into high-impedance sense lines corrupts the very loops the ADC samples. Third: the MCLR pin needs the datasheet-specified pull-up and capacitor; floating MCLR causes erratic reset behavior under ESD or noisy supply conditions common in SMPS environments.
コンプライアンス情報
AEC-Q100 automotive qualification and Functional Safety (FuSa) support confirmed by DigiKey and Microchip USA listings. RoHS compliance per standard Microchip current-production status; REACH and halogen-free status not stated in provided data.
