EP1AGX20CF780C5N - Arria GX FPGA, 20K LE, 780-BGA | Altera
MPN: EP1AGX20CF780C5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $360 | $36,000.00 |
| 500 | $330 | $165,000.00 |
| 1,000 | $305 | $305,000.00 |
Drop-in alternatives for EP1AGX20CF780C5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX20CF780C6N
✅ Drop-In✓ In Stock
$38.95 / Unit
View Datasheet →EP1AGX20CF780I6N
✅ Drop-In✓ In Stock
$295 / Unit
View Datasheet →EP1AGX20CF780C7N
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
EP1AGX20CF780C5N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 21,580 |
| Embedded Memory Bits | 1,229,184 bits (approx. 150 kbyte) |
| Transceivers | 4 channels |
| Transceiver Data Rate | Up to 3.125 Gbps per channel |
| PLLs | 6 |
| Process Technology | 90 nm |
| Package | 780-ball FineLine BGA (FBGA-780) |
| Speed Grade | -5 (C5) |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount |
| Configuration Memory | SRAM-based (volatile, requires external config device) |
EP1AGX20CF780C5N 780-ball fineline bga (fbga-780) Pin Configuration Guide
Complete pinout information for EP1AGX20CF780C5N (780-ball fineline bga (fbga-780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX20CF780C5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX20CF780C5N is suitable for 6 applications: Wireless Baseband Processing, Video Broadcast Equipment, PCI Express Endpoint Card, Serial RapidIO Switch Fabric, Test and Measurement Instrumentation, Defense and Aerospace Signal Processing.
Wireless Baseband Processing
The EP1AGX20CF780C5N fits wireless baseband processing because its 21,580 logic elements and embedded 18x18 multipliers handle DSP-intensive channel filtering, FFT/IFFT blocks, and turbo-decoder datapaths. The 4 transceivers at up to 3.125 Gbps support CPRI/OBSAI links between the baseband unit and remote radio head, while 1,229,184 bits of embedded memory buffer symbol-rate data without external SRAM. Compared with a discrete DSP + ASIC approach, the Arria GX integrates DSP blocks, transceivers, and glue logic in one 780-BGA device, shrinking board area. Engineers should budget 1.5x headroom on transceiver PLL jitter for CPRI short-haul links.
Recommended
Video Broadcast Equipment
The EP1AGX20CF780C5N fits video broadcast applications such as SDI embedder/de-embedder cards, format converters, and multiviewers because its high-speed transceivers carry 3G-SDI/HD-SDI signals at 2.97 Gbps and 1.485 Gbps respectively. The 6 PLLs generate independent video clock domains for input SDI deserialization, internal processing, and output re-serialization. Embedded M4K and M-RAM memory blocks serve as line/frame buffers. Compared with an ASIC-only SDI solution, the FPGA allows field firmware upgrades for new broadcast standards. Engineers should allocate dedicated transceiver reference clock pins per channel to meet SDI jitter specifications.
Recommended
PCI Express Endpoint Card
The EP1AGX20CF780C5N fits PCI Express Gen1 endpoint cards because its 4 transceivers provide x1/x4 Gen1 (2.5 Gbps) lanes with built-in hard IP, eliminating soft-logic PCIe PHY implementation. The 21,580 logic elements handle protocol stack layers (transaction, data link, plus user application logic) while the 780-ball BGA delivers adequate user I/O for board-edge signaling. Compared with a soft-IP PCIe implementation, the hardened transceiver achieves lower bit-error-rate and faster link-training. Engineers must observe PCIe CEM connector routing and 85-ohm differential impedance.
Recommended
Serial RapidIO Switch Fabric
The EP1AGX20CF780C5N fits Serial RapidIO (SRIO) switch fabric and DSP-cluster interconnect cards because its 4 transceivers at 3.125 Gbps match SRIO Gen1 lane rates and the hardened PCS simplifies link-layer design. The 1,229,184 bits of embedded memory buffer SRIO packets with deterministic latency, while 6 PLLs provide the multiple clock domains required for switch backplane operation. Compared with an ASIC switch, the FPGA enables custom traffic classes and port mirroring. Engineers should budget SRIO error-management registers in firmware.
Recommended
Test and Measurement Instrumentation
The EP1AGX20CF780C5N fits test and measurement instruments such as logic analyzers, protocol analyzers, and bit-error-rate testers because its 4 transceivers aggregate up to 12.5 Gbps of input data, while the 21,580 logic elements implement deep pattern-matching, triggering, and statistics counters. The 780-ball BGA provides ample user I/O for front-panel control and backplane connectivity. Compared with discrete FPGA + MCU architectures, integrating in a single Arria GX device reduces measurement latency. Engineers should isolate analog input paths from FPGA digital switching noise with proper ground partitioning.
Recommended
Defense and Aerospace Signal Processing
The EP1AGX20CF780C5N fits defense and aerospace signal-processing cards such as radar front-end preprocessing, electronic-warfare channelizers, and software-defined radio baseband because its 4 transceivers carry digitized RF data at up to 3.125 Gbps, while 18x18 multipliers and embedded memory implement FFT and pulse-compression datapaths. The industrial-grade variant EP1AGX20CF780I6N extends the temperature range for avionics bays. Compared with custom ASIC solutions, FPGAs shorten program timelines and allow post-deployment algorithm updates. Engineers should review Altera's radiation/SEU mitigation documentation for high-altitude applications.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX20CF780C5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX20CF780C6N | EP1AGX20CF780I6N | EP1AGX20CF780C7N |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 |
| Embedded Memory | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits |
| Transceivers | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps |
| PLLs | 6 | 6 | 6 | 6 |
| Speed Grade | -5 (C5) | -6 (C6, slower) | -6 (I6, slower, industrial temp) | -7 (C7, slowest) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
Key Differentiators
- Faster speed grade than C6N in same 780-BGA footprint (vs EP1AGX20CF780C6N)
- Wider temperature range than commercial C5N (vs EP1AGX20CF780I6N)
- 4 integrated 3.125 Gbps transceivers reduce external PHY cost (vs Cyclone III FPGAs (no transceivers))
Design Notes
Estimated: at typical utilization (60% LEs, 2 active transceivers at 3.125 Gbps), the EP1AGX20CF780C5N draws approximately 4 to 6 W from core VCCINT and 1.5 to 2 W from VCCA_PLL/VCCA_TX/VCCA_RX analog rails. A 6-layer PCB with dedicated power planes and at least 8 decoupling capacitors (0.1 uF X7R per power pin group + bulk 470 uF polymer tantalum) is required to keep supply ripple below 50 mV peak-to-peak.
The 780-ball FineLine BGA has an estimated theta_JA of approximately 12 C/W with a properly designed 6-layer PCB thermal via array under the package. At 6 W total dissipation the junction temperature rises 72C above ambient. For commercial-temperature operation (max 85C ambient), keep total power under 7 W; for industrial applications, use the EP1AGX20CF780I6N variant or attach a heatsink. Without thermal vias, the package can exceed 100 C/W and trigger thermal shutdown.
Place transceiver reference clock generators (e.g., CDCM7005) within 200 mils of the FPGA REFCLK pins and route with 50-ohm controlled impedance and length matching within 20 mils. Use 85-ohm differential routing for transceiver TX/RX pairs with intra-pair length matching within 5 mils. The 780-ball BGA requires a 1.0 mm pitch BGA footprint with 0.5 mm drilled microvias for breakout routing. Do NOT route signals under the BGA; use inner layers for escape.
Common pitfalls: (1) Failing to connect all VCCINT/VCCIO/VCCA power pins - unused balls must still be connected to the appropriate rail; (2) Driving JTAG TCK faster than 10 MHz without series-damping; (3) Using JTAG-based configuration for production (EPCS/EPCQ flash is required for power-cycle bitstream loading); (4) Leaving unused transceiver channels in active state, increasing power by 300 mW per channel - configure unused channels to power-down in the Quartus device configuration file.
Compliance Information
Compliance status not provided in verified web data. Altera Arria GX family is generally lead-free and RoHS compliant per typical Altera product standards, but specific certification documents should be requested from the manufacturer.
