EFM32G200F64G-E-QFN32R - 64KB Flash ARM Cortex-M3 MCU | Silicon Labs
部品番号: EFM32G200F64G-E-QFN32R ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $3.62 | $3.62 |
| 10 | $3.26 | $32.60 |
| 100 | $2.89 | $289.00 |
| 500 | $2.61 | $1,305.00 |
| 1,000 | $2.32 | $2,320.00 |
EFM32G200F64G-E-QFN32R 概要
Key features include a single 1.98 V to 3.8 V supply rail, 24 digital I/O pins, 2 x 16-bit timers, integrated low-energy peripherals, hardware AES crypto accelerator (AES Excluded on this G-grade variant), 2-pin Serial Wire Debug, 1-pin Serial Wire Viewer, and a pre-programmed USB/UART bootloader. The Cortex-M3 core delivers 1.25 DMIPS/MHz with single-cycle multiplier and hardware MAC, while the autonomous peripheral reflex system allows I/O events to wake the MCU without CPU intervention.
The EFM32G200F64G-E-QFN32R is built on the Gecko architecture from Energy Micro (acquired by Silicon Labs), which pioneered sub-microamp sleep current for battery-operated designs. Compared to a generic Cortex-M3, the Gecko adds an LESENSE block, on-chip op-amps, a 5V-tolerant GPIO structure, and an ultra-efficient Power-on Reset / Brown-Out Detector, giving designers a tightly integrated SoC rather than a raw MCU. Hardware AES and a true random number generator on related Gecko variants enable secure connected designs at the edge.
Typical applications include battery-powered wireless sensor nodes, energy-harvesting IoT endpoints, BLE/HID peripherals, smart meters, wearables, and any system where standby current must remain below 1 uA while wake-up latency stays under 2 us. The combination of Cortex-M3 throughput and the Gecko peripheral set makes this MCU a strong fit for line-powered industrial control as well.
When designing with this device, place a 100 nF decoupling capacitor within 3 mm of each VDD pin and connect the exposed pad to a solid ground plane to achieve the lowest sleep current. The integrated DC-DC converter requires an external 4.7 uH inductor and 4.7 uF bypass capacitor to operate efficiently above 10 mA loads.
ドロップイン代替品: EFM32G200F64G-E-QFN32R — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EFM32G200F64G-E-QFN32R （同一形状・フットプリント） — 相違点: Core, RAM Size, Supply Voltage (Vcc/Vdd), Connectivity, Core Architecture.
クイック比較ツール — 並列比較する代替部品を選択:
EFM32G200F64G-E-QFN32
✅ ドロップイン✓ 在庫あり
$1.95 / 個
データシートを見る →EFM32G200F64-QFN32
✅ ドロップイン✓ 在庫あり
$1.74 / 個
データシートを見る →EFM32G200F32-QFN32
✅ ドロップイン✓ 在庫あり
$1.05 / 個
データシートを見る →EFM32G200F64G-E-QFN32R 最大定格＆電気的特性
| Core | ARM Cortex-M3 |
| Core Architecture | 32-bit |
| Max Clock Frequency | 32 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 16 KB |
| Supply Voltage (Vcc/Vdd) | 1.98 V to 3.8 V |
| Number of I/O Pins | 24 |
| Timers | 2 x 16-bit |
| AES Hardware Crypto | AES Excluded on this G-grade variant |
| 実装タイプ | Surface Mount |
| 動作温度 | -40 C to +85 C |
| Debug Interface | 2-pin Serial Wire Debug + 1-pin Serial Wire Viewer |
| Bootloader | Pre-programmed USB/UART |
| Power-on Reset / Brown-Out Detector | Ultra-efficient integrated POR/BOD |
| RoHS ステータス | Compliant |
EFM32G200F64G-E-QFN32R ピン構成
| ピン 1 | PA0 — GPIO/Port A pin 0 |
| ピン 2 | PA1 — GPIO/Port A pin 1 |
| ピン 3 | PA2 — GPIO/Port A pin 2 |
| ピン 4 | PA3 — GPIO/Port A pin 3 |
| ピン 5 | PA4 — GPIO/Port A pin 4 |
| ピン 6 | PA5 — GPIO/Port A pin 5 |
| ピン 7 | PA6 — GPIO/Port A pin 6 |
| ピン 8 | PA7 — GPIO/Port A pin 7 |
| ピン 9 | PB0 — GPIO/Port B pin 0 |
| ピン 10 | PB1 — GPIO/Port B pin 1 |
| ピン 11 | PB2 — GPIO/Port B pin 2 |
| ピン 12 | PB3 — GPIO/Port B pin 3 |
| ピン 13 | PB4 — GPIO/Port B pin 4 |
| ピン 14 | PB5 — GPIO/Port B pin 5 |
| ピン 15 | PB6 — GPIO/Port B pin 6 |
| ピン 16 | PB7 — GPIO/Port B pin 7 |
| ピン 17 | VDD — Supply voltage input 1.98-3.8 V |
| ピン 18 | VSS — Ground reference |
| ピン 19 | RESETn — Active-low reset input |
| ピン 20 | SWDIO — Serial Wire Debug data |
| ピン 21 | SWCLK — Serial Wire Debug clock |
| ピン 22 | SWO — Serial Wire Viewer output |
| ピン 23 | PC0 — GPIO/Port C pin 0 |
| ピン 24 | PC1 — GPIO/Port C pin 1 |
| ピン 25 | PC2 — GPIO/Port C pin 2 |
| ピン 26 | PC3 — GPIO/Port C pin 3 |
| ピン 27 | PC4 — GPIO/Port C pin 4 |
| ピン 28 | PC5 — GPIO/Port C pin 5 |
| ピン 29 | PC6 — GPIO/Port C pin 6 |
| ピン 30 | PC7 — GPIO/Port C pin 7 |
| ピン 31 | VDD — Supply voltage input 1.98-3.8 V |
| ピン 32 | VSS — Ground reference |
主な用途
EFM32G200F64G-E-QFN32R の用途: 6 件s: Battery-Powered IoT Sensor Nodes, Smart Energy Metering, Wearable Health Devices, Industrial Control Modules, Connected Lighting and LED Controllers, Human Interface Devices (HID).
Battery-Powered IoT Sensor Nodes
The EFM32G200F64G-E-QFN32R is ideal for IoT sensor nodes requiring multi-year battery life. The Gecko peripheral reflex system wakes the Cortex-M3 core in under 2 microseconds from sub-microamp sleep, while integrated LESENSE hardware scans capacitive, inductive, and analog sensors without CPU intervention. Its 1.98 V to 3.8 V supply range accepts single-cell Li-coin or 2xAA chemistries directly, eliminating boost converters. The 64 KB Flash accommodates Contiki/RIOT stacks or proprietary BLE HID bridges, and 16 KB RAM supports RTOS-driven sensor fusion. With AES Excluded on this G-grade variant, security must be implemented in firmware for sensitive payloads.
おすすめ
Smart Energy Metering
The EFM32G200F64G-E-QFN32R fits smart metering front-ends where metering compute, metrology logging, and low standby current must coexist in one chip. Hardware AES Excluded on G-grade means meter cryptographic signing must be implemented in firmware or offloaded to a companion secure element. The 32 MHz Cortex-M3 core computes RMS, VAR, and THD metering algorithms in real time, while the autonomous PERPREF peripheral block handles zero-cross detection of mains voltage without CPU wake. Dry-run is critical for EN 62053-21 class 0.5/0.2 meters. 24 GPIO pins drive segmented LCD, LED bargraphs, and isolated metrology serial interfaces.
おすすめ
Wearable Health Devices
The EFM32G200F64G-E-QFN32R suits wearable health monitors requiring extended battery life and compact PCB area. The 32-pin QFN (6x6) footprint occupies less than 36 mm², leaving room for Li-coin cells in wrist-worn form factors. Sub-1 uA sleep current with 2 us wake-up time enables heart-rate, SpO2, and accelerometer duty cycles below 0.1%, achieving months of standby. The Cortex-M3 single-cycle MAC computes step-count, fall-detection, and PPG signal processing in firmware. Hardware AES Excluded on this G-grade variant means any health data encryption requires firmware implementation or a companion crypto IC.
おすすめ
Industrial Control Modules
The EFM32G200F64G-E-QFN32R serves industrial control modules needing deterministic NVIC latency for fast-loop PID, encoder counting, and fieldbus bridging. Its 32-bit Cortex-M3 with hardware MAC delivers deterministic 1.25 DMIPS/MHz performance for sensor-fusion compute, while the 16-bit timer set drives PWM at 48 MHz for motor and actuator control. The 5V-tolerant GPIO interfaces directly to industrial sensors and 24 V field I/O with external clamping. Industrial-grade -40 C to +85 C operation covers cabinet-internal deployments. The 64 KB Flash holds fieldbus stacks like Modbus RTU, CANopen, or IO-Link device firmware.
おすすめ
Connected Lighting and LED Controllers
The EFM32G200F64G-E-QFN32R drives connected lighting controllers that combine dimming compute, color-mixing control, and wireless bridging. The 16 KB SRAM handles smooth HSV-to-PWM transition curves and DMX-style frame buffers, while the Cortex-M3's hardware MAC computes CIE color calibration in firmware. The integrated DC-DC converter operates the MCU efficiently across 1.98-3.8 V supplies, accepting 12-24 V mains after buck conversion. Low sleep current under 1 uA lets the controller remain network-attached when the LED string is off. Hardware AES Excluded on G-grade means commissioning security requires alternate stack.
おすすめ
Human Interface Devices (HID)
The EFM32G200F64G-E-QFN32R integrates BLE HID, USB HID, or proprietary RF HID bridges where multi-year coin-cell battery life and USB/UART bootloader drive are required. The 64 KB Flash accommodates Bluetooth Low Energy HID stacks with full descriptor tables, while 16 KB RAM supports HID report buffers and multi-touch gesture processing. Sub-1 uA sleep current enables multi-year coin-cell operation, and the integrated USB/UART bootloader simplifies DFU programming. Hardware AES Excluded on this G-grade variant means BLE pairing security is handled in firmware or offloaded to a companion secure element.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EFM32G200F64G-E-QFN32R — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EFM32G200F64G-E-QFN32 | EFM32G200F64-QFN32 | EFM32G200F32-QFN32 |
|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs - same | Silicon Labs - same | Silicon Labs - same |
| Package | 32-QFN (6x6) | 32-QFN (6x6) - same | 32-QFN (6x6) - same | 32-QFN (6x6) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 - same | ARM Cortex-M3 - same | ARM Cortex-M3 - same |
| Max Clock Frequency | 32 MHz | 32 MHz - same | 32 MHz - same | 32 MHz - same |
| Flash | 64 KB | 64 KB - same | 64 KB - same | 32 KB (-50%) |
| RAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same |
| Supply Voltage | 1.98-3.8 V | 1.98-3.8 V - same | 1.98-3.8 V - same | 1.98-3.8 V - same |
| AES Hardware Crypto | AES Excluded (G-grade) | AES Excluded - same | AES Excluded - same | AES Excluded - same |
| Operating Temperature | -40 to +85 C | -40 to +85 C - same | -40 to +85 C - same | -40 to +85 C - same |
| GPIO Count | 24 | 24 - same | 24 - same | 24 - same |
主な差別化要因
- Tap-and-reel packaging for high-volume SMT （vs EFM32G200F64G-QFN32 (tray))
- Full 64 KB Flash with Rev. E silicon （vs EFM32G200F32-QFN32)
- Rev. E product revision per PCN 170724110 （vs EFM32G200F64-QFN32 (pre-E))
設計ノート
The EFM32G200F64G-E-QFN32R's sub-microamp EM2 sleep current requires careful power-tree design. Place a 100 nF decoupling capacitor within 3 mm of each VDD pin (pins 17 and 31), and connect the QFN exposed pad to a solid ground plane for lowest sleep current. Estimated: at 3.0 V VDD and EM2 sleep, the typical sleep current is 0.9 uA; using a 1 nH or larger capacitor can add 0.3 uA of leakage per decoupling stage. For multi-year coin-cell designs, the design rules in the EFM32G Gecko Family Reference Manual section 11 are mandatory.
The 32-QFN (6x6) package has a thermal resistance (theta_JA) of approximately 65 C/W on a 4-layer JEDEC test PCB. Estimated: at 32 MHz active current draw of 5 mA at 3.0 V, the MCU dissipates 15 mW, yielding a junction-to-ambient temperature rise of under 1 C. Even at maximum 3.8 V and 32 MHz, junction temperature rise stays below 2 C - well within industrial -40 to +85 C operating limits. The exposed thermal pad must be soldered to the ground plane to maintain this low thermal resistance.
Route SWDIO and SWCLK traces with 50 ohm impedance and keep them under 50 mm length to ensure reliable 2-pin Serial Wire Debug operation. Place the SWO trace on a different layer than SWDIO/SWCLK with a ground pour on adjacent layers to avoid crosstalk. Add a 4.7 kohm pull-up on SWDIO and a 4.7 kohm pull-down on SWCLK for production-test stability. Per Silicon Labs reference design AN0003, keep the 32.768 kHz crystal traces within 5 mm of the MCU with a ground guard ring for RTC accuracy.
Do not assume AES Excluded on this G-grade variant means hardware AES is fully disabled at silicon level - G-grade omits the AES accelerator, so firmware encryption is required for security-sensitive payloads. Avoid driving any 5V logic directly into the GPIO unless the IOVDD is set to 3.3 V; the 5V-tolerant GPIO only applies when VDD is at 3.3 V nominal. Always enable the Brown-Out Detector (BOD) in software development for production firmware to prevent undefined execution during supply droops.
コンプライアンス情報
RoHS compliant per Silicon Labs product page. Not AEC-Q100 qualified; this part targets industrial/consumer applications. Halogen-free status not explicitly stated in the verified data; refer to Silicon Labs environmental compliance docs for confirmation.
