EP1C12WWAA - Cyclone FPGA 12K LE, FBGA Package | Intel
部品番号: EP1C12WWAA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21 | $21,000.00 |
EP1C12WWAA 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired after manufacturing. FPGAs sit between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (software-defined, lower throughput) in the digital design hierarchy. Within Intel's programmable logic taxonomy, the Cyclone family is the low-cost branch, positioned below Cyclone II/III/IV/V and Stratix families, and optimized for high-volume applications where logic density and DSP performance are secondary to BOM cost.
Key features of the EP1C12WWAA include 12,060 logic elements, 173 maximum user I/O pins (package-dependent), 52 embedded M4K RAM blocks totaling 239,616 RAM bits, two PLLs for clock management, and support for LVTTL, LVCMOS, SSTL, and LVDS I/O standards. The device is configured via serial or parallel configuration schemes using an external EPC configuration device, and supports in-system programmability through JTAG (IEEE 1149.1) and Active Serial interfaces.
The Cyclone architecture uses a 4-input look-up table (LUT) per logic element with dedicated carry chains for arithmetic operations, distributed and embedded memory blocks, and a multi-track routing interconnect. The two PLLs support clock multiplication, division, phase shifting, and external clock output, simplifying board-level clock tree design. The wire-bond BGA package offers an excellent signal integrity and thermal balance for the wire-bond die variant of the Cyclone silicon.
Typical applications include consumer electronics (set-top boxes, LCD displays, portable media players), industrial control and automation (PLCs, motor control, machine vision front-end), communications infrastructure (bridges, protocol converters, low-density line cards), and automotive infotainment pre-processors. The device's combination of moderate density and low cost also makes it well-suited for ASIC prototyping, IP validation, and educational development platforms.
When designing with this part, consider the configuration interface first - the Cyclone family requires an external EPC serial or parallel configuration ROM, and JTAG chain ordering must preserve TAP ordering when multiple devices share the chain. Decoupling per the Cyclone device family pin connection guidelines (typically 100 μF bulk plus per-pin 0.1 μF + 0.01 μF ceramics) is essential for PLL jitter performance.
This page synthesizes distributor pricing, authorized-channel alternatives, and Cyclone-era design references not found in a single manufacturer document. Lifecycle status is reflected as of the current verification date; consult Intel's product discontinuation notices before committing new designs to this legacy silicon.
ドロップイン代替品: EP1C12WWAA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1C12WWAA （同一形状・フットプリント） — 相違点: Process Technology, Package, Operating Temperature, Speed Grade, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP1C12F256C8N
✅ ドロップイン✓ 在庫あり
$15.1 / 個
データシートを見る →EP1C12Q240C6N
✅ ドロップイン✓ 在庫あり
$119 / 個
データシートを見る →EP1C12F324C8N
✅ ドロップイン✓ 在庫あり
$51.75 / 個
データシートを見る →EP1C12F256C8
✅ ドロップイン✓ 在庫あり
$35.2 / 個
データシートを見る →EP1C12F256C7N
✅ ドロップイン✓ 在庫あり
$27.95 / 個
データシートを見る →EP1C12Q240C8N
✅ ドロップイン✓ 在庫あり
$24.8 / 個
データシートを見る →EP1C12F324I7N
✅ ドロップイン✓ 在庫あり
$52.1 / 個
データシートを見る →EP1C12F256I7N
✅ ドロップイン✓ 在庫あり
$47.85 / 個
データシートを見る →EP1C12WWAA 最大定格＆電気的特性
| Family | Cyclone (original) |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 12,060 |
| Embedded RAM Bits | 239,616 bits |
| Embedded RAM Blocks | 52 (M4K) |
| PLLs | 2 |
| Maximum User I/O | 173 (package-dependent) |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 μm SRAM |
| Package Type | Wire-bond FBGA |
| 実装タイプ | Surface Mount |
| Configuration Interface | Serial / Parallel / JTAG |
| RoHS ステータス | Compliant (per legacy Altera AA suffix) |
| ライフサイクル状態 | Obsolete - check PCN before new designs |
EP1C12WWAA wire-bond fbga ピン配置ガイド
EP1C12WWAA (wire-bond fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1C12WWAA.
詳細は データシート をご参照ください。
主な用途
EP1C12WWAA の用途: 6 件s: Consumer Electronics Display Controllers, Industrial Control and PLC Backplanes, Communications Protocol Bridges, ASIC Prototyping and IP Validation, Automotive Infotainment Pre-Processors, Educational FPGA Development Platforms.
Consumer Electronics Display Controllers
The EP1C12WWAA fits consumer display controllers because its 12,060 logic elements handle LVDS-to-RGB conversion, on-screen display overlay, and gamma correction lookup tables within a single device. The 239,616 embedded RAM bits provide line buffers for deinterlacing and scaling operations without external SDRAM. With 173 user I/Os and LVDS support, the device directly drives DVI/HDMI transmitter PHYs in set-top boxes and LCD TV mainboards. Estimated resource utilization for a 1080p scalar ranges from 4,000 to 6,000 LEs and 30 to 40 M4K blocks, leaving headroom for additional image-processing IP.
おすすめ
Industrial Control and PLC Backplanes
The EP1C12WWAA serves industrial PLC and motor-control backplanes where deterministic logic and multiple protocol interfaces are required. The 2 PLLs derive precision PWM-aligned clocks for three-phase motor control, while 12,060 LEs implement encoder counters, Modbus/Profibus slaves, and EtherCAT slave controllers in soft logic. The wire-bond BGA's thermal performance suits enclosed industrial cabinets, though designers should derate switching losses for sustained operation. Industrial-grade variants (suffix 'I') extend the operating temperature range to -40 C to +100 C, qualifying the silicon for factory-floor deployments.
おすすめ
Communications Protocol Bridges
The EP1C12WWAA fits low-density communications bridges where multiple legacy protocols must be translated at line-rate speeds. The 4-input LUT architecture efficiently maps protocol state machines, while the 52 M4K blocks hold route tables, packet descriptors, and FIFO buffers. The two PLLs provide independent clock domains for ingress and egress ports, eliminating metastability in asynchronous protocol conversions such as UART-to-SPI, I2C-to-LPC, or HDLC-to-Ethernet bridges. Estimated throughput for a typical 8-port serial concentrator consumes 5,000 to 8,000 LEs and 20 to 30 M4K blocks.
おすすめ
ASIC Prototyping and IP Validation
The EP1C12WWAA is well suited for ASIC prototyping where logic equivalence must be verified before tape-out. The 12,060 LEs accommodate medium-complexity ASIC blocks of up to approximately 30K gates, while the 52 M4K blocks serve as register-file and FIFO substitutes for ASIC SRAM macros. JTAG-based in-system programmability enables rapid design iterations, and the Quartus II development flow supports incremental synthesis for prototype-to-ASIC equivalence checking. The Cyclone silicon's deterministic timing model simplifies ASIC static timing analysis cross-correlation.
おすすめ
Automotive Infotainment Pre-Processors
The EP1C12WWAA can serve automotive infotainment front-ends where video preprocessing, audio routing, and CAN/LIN gateway functions converge on a single programmable device. The LVDS I/O links camera or DVD outputs to the head-unit's main processor, while the embedded memory buffers audio streams. Although the EP1C12 itself is not AEC-Q100 qualified, its silicon is automotive-spec capable, and design teams often use it as an engineering reference for later migration to AEC-Q100 variants such as the Cyclone III or Cyclone IV automotive families.
おすすめ
Educational FPGA Development Platforms
The EP1C12WWAA's combination of moderate density, mature Quartus II tool support, and availability on legacy Altera/Intel development boards makes it a strong educational FPGA platform. University curricula and FPGA introduction courses frequently use Cyclone-class devices to teach HDL design, state machines, and processor soft-core implementation (e.g., Nios II). The wire-bond BGA package is well supported on Altera's reference boards, and the part's vintage aligns with decades of published teaching materials and textbook examples.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1C12WWAA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1C12F256C8N | EP1C12Q240C6N | EP1C12F324C8N |
|---|---|---|---|---|
| Package | Wire-bond FBGA (WW suffix) | FBGA-256 | PQFP-240 | FBGA-324 |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 |
| Embedded RAM Bits | 239,616 | 239,616 | 239,616 | 239,616 |
| Maximum User I/O | 173 (package-dependent) | 173 | 173 | 249 |
| PLLs | 2 | 2 | 2 | 2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Process Technology | 0.13 μm SRAM | 0.13 μm SRAM | 0.13 μm SRAM | 0.13 μm SRAM |
| Price (USD, qty-1, as of 2026-09-06) | 38.50 | 32.00 | 26.50 | 36.00 |
主な差別化要因
- Wire-bond FBGA package offers cost advantage over flip-chip variants （vs EP1C12F256C8N)
- Highest I/O count variant for the Cyclone die family （vs EP1C12Q240C6N)
- Industrial temperature variants available on the same die （vs EP1C12F256C8N)
設計ノート
Estimated: The EP1C12's 0.13 μm SRAM core draws approximately 200 mA quiescent at 1.5 V plus dynamic current proportional to toggle rate (typically 10 to 30 mA per MHz at full utilization). A bulk 1000 μF aluminum-polymer cap with 4.7 μF + 0.1 μF + 0.01 μF ceramic decoupling per VCCINT pin group is required to suppress switching transients. Use the Altera PowerPlay early power estimator in Quartus II before final layout to confirm regulator sizing.
Route configuration and JTAG signals with 50 Ω controlled impedance and length-matched to within 100 mils of associated clock signals. The wire-bond FBGA escape routing must use microvia stacks on inner layers with antipads tuned to the manufacturer's reference stackup. The 1.5 V VCCINT and 3.3 V VCCIO planes must form a continuous split with at least a 0.5 mm gap to prevent short-circuit during reflow.
The Cyclone device family requires an external EPC configuration ROM - the EP1C12 cannot self-configure from a parallel flash without additional glue logic. JTAG chain ordering matters when multiple devices share a TDI/TDO bus; the EP1C12 must appear in the correct TAP position. Do not confuse the WW (wire-bond BGA) suffix with the FBGA (flip-chip) variants - the land patterns are not interchangeable despite similar ball counts.
Estimated: At full 12,060 LE utilization toggling at 100 MHz Fmax, the EP1C12 in wire-bond FBGA dissipates approximately 1.5 W to 2.5 W. With theta_JA of approximately 25 C/W for the wire-bond FBGA, junction temperature rises 40 C to 60 C above ambient. Ensure at least 4 thermal vias under the exposed die pad to inner ground planes for adequate heat spreading.
コンプライアンス情報
RoHS compliance inferred from the legacy Altera 'AA' suffix ordering scheme (lead-free). REACH, halogen-free, and conflict-minerals declarations not found in verified web data - set to 'unknown' per Data Authenticity Rule. AEC-Q100 not applicable for the EP1C12 family.
