DSPIC33EV64GM004-I/ML - 16-bit 70 MIPS 5V DSC 64KB | Microchip
部品番号: DSPIC33EV64GM004-I/ML ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.7 | $370.00 |
| 500 | $3.33 | $1,665.00 |
| 1,000 | $2.96 | $2,960.00 |
DSPIC33EV64GM004-I/ML 概要
A digital signal controller combines the computational capability of a digital signal processor with the peripheral integration and control architecture of a microcontroller. Within the semiconductor hierarchy, the dsPIC33EV sits under Microchip's 16-bit dsPIC33 DSC line, itself a subset of the broader microcontroller and embedded processor category. DSCs are optimized for real-time control loops where deterministic interrupt latency and hardware multiply-accumulate operations are required.
Key features of this device include the 5V-tolerant 70 MIPS dsPIC DSC core, 64KB of self-programming Flash with ECC-class endurance, dual CAN 2.0B modules for automotive and industrial networking, and multiple UART, SPI, and I2C serial channels. The industrial-grade temperature rating (-40C to +85C, indicated by the -I suffix) makes it suitable for harsh environments.
Architecturally, the dsPIC33EV core supports DSP-class instructions, hardware looping, and a flexible interrupt controller with fast context switching. Multiple DMA channels offload data movement from the CPU, and an internal fast RC oscillator with PLL allows full-speed operation without an external crystal, reducing bill-of-material cost.
Typical applications include BLDC, PMSM, AC induction, and stepper motor control; appliance and industrial control panels; automotive body and sensor units; and touch-sensing user interfaces where 5V noise immunity is a decisive advantage over 3.3V-only MCUs.
When designing with this part, plan the power distribution so the 5V core supply rails are well decoupled at the QFN exposed pad, and confirm configuration-bit settings for oscillator and watch-dog selection before first flash programming.
This page synthesizes distributor availability, family drop-in alternatives, and design guidance not consolidated in the manufacturer datasheet.
ドロップイン代替品: DSPIC33EV64GM004-I/ML — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: DSPIC33EV64GM004-I/ML （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Functional Safety Support, RAM, Core.
クイック比較ツール — 並列比較する代替部品を選択:
DSPIC33EV256GM104-E/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.9 / 個
データシートを見る →DSPIC33EV64GM104-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$3.11 / 個
データシートを見る →DSPIC33EV64GM006-I/MR
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.95 / 個
データシートを見る →DSPIC33EV32GM104T-I/ML
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$2.95 / 個
データシートを見る →DSPIC33EV64GM004-E/ML
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
DSPIC33EV64GM004-I/ML 最大定格＆電気的特性
| Core Architecture | 16-bit dsPIC DSC |
| Maximum CPU Speed | 70 MIPS |
| Core Supply Voltage | 5 V |
| Flash Program Memory | 64 KB (22K x 24) |
| Data RAM | 8 KB |
| パッケージ | 44-QFN (8x8 mm), exposed pad |
| 実装タイプ | Surface Mount |
| 動作温度 | -40C to +85C (industrial, -I suffix) |
| CAN Modules | 2 x CAN 2.0B |
| Timers | 9 timers |
| DMA Channels | 4 DMA channels |
| Serial Interfaces | UART, SPI, I2C |
| Internal Oscillator | FRC with PLL (crystal option available) |
| RoHS ステータス | Compliant |
| Functional Safety Support | FuSa (Functional Safety) variant documented |
DSPIC33EV64GM004-I/ML 44-qfn (8x8 mm), exposed pad ピン配置ガイド
DSPIC33EV64GM004-I/ML (44-qfn (8x8 mm), exposed pad パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: DSPIC33EV64GM004-I/ML.
詳細は データシート をご参照ください。
主な用途
DSPIC33EV64GM004-I/ML の用途: 6 件s: BLDC and PMSM Motor Control, Automotive Body and Sensor Units, Industrial Control Panels and Appliances, Touch-Sensing User Interfaces, CAN-Networked Industrial Nodes, Sensor Acquisition and Signal Conditioning.
BLDC and PMSM Motor Control
The DSPIC33EV64GM004-I/ML fits motor-drive applications because its 70 MIPS 16-bit DSP core executes field-oriented control (FOC) loops with hardware multiply-accumulate instructions, keeping current-loop sample periods deterministic at PWM frequencies of 20 kHz and above. The 5V operating rail provides direct gate-driver interface margins that 3.3V controllers cannot offer without level shifting. In a typical drive, the on-board ADC samples phase currents synchronized to the PWM via the 4 DMA channels so the CPU is never stalled by data movement. Firmware up to 64KB supports sensorless observers plus a communication stack simultaneously. Compared with general-purpose MCUs, the dsPIC33EV reduces external gate-buffer complexity and preserves CAN 2.0B connectivity for networked drives.
おすすめ
Automotive Body and Sensor Units
Microchip explicitly targets the dsPIC33EV family at automotive sensors and touch/control units operating under noise and vibration, and the DSPIC33EV64GM004-I/ML reflects that with its 5V core tolerance and dual CAN 2.0B modules for in-vehicle networking. The 70 MIPS core handles sensor fusion filtering (speed, position, pressure) at low latency, while 64KB Flash retains diagnostics, bootloader, and application code in one bank. The industrial -I temperature rating of -40C to +85C covers under-dash and engine-bay-adjacent electronics; for full under-hood exposure the -E grade variant of the same die should be selected. DMA-driven ADC sampling keeps sensor acquisition deterministic, and the internal FRC oscillator with PLL maintains timing if the external crystal path is disturbed by vibration.
おすすめ
Industrial Control Panels and Appliances
Appliance and panel controllers benefit from the DSPIC33EV64GM004-I/ML's 5V noise immunity in environments with relay arcing, compressor inrush, and motor switching transients. The 70 MIPS core executes PID loops for temperature and speed regulation while the 9 timers independently manage PWM heater drive, fan control, and system tick. 64KB Flash accommodates multiple operating profiles plus an OTA-style bootloader for field updates. Serial channels (UART, SPI, I2C) interface displays, EEPROM, and touch front-ends concurrently. Designers should decouple the QFN exposed pad firmly to the ground plane to counter conducted noise from switching loads. The dual CAN module also links the appliance into factory automation networks where required, and the 44-QFN 8x8 mm footprint keeps two-layer board designs economical.
おすすめ
Touch-Sensing User Interfaces
The dsPIC33EV family is specified by Microchip for advanced touch interfacing, and the DSPIC33EV64GM004-I/ML implements capacitive touch sensing using charge-transfer measurement on its analog-capable I/O pins. Operating at 5V increases the signal-to-noise ratio of touch measurements through gloves, moisture, or metal-bezel coupling - a common failure mode for 3.3V-only touch MCUs in appliance and industrial HMI products. The 70 MIPS core runs drift-compensation algorithms while simultaneously executing the application control loop, avoiding a separate touch controller chip. 64KB Flash holds both touch tuning tables and application firmware. The 4 DMA channels stream raw scan data for post-processing. Designers should route touch pads away from PWM traces and use the exposed-pad ground as a guard reference for best sensitivity.
おすすめ
CAN-Networked Industrial Nodes
With two independent CAN 2.0B modules, the DSPIC33EV64GM004-I/ML acts as a gateway or multi-segment node in industrial networks, bridging motor-drive CAN traffic to a supervisory bus while running local control at 70 MIPS. The 5V core tolerates the electrically harsh cabinet environment, and 64KB Flash stores both protocol stacks (for example CANopen-style layers) plus application logic. The 9 timers and 4 DMA channels offload periodic transmission scheduling and buffer management, so the CPU remains available for control and diagnostics. Typical deployments include conveyor node controllers, pump monitoring units, and energy-meter aggregators. Firmware should implement bus-off recovery and error counters per CAN 2.0B requirements, and the exposed thermal pad of the QFN-44 should be tied to a solid ground pour for EMI performance.
おすすめ
Sensor Acquisition and Signal Conditioning
The DSPIC33EV64GM004-I/ML serves as a compact sensor hub: its DSP core applies FIR and IIR filtering at 70 MIPS while the ADC stream, managed by 4 DMA channels, captures multiple channels without CPU overhead. The 5V analog domain improves resolution against noise for ratiometric sensors such as pressure bridges and potentiometric position sensors common in industrial and automotive systems. 64KB Flash supports calibration tables, linearization curves, and a communication stack simultaneously; 8KB RAM buffers filtered datasets. Outputs can be published over UART, SPI, I2C, or either CAN module. When selecting this DSC for a sensor node, budget the sample-and-hold timing per the family data sheet and use the internal FRC with PLL only when absolute time-stamp accuracy to an external standard is not required.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: DSPIC33EV64GM004-I/ML — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | DSPIC33EV256GM104-E/ML | DSPIC33EV64GM104-I/ML | DSPIC33EV64GM006-I/MR |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (22K x 24) | 256 KB | 64 KB | 64 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40C to +85C (-I) | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +85C (-I) |
| CAN Modules | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B |
| Drop-in Compatibility | Reference part | Pin-to-pin, QFN-44 | Pin-to-pin, QFN-44 | Pin-to-pin, QFN-44 |
主な差別化要因
- Native 5V operation （vs 3.3V motor-control MCUs (e.g., dsPIC33CK family))
- Upgrade path on identical footprint （vs DSPIC33EV256GM104-E/ML)
- Dual CAN 2.0B on-chip （vs DSPIC33EV32GM104T-I/ML)
- Cost efficiency at 64KB class （vs DSPIC33EV256GM104-E/ML)
設計ノート
The 44-QFN (8x8 mm) exposed pad must be soldered to a ground pour with an array of thermal vias (typically 4x4 via matrix at 1.0 mm pitch) to achieve both low thermal resistance and good EMI performance. The exposed pad is the primary ground connection for the die; relying only on perimeter ground pins increases ground bounce during simultaneous PWM switching and can corrupt ADC readings. Per the family data sheet layout guidance, keep the crystal (if used) within 10 mm of its OSCO/OSCI pins with guard ground traces.
The dsPIC33EV core runs from a 5V rail with significant dynamic current during 70 MIPS execution. Estimated: at 70 MIPS the core supply current is typically in the tens-of-mA range; with 100 nF ceramic decoupling on every VDD pin pair plus a 10 uF bulk capacitor near the QFN, supply ripple stays within the data sheet limit. Because the family is 5V-only, do not attempt 3.3V operation - if the system rail is 3.3V, choose dsPIC33EP/CK families or add level shifting.
Configuration bits (oscillator source, PLL settings, watchdog, PWM pin mode) are stored in Flash and loaded at every reset - incorrect FOSC settings render the board unresponsive to the intended clock. Before first programming, verify the oscillator configuration in MPLAB X against the DS70005144H register tables. Also note that PGD/PGC pins double as general-purpose I/O; reserve them for ICSP access or disable debug only in production builds, otherwise field reprogramming becomes impossible without board rework.
When using both CAN 2.0B modules, route each CAN pair as a 120-ohm differential transmission line and place the transceiver (for example MCP2551) within 20 mm of the DSC CANTX/CANRX pins. Because the dsPIC33EV PWM outputs can switch amps of gate current through nearby traces, keep analog sensor routing on the opposite board side with a ground reference plane; the 4 DMA-managed ADC channels are sensitive to coupling from 20 kHz PWM edges.
コンプライアンス情報
RoHS compliance inferred from Microchip standard product offering; REACH/halogen-free/conflict-minerals status not stated in the provided web data - confirm on the Microchip product page environmental section.