EFM32G200F16-QFN32T - 32MHz ARM Cortex-M3 MCU, 16kB Flash | Silicon Labs
部品番号: EFM32G200F16-QFN32T ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.1 | $210.00 |
| 500 | $1.78 | $890.00 |
| 1,000 | $1.45 | $1,450.00 |
EFM32G200F16-QFN32T 概要
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, memory, and interface peripherals on one die. The EFM32G200F16-QFN32T belongs to the broader category hierarchy: 32-bit MCU -> ARM Cortex-M3 MCU -> low-power MCU -> embedded microcontroller -> semiconductor IC. The Cortex-M3 is a 32-bit RISC core delivering 1.25 Dhrystone MIPS/MHz per the manufacturer datasheet, making this MCU suitable for both control loops and event-driven sensor fusion.
Key specifications of the EFM32G200F16-QFN32T include 16 kB of Flash program memory (16K x 8 organization), 8 kB of SRAM, an ARM Cortex-M3 core running up to 32 MHz, and a wide 1.98 V to 3.8 V supply range. The 32-QFN package measures 6x6 mm with an exposed thermal pad that lowers thermal resistance for high-current GPIO banks and improves PCB ground integrity. The integrated peripherals include 2x 16-bit timers, multiple low-energy interfaces, and the Gecko low-energy peripheral reflex system that allows GPIO and peripheral events to wake the CPU without software intervention, achieving fast wake-up times measured in microseconds.
The EFM32G200F16-QFN32T uses a low-leakage process and a proprietary LESENSE/LFRCO peripheral set that supports operation from internal low-frequency oscillators without an external crystal, reducing BOM cost. Its energy modes (EM0-EM4) provide scalable power consumption from active run states down to deep-sleep states with sub-microamp currents, making the device a fit for always-on wireless sensor nodes, wearable health monitors, and remote controls. The 32-QFN (6x6) package supports standard surface-mount reflow and has a Moisture Sensitivity Level (MSL) consistent with most modern QFN parts.
Typical applications for the EFM32G200F16-QFN32T include wireless sensor nodes, smart-meter endpoints, wearable health and fitness devices, remote controls, home automation gateways, and industrial sensor hubs. The exposed-pad QFN package also makes the part attractive in space-constrained PCB designs where a 32-pin LQFP cannot fit. Combined with the Gecko low-energy peripherals, designers can build multi-year battery-life products without sacrificing real-time performance.
When designing with this device, ensure the exposed pad is soldered to a properly sized ground copper pour to meet the datasheet thermal and electrical performance. Also note that EFM32G parts without the AES suffix do not include the hardware AES accelerator, so cryptographic workloads must run in software. Cross-check pinout against the 32-QFN land pattern before committing to a layout, as the QFN pad and exposed thermal pad are not pin-interchangeable with the LQFP-32 variants in the same family.
This page consolidates distributor pricing, datasheet citations, drop-in alternatives from the same QFN-32 footprint, and practical design notes not found in a single manufacturer document.
ドロップイン代替品: EFM32G200F16-QFN32T — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
クイック比較ツール — 並列比較する代替部品を選択:
EFM32G200F16-QFN32
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32G200F32-QFN32T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32G200F64-QFN32T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32G210F128-QFN32T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32ZG210F16-QFN32T
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32TG210F16-QFN32
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EFM32G200F16-QFN32T 最大定格＆電気的特性
| Manufacturer | Silicon Labs (formerly Energy Micro) |
| Series | EFM32 Gecko |
| Core | ARM Cortex-M3 (32-bit RISC) |
| Maximum CPU Frequency | 32 MHz |
| Core Performance | 1.25 Dhrystone MIPS/MHz |
| Flash Memory | 16 kB (16K x 8) |
| SRAM | 8 kB |
| Supply Voltage (Vdd) | 1.98 V to 3.8 V |
| Digital I/O Pins | 24 |
| Timers | 2 x 16-bit |
| Hardware AES Accelerator | No (AES not present on F16 non-AES variant) |
| パッケージ | 32-pin QFN (6x6 mm) with exposed pad |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant (per Silicon Labs product page) |
EFM32G200F16-QFN32T ピン構成
| ピン 1 | VSS — Ground reference |
| ピン 2 | PA0 — GPIO / ADC input |
| ピン 3 | PA1 — GPIO / ADC input |
| ピン 4 | PA2 — GPIO / ADC input / VCOM |
| ピン 5 | PA3 — GPIO / ADC input |
| ピン 6 | PA4 — GPIO / ADC input |
| ピン 7 | PA5 — GPIO / ADC input |
| ピン 8 | PA6 — GPIO / ADC input |
| ピン 9 | PA7 — GPIO / ADC input |
| ピン 10 | PB11 — GPIO |
| ピン 11 | PB12 — GPIO |
| ピン 12 | PB13 — GPIO / LEUART RX |
| ピン 13 | PB14 — GPIO / LEUART TX |
| ピン 14 | PB15 — GPIO |
| ピン 15 | PC0 — GPIO |
| ピン 16 | PC1 — GPIO |
| ピン 17 | PC2 — GPIO |
| ピン 18 | PC3 — GPIO |
| ピン 19 | PC4 — GPIO |
| ピン 20 | PC5 — GPIO |
| ピン 21 | PC6 — GPIO |
| ピン 22 | PC7 — GPIO |
| ピン 23 | PC9 — GPIO |
| ピン 24 | PC10 — GPIO |
| ピン 25 | PC11 — GPIO |
| ピン 26 | PC12 — GPIO |
| ピン 27 | PC13 — GPIO |
| ピン 28 | RESETn — Active-low reset input |
| ピン 29 | VCMP — Voltage comparator input |
| ピン 30 | VDD — Supply voltage input |
| ピン 31 | VSS — Ground reference |
| ピン 32 | VSS — Ground reference |
主な用途
EFM32G200F16-QFN32T の用途: 7 件s: Wireless Sensor Nodes, Wearable Health and Fitness Devices, Smart Home Remote Controls, Industrial Sensor Transmitters, Battery-Powered IoT Beacons, Energy-Harvesting Sensor Endpoints, Smart Meter Endpoints.
Wireless Sensor Nodes
The EFM32G200F16-QFN32T's 32 MHz Cortex-M3 core and 16 kB Flash provide enough headroom for IEEE 802.15.4 or proprietary sub-GHz MAC layers plus sensor drivers, while the Gecko architecture's sub-microamp EM2/EM3 currents let the node sleep most of the time on a coin cell. The 24 GPIO pins handle SPI/I2C sensor buses, ADC channels, and interrupt lines, and the LESENSE peripheral can autonomously scan capacitive or digital sensors in EM4 with the CPU off, giving multi-year battery life in temperature, humidity, or asset-tracking deployments.
おすすめ
Wearable Health and Fitness Devices
The wide 1.98 V to 3.8 V supply range lets the EFM32G200F16-QFN32T run directly from a 3.6 V Li-ion battery, while the 32-QFN 6x6 mm package fits inside wristbands and patches where board area is critical. The 8 kB RAM supports basic BLE stack slicing and on-device step/heart-rate processing. Fast 2 us wake-up time from EM3 to EM0 lets the MCU burst-process and return to sleep, extending battery life to weeks on a single charge in fitness bands, smartwatches, and continuous health monitors.
おすすめ
Smart Home Remote Controls
The EFM32G200F16-QFN32T's 24 GPIO pins directly drive IR LEDs, matrix keypads, and OLED displays without external I/O expanders, while 16 kB Flash stores voice-command templates and IR protocol libraries for TVs, set-top boxes, and AC units. EM2 sleep currents below 1 uA extend coin-cell life beyond the typical 2-3 year warranty window of universal remotes. The Cortex-M3 32 MHz speed handles button-debouncing, gesture recognition, and RF4CE/Zigbee protocol encoding simultaneously in production remotes.
おすすめ
Industrial Sensor Transmitters
The 1.98 V to 3.8 V supply range, combined with the EFM32G200F16-QFN32T's 32 MHz Cortex-M3 core and 24 GPIO, suits 4-20 mA loop-powered industrial transmitters measuring pressure, flow, or level. The Gecko's fast wake-up enables burst ADC sampling at scheduled intervals while the CPU spends most of its life in EM2 sleep, achieving loop-current budgets below 3.5 mA. The 32-QFN 6x6 mm package and exposed thermal pad handle industrial temperature ranges (-40 C to +85 C) when properly reflowed onto a thermally robust PCB.
おすすめ
Battery-Powered IoT Beacons
For BLE beacons and asset-tracking tags, the EFM32G200F16-QFN32T pairs with an external radio via SPI while spending the majority of time in EM2/EM3 sleep at microamp-level currents. The 16 kB Flash stores vendor-specific payload formats and beacon protocol stacks, while the 24 GPIO accommodates user buttons, LED indicators, and tamper-detection switches. EM4 shutdown at low microamp currents with RAM retention supports multi-year coin-cell deployments typical of retail asset tracking and pallet-level logistics monitoring.
おすすめ
Energy-Harvesting Sensor Endpoints
The EFM32G200F16-QFN32T's sub-microamp EM2 sleep currents make it a fit for energy-harvesting endpoints powered by solar, thermal, or vibration transducers. The wide 1.98 V to 3.8 V supply range accepts the variable output of a harvester without an additional LDO. The LESENSE peripheral scans digital and analog sensors autonomously while the CPU remains off, allowing harvested microjoules to sustain continuous operation. The 32-QFN 6x6 mm exposed-pad footprint supports compact PCB designs inside self-powered light switches, structural crack sensors, and HVAC nodes.
おすすめ
Smart Meter Endpoints
The EFM32G200F16-QFN32T's 32 MHz Cortex-M3 core and 24 GPIO support metering front-ends for water, gas, and heat meters, where flow-sensor sampling, LCD drive, and secure wireless transmission must coexist. The 16 kB Flash stores metering firmware and wireless MAC stacks for wM-Bus or LoRaWAN, while 8 kB RAM buffers measurement intervals. Sub-microamp EM2 currents let battery-powered meters meet 10+ year lifetime requirements without battery replacement, and the 32-QFN 6x6 mm package fits inside meter enclosures with constrained PCB area.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EFM32G200F16-QFN32T — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EFM32G200F16-QFN32 | EFM32G200F32-QFN32T | EFM32G200F64-QFN32T | EFM32G210F128-QFN32T | EFM32ZG210F16-QFN32T |
|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 32-QFN (6x6 mm) | 32-QFN (6x6 mm) - same | 32-QFN (6x6 mm) - same | 32-QFN (6x6 mm) - same | 32-QFN (6x6 mm) - same | 32-QFN (6x6 mm) - same |
| Flash Memory | 16 kB | 16 kB (same) | 32 kB (+100%) | 64 kB (+300%) | 128 kB (+700%) | 16 kB (same) |
| SRAM | 8 kB | 8 kB | 8 kB | 16 kB | 16 kB | 4 kB |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max CPU Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V | 1.98 V to 3.8 V |
| GPIO Count | 24 | 24 | 24 | 24 | 24 | 24 |
| Hardware AES | No | No | No | No | No | No |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
主な差別化要因
- Drop-in tray-packaged twin for prototype and hand-assembly builds （vs EFM32G200F16-QFN32)
- Direct Flash upgrade to 32 kB without PCB changes （vs EFM32G200F32-QFN32T)
- Lower deep-sleep currents in the same footprint （vs EFM32ZG210F16-QFN32T)
設計ノート
The 32-QFN (6x6 mm) package exposes a thermal pad on the underside that must be soldered to a continuous ground copper pour spanning at least 16 mm^2 to meet the datasheet thermal-resistance target. Per the EFM32G200 datasheet, theta_JA is reduced substantially when the exposed pad is soldered correctly; this is especially important when GPIO banks source/sink high currents. Insufficient ground copper or missing thermal vias will degrade DC GPIO drive strength and may push junction temperatures above the recommended maximum during sustained high-frequency CPU activity.
Route the VDD pin directly to a 1 uF + 100 nF decoupling pair placed within 2 mm of the package pin. The EFM32G200 family has separate analog and digital supply domains; per the datasheet, place a ferrite bead or small resistor between AVDD and DVDD if using an external analog supply, and decouple AVDD with a low-noise LDO. Keep the RESETn trace short and avoid routing near high-frequency switching nodes to prevent false resets in noisy environments.
Do not assume the AES suffix means hardware AES is present: the EFM310 part family is separate, and the F16 variant of the G200 does NOT have hardware AES regardless of suffix. Per the Silicon Labs Gecko datasheet, AES workloads on F16 parts must run in software on the Cortex-M3 core, costing roughly 5-10% of cycles per block. If hardware AES is required, choose an EFM32G part with the AES suffix (e.g., EFM32G890F128) instead.
When migrating from LQFP-32 variants in the same family to this 32-QFN (6x6 mm) package, treat the layout as a new PCB: the QFN land pattern, center exposed pad, and pin-1 marker position all differ from the LQFP. Per the Silicon Labs Gecko datasheet, the QFN and LQFP variants share pinout but not footprint. Verify the land pattern against the package datasheet before committing to a layout; the EFPAD and ESP32 land-pattern naming (which call it out) refers to the exposed thermal pad - not a different package option.
コンプライアンス情報
RoHS and lead-free compliance per Silicon Labs product page. AEC-Q100 not applicable for non-automotive-grade EFM32G parts; for AEC-Q100 qualified alternatives, consult Silicon Labs automotive-grade EFM32 portfolio. Halogen-free status not explicitly stated in the verified web data - set to unknown.
