EP1AGX20CF780C5N - Arria GX FPGA, 20K LE, 780-BGA | Altera
部品番号: EP1AGX20CF780C5N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
EP1AGX20CF780C5N 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor IC in the programmable logic category that allows hardware designers to implement arbitrary digital logic via a configuration bitstream. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Arria GX family is positioned between the Stratix high-end and Cyclone low-end families, targeting mid-range applications that require embedded transceivers without the power and cost of Stratix-class devices.
Key differentiating specifications include 4 full-duplex 3.125 Gbps transceivers (CPRI/OBSAI/PCI Express compatible), 6 phase-locked loops (PLLs), dedicated 18x18 multipliers for DSP blocks, and 1,229,184 bits (approximately 150 kbytes) of embedded SRAM. The device supports LVDS, LVTTL, LVCMOS, SSTL, HSTL, and differential I/O standards across user I/O banks, providing flexible board-level integration.
Architecturally, the EP1AGX20CF780 uses Altera's logic element (LE) fabric with adaptive logic modules (ALMs), embedded memory blocks (M512/M4K/M-RAM tiers), and DSP blocks for arithmetic-intensive paths. The transceiver physical medium attachment (PMA) and physical coding sublayer (PCS) are hardened for protocol compliance, reducing soft-logic overhead for serial interfaces.
Typical applications include wireless baseband processing, video broadcast equipment, serial protocol bridging (PCI Express x1/x4, Serial RapidIO, Gigabit Ethernet), test and measurement instrumentation, and defense/aerospace signal processing. The 780-ball FineLine BGA package offers a compact footprint for high-density board designs.
When designing with the EP1AGX20CF780C5N, engineers must allocate dedicated transceiver reference clock pins, observe power sequencing for the analog supply rails (VCCA_PLL, VCCA_TX/RX), and configure unused transceiver channels to power-down states. The Altera Quartus II design software (legacy version 7.x/8.x compatible) is required for synthesis, place-and-route, and bitstream generation.
This page consolidates distributor pricing, drop-in same-package alternatives from the Arria GX family (including the EP1AGX20CF780C6N commercial C6 speed-grade and EP1AGX20CF780I6N industrial-temperature variants), and practical design guidance beyond the Altera datasheet.
ドロップイン代替品: EP1AGX20CF780C5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1AGX20CF780C5N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Mounting Type, Operating Temperature, Transceivers.
クイック比較ツール — 並列比較する代替部品を選択:
EP1AGX20CF780C6N
✅ ドロップイン✓ 在庫あり
$38.95 / 個
データシートを見る →EP1AGX20CF780I6N
✅ ドロップイン✓ 在庫あり
$295 / 個
データシートを見る →EP1AGX20CF780C7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP1AGX20CF780C5N 最大定格＆電気的特性
| Family | Arria GX |
| Logic Elements | 21,580 |
| Embedded Memory Bits | 1,229,184 bits (approx. 150 kbyte) |
| Transceivers | 4 channels |
| Transceiver Data Rate | Up to 3.125 Gbps per channel |
| PLLs | 6 |
| Process Technology | 90 nm |
| パッケージ | 780-ball FineLine BGA (FBGA-780) |
| Speed Grade | -5 (C5) |
| 動作温度 | 0C to +85C (commercial) |
| 実装タイプ | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires external config device) |
EP1AGX20CF780C5N 780-ball fineline bga (fbga-780) ピン配置ガイド
EP1AGX20CF780C5N (780-ball fineline bga (fbga-780) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1AGX20CF780C5N.
詳細は データシート をご参照ください。
主な用途
EP1AGX20CF780C5N の用途: 6 件s: Wireless Baseband Processing, Video Broadcast Equipment, PCI Express Endpoint Card, Serial RapidIO Switch Fabric, Test and Measurement Instrumentation, Defense and Aerospace Signal Processing.
Wireless Baseband Processing
The EP1AGX20CF780C5N fits wireless baseband processing because its 21,580 logic elements and embedded 18x18 multipliers handle DSP-intensive channel filtering, FFT/IFFT blocks, and turbo-decoder datapaths. The 4 transceivers at up to 3.125 Gbps support CPRI/OBSAI links between the baseband unit and remote radio head, while 1,229,184 bits of embedded memory buffer symbol-rate data without external SRAM. Compared with a discrete DSP + ASIC approach, the Arria GX integrates DSP blocks, transceivers, and glue logic in one 780-BGA device, shrinking board area. Engineers should budget 1.5x headroom on transceiver PLL jitter for CPRI short-haul links.
おすすめ
Video Broadcast Equipment
The EP1AGX20CF780C5N fits video broadcast applications such as SDI embedder/de-embedder cards, format converters, and multiviewers because its high-speed transceivers carry 3G-SDI/HD-SDI signals at 2.97 Gbps and 1.485 Gbps respectively. The 6 PLLs generate independent video clock domains for input SDI deserialization, internal processing, and output re-serialization. Embedded M4K and M-RAM memory blocks serve as line/frame buffers. Compared with an ASIC-only SDI solution, the FPGA allows field firmware upgrades for new broadcast standards. Engineers should allocate dedicated transceiver reference clock pins per channel to meet SDI jitter specifications.
おすすめ
PCI Express Endpoint Card
The EP1AGX20CF780C5N fits PCI Express Gen1 endpoint cards because its 4 transceivers provide x1/x4 Gen1 (2.5 Gbps) lanes with built-in hard IP, eliminating soft-logic PCIe PHY implementation. The 21,580 logic elements handle protocol stack layers (transaction, data link, plus user application logic) while the 780-ball BGA delivers adequate user I/O for board-edge signaling. Compared with a soft-IP PCIe implementation, the hardened transceiver achieves lower bit-error-rate and faster link-training. Engineers must observe PCIe CEM connector routing and 85-ohm differential impedance.
おすすめ
Serial RapidIO Switch Fabric
The EP1AGX20CF780C5N fits Serial RapidIO (SRIO) switch fabric and DSP-cluster interconnect cards because its 4 transceivers at 3.125 Gbps match SRIO Gen1 lane rates and the hardened PCS simplifies link-layer design. The 1,229,184 bits of embedded memory buffer SRIO packets with deterministic latency, while 6 PLLs provide the multiple clock domains required for switch backplane operation. Compared with an ASIC switch, the FPGA enables custom traffic classes and port mirroring. Engineers should budget SRIO error-management registers in firmware.
おすすめ
Test and Measurement Instrumentation
The EP1AGX20CF780C5N fits test and measurement instruments such as logic analyzers, protocol analyzers, and bit-error-rate testers because its 4 transceivers aggregate up to 12.5 Gbps of input data, while the 21,580 logic elements implement deep pattern-matching, triggering, and statistics counters. The 780-ball BGA provides ample user I/O for front-panel control and backplane connectivity. Compared with discrete FPGA + MCU architectures, integrating in a single Arria GX device reduces measurement latency. Engineers should isolate analog input paths from FPGA digital switching noise with proper ground partitioning.
おすすめ
Defense and Aerospace Signal Processing
The EP1AGX20CF780C5N fits defense and aerospace signal-processing cards such as radar front-end preprocessing, electronic-warfare channelizers, and software-defined radio baseband because its 4 transceivers carry digitized RF data at up to 3.125 Gbps, while 18x18 multipliers and embedded memory implement FFT and pulse-compression datapaths. The industrial-grade variant EP1AGX20CF780I6N extends the temperature range for avionics bays. Compared with custom ASIC solutions, FPGAs shorten program timelines and allow post-deployment algorithm updates. Engineers should review Altera's radiation/SEU mitigation documentation for high-altitude applications.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1AGX20CF780C5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1AGX20CF780C6N | EP1AGX20CF780I6N | EP1AGX20CF780C7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 |
| Embedded Memory | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits |
| Transceivers | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps |
| PLLs | 6 | 6 | 6 | 6 |
| Speed Grade | -5 (C5) | -6 (C6, slower) | -6 (I6, slower, industrial temp) | -7 (C7, slowest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
主な差別化要因
- Faster speed grade than C6N in same 780-BGA footprint （vs EP1AGX20CF780C6N)
- Wider temperature range than commercial C5N （vs EP1AGX20CF780I6N)
- 4 integrated 3.125 Gbps transceivers reduce external PHY cost （vs Cyclone III FPGAs (no transceivers))
設計ノート
Estimated: at typical utilization (60% LEs, 2 active transceivers at 3.125 Gbps), the EP1AGX20CF780C5N draws approximately 4 to 6 W from core VCCINT and 1.5 to 2 W from VCCA_PLL/VCCA_TX/VCCA_RX analog rails. A 6-layer PCB with dedicated power planes and at least 8 decoupling capacitors (0.1 uF X7R per power pin group + bulk 470 uF polymer tantalum) is required to keep supply ripple below 50 mV peak-to-peak.
The 780-ball FineLine BGA has an estimated theta_JA of approximately 12 C/W with a properly designed 6-layer PCB thermal via array under the package. At 6 W total dissipation the junction temperature rises 72C above ambient. For commercial-temperature operation (max 85C ambient), keep total power under 7 W; for industrial applications, use the EP1AGX20CF780I6N variant or attach a heatsink. Without thermal vias, the package can exceed 100 C/W and trigger thermal shutdown.
Place transceiver reference clock generators (e.g., CDCM7005) within 200 mils of the FPGA REFCLK pins and route with 50-ohm controlled impedance and length matching within 20 mils. Use 85-ohm differential routing for transceiver TX/RX pairs with intra-pair length matching within 5 mils. The 780-ball BGA requires a 1.0 mm pitch BGA footprint with 0.5 mm drilled microvias for breakout routing. Do NOT route signals under the BGA; use inner layers for escape.
Common pitfalls: (1) Failing to connect all VCCINT/VCCIO/VCCA power pins - unused balls must still be connected to the appropriate rail; (2) Driving JTAG TCK faster than 10 MHz without series-damping; (3) Using JTAG-based configuration for production (EPCS/EPCQ flash is required for power-cycle bitstream loading); (4) Leaving unused transceiver channels in active state, increasing power by 300 mW per channel - configure unused channels to power-down in the Quartus device configuration file.
コンプライアンス情報
Compliance status not provided in verified web data. Altera Arria GX family is generally lead-free and RoHS compliant per typical Altera product standards, but specific certification documents should be requested from the manufacturer.