EP1C12F324I7N - Cyclone FPGA 12,060 LE 324-FBGA | Intel | Industrial
部品番号: EP1C12F324I7N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
EP1C12F324I7N 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated block RAM, DSP, and I/O resources. Architecturally, an FPGA sits between a microcontroller (fixed-function, sequential execution) and an ASIC (custom-fabricated, fixed function), offering hardware-level parallelism with the flexibility of in-field re-programmability. The Cyclone family is positioned as the low-cost branch of the Intel/Altera FPGA portfolio, optimized for cost-sensitive volume applications such as industrial control, video processing, and communications bridging.
Key features include 12,060 logic elements organized as logic array blocks (LABs), 52 embedded M4K memory blocks totaling 239,616 RAM bits (about 29 KBytes of dedicated block RAM), up to two PLLs for clock management, and a maximum operating frequency in the 250-320 MHz range depending on design. The device is configured via a serial configuration device and supports JTAG boundary-scan testing. The 324-ball FBGA package uses a 1.0 mm ball pitch and is approximately 19 x 19 mm, requiring standard JEDEC JEDEC-MS-034-compliant PCB land patterns.
Typical applications include industrial motor control, video surveillance and image processing, automotive infotainment prototyping, telecom line cards, and low-cost DSP front-ends. The 249 user I/Os are sufficient to interface directly to DDR SDRAM, parallel video buses, and multiple LVDS channels. The Cyclone architecture is well supported by the Quartus II / Quartus Prime design toolchain, including the Qsys system integration tool and the Nios II soft-core processor for embedded CPU subsystems.
When designing with this device, ensure the PCB land pattern follows JEDEC MS-034 for the 324-ball FBGA, and that decoupling capacitors are placed as close as practical to each power pin group. The industrial temperature grade (-40C to +100C) makes this part suitable for outdoor enclosures, factory automation, and other harsh-environment deployments. Verify configuration mode selection (AS, PS, JTAG) matches your chosen EPCS serial configuration device.
This page synthesizes distributor pricing, drop-in Cyclone family alternatives, and practical design considerations that are not collated in any single manufacturer datasheet, helping engineers shorten the sourcing and qualification cycle for Cyclone I based designs.
ドロップイン代替品: EP1C12F324I7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1C12F324I7N （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP1C12F324C8N
✅ ドロップイン✓ 在庫あり
$51.75 / 個
データシートを見る →EP1C12F324I7
✅ ドロップイン✓ 在庫あり
$52.1 / 個
データシートを見る →EP1C12F324C7N
✅ ドロップイン✓ 在庫あり
$37.2 / 個
データシートを見る →EP1C12F324C6N
✅ ドロップイン✓ 在庫あり
$22.1 / 個
データシートを見る →EP1C12F324C8NGA
✅ ドロップイン✓ 在庫あり
$22.95 / 個
データシートを見る →EP1C12F324C8
✅ ドロップイン✓ 在庫あり
$21.5 / 個
データシートを見る →EP1C12F324C7
✅ ドロップイン✓ 在庫あり
$40.26 / 個
データシートを見る →EP1C12F324C6AA
✅ ドロップイン✓ 在庫あり
$36.9 / 個
データシートを見る →EP1C12F324I7N 最大定格＆電気的特性
| Family | Cyclone I |
| Logic Elements (LE) | 12,060 |
| Total RAM Bits | 239,616 |
| Embedded Memory Blocks | 52 x M4K (4,608 bits each) |
| User I/O Count | 249 |
| PLLs | 2 |
| Global Clocks | 8 |
| Process Technology | 130 nm |
| Core Voltage | 1.5 V (typ) |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, HSTL |
| 動作温度 | -40C to +100C (Industrial) |
| パッケージ | 324-ball FBGA (FineLine BGA) |
| Package Code Suffix | F324 |
| Speed Grade | 7 (industrial, performance) |
EP1C12F324I7N f324 ピン配置ガイド
EP1C12F324I7N (f324 パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1C12F324I7N.
詳細は データシート をご参照ください。
主な用途
EP1C12F324I7N の用途: 7 件s: Industrial Motor Control, Video Surveillance and Image Processing, Telecom Line Card Bridging, Automotive Infotainment Prototyping, Low-Cost DSP Front-End, Print Engine Controller, Test and Measurement Front-End.
Industrial Motor Control
The EP1C12F324I7N is well suited to multi-axis industrial motor drives, where its 12,060 logic elements handle encoder decoding, PWM generation, and field-oriented control (FOC) state machines while leaving headroom for safety logic. The 249 user I/Os permit direct interfacing to multiple quadrature encoders, resolver-to-digital converters, and gate-driver ICs without external muxing. Two on-chip PLLs synthesize motor-control frequencies from a single external crystal, eliminating discrete timing components. The industrial -40C to +100C temperature grade tolerates factory-floor ambient swings, and the 324-ball FBGA's thermal pad enables conduction-cooling attach to a chassis heatsink for sustained high-utilization workloads.
おすすめ
Video Surveillance and Image Processing
The EP1C12F324I7N's 12,060 LEs and 52 M4K block RAM blocks provide the parallelism needed for real-time video preprocessing tasks such as Bayer demosaicing, motion detection, and JPEG/MJPEG compression at CIF/D1 resolutions. The 249 user I/Os accept parallel ITU-R BT.656 video buses and LVDS channels from megapixel CMOS sensors, while the on-chip block RAM serves as line buffers without requiring external SDRAM for low-resolution streams. The industrial temperature grade supports outdoor IP-camera deployments. Compared with microcontrollers, the FPGA delivers 5-10x throughput on per-pixel pipelines, and it is well supported by the Quartus II DSP Builder flow for color-space conversion.
おすすめ
Telecom Line Card Bridging
The EP1C12F324I7N is frequently deployed on legacy telecom line cards for protocol bridging between E1/T1 framers, HDLC controllers, and backplane SERDES. Its 12,060 LEs absorb hundreds of state-machine cells and parallel datapath registers, while 249 user I/Os handle TDM bus fan-out without external buffers. Two PLLs synthesize 1.544/2.048/4.096/8.192 MHz clock domains required for T1/E1/ISDN-PRI interfaces. The industrial temperature rating is appropriate for central-office and outdoor-cabinet deployments. For new designs, the Cyclone IV E family offers lower 1.2 V core operation and longer product life, but the existing Cyclone I ecosystem keeps the EP1C12 in service for legacy upgrades.
おすすめ
Automotive Infotainment Prototyping
The EP1C12F324I7N supports rapid prototyping of automotive infotainment systems including CAN/LIN gateway logic, audio routing, and display controllers. Its 12,060 LEs are sufficient for soft IP cores such as the Nios II embedded processor running AUTOSAR-classic stacks, plus CAN 2.0B controllers and I2S audio bridges. The 249 user I/Os are enough to fan out to multiple CAN transceivers, MOST or LVDS display interfaces, and PCM audio codecs. Industrial temperature grade covers cabin environments, but engine-bay applications require AEC-Q100 qualified variants. Engineers moving to production should migrate to Cyclone IV or Cyclone V Auto grade parts for AEC-Q100 conformance and longer supply.
おすすめ
Low-Cost DSP Front-End
The EP1C12F324I7N functions as a low-cost DSP front-end for instrumentation, software-defined radio (SDR) baseband, and ultrasonic flow-meter designs. Although Cyclone I lacks hard DSP blocks, the FPGA's parallel LE fabric implements multiplier-accumulator arrays efficiently at audio and low-IF sample rates. The 249 user I/Os connect directly to 16-bit ADCs such as the AD7606 and high-speed DACs without external logic. Two PLLs derive ADC sampling clocks and DAC update clocks from a single reference. Block RAM serves as FIFO buffering between ADC bursts and downstream processor. For higher DSP throughput, upgrade to Cyclone IV E or Cyclone V with dedicated DSP blocks.
おすすめ
Print Engine Controller
The EP1C12F324I7N serves as the print-engine controller in commercial and industrial printers, driving stepper motors, laser-beam polygon mirrors, and high-speed serializer-deserializer channels to print heads. Its 249 user I/Os support multiple motors and high-resolution data lanes, while the 12,060 LEs absorb page-description-language (PDL) interpreters and raster image processors for moderate page-per-minute rates. Two PLLs synthesize the polygon-motor reference clock and the high-frequency LVDS clocking for the print head. Industrial temperature rating covers the elevated ambient inside printer enclosures. For higher-volume throughput, migrate to Cyclone IV E with more block RAM and DSP blocks.
おすすめ
Test and Measurement Front-End
The EP1C12F324I7N's 249 user I/Os and 12,060 LEs make it a flexible front-end for test and measurement instruments such as logic analyzers, protocol analyzers, and arbitrary waveform generators. Its logic-array block fabric allows engineers to instantiate custom capture macros for SPI, I2C, UART, and parallel buses without dedicated peripherals. The on-chip block RAM stores captured traces before uploading to host PC via USB or Ethernet bridge. Two PLLs synthesize multiple test-clock domains from a single reference. Industrial temperature grade supports benchtop and laboratory deployment. For multi-GHz analysis, migrate to Cyclone V or Cyclone 10 with transceivers.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1C12F324I7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1C12F324C8N | EP1C12F324I7 | EP1C12F324C7N | EP1C12F324C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball FBGA (F324) | 324-ball FBGA (F324) - same | 324-ball FBGA (F324) - same | 324-ball FBGA (F324) - same | 324-ball FBGA (F324) - same |
| Logic Elements | 12,060 | 12,060 (same) | 12,060 (same) | 12,060 (same) | 12,060 (same) |
| Total RAM Bits | 239,616 | 239,616 (same) | 239,616 (same) | 239,616 (same) | 239,616 (same) |
| User I/O Count | 249 | 249 (same) | 249 (same) | 249 (same) | 249 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 7 | 8 | 7 | 7 | 6 |
| Pb-Free (N suffix) | Yes | Yes | No | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
| Process Technology | 130 nm | 130 nm (same) | 130 nm (same) | 130 nm (same) | 130 nm (same) |
主な差別化要因
- Industrial temperature grade for harsh environments （vs EP1C12F324C8N)
- Speed grade 7 balances fMAX and power （vs EP1C12F324C6N)
- Lead-free (Pb-free) N-suffix for RoHS markets （vs EP1C12F324C8)
- 249 user I/Os maximize peripheral integration （vs EP1C12F256I7N)
設計ノート
The 324-ball FBGA package has a thermal resistance theta_JA of approximately 16-19 C/W with a standard 4-layer JEDEC PCB and adequate thermal via array under the die flag. At maximum toggle rate (all 12,060 LEs active at 320 MHz), worst-case power dissipation is roughly 1.5-2 W. For enclosed industrial enclosures with ambient up to +85C, conduction-cooling to a chassis heatsink via thermal pad is recommended. Reference the Cyclone Device Handbook, chapter on packaging and thermal characteristics, for theta_JC and recommended PCB via patterns.
The 324-ball FBGA uses 1.0 mm ball pitch and a JEDEC MS-034 compliant land pattern with 0.55 mm pad diameter. A 4-layer PCB with continuous VCCINT/GND planes directly under the BGA and a 5x5 thermal-via array (0.3 mm drill, 1.0 mm pitch) below the die flag is required. Route all signal traces on outer layers with microvia-in-pad escape routing for inner-row balls. Reference Cyclone Handbook chapter on PCB layout and Quartus II pin planner to optimize pin assignment before layout.
Configuration mode selection (AS, PS, JTAG) must match the chosen EPCS serial configuration device; mismatched MSEL pins lock the FPGA into an unknown state at power-up. The 1.5 V VCCINT and 3.3 V VCCIO banks require separate power rails with independent 0.1 uF + 10 uF decoupling per pin group. Do not leave JTAG TCK floating during normal operation - tie to GND through 1 kohm to prevent spurious configuration. LVDS inputs require 100 ohm termination across the pair. Cyclone I has no on-chip termination, so external resistor networks are mandatory.
Cyclone I PLL analog supply (VCCA_P3L) must be filtered through a ferrite bead and decoupled with 10 uF + 0.1 uF close to the PLL pin; noise on VCCA causes jitter degradation. The 8 global clock inputs are on dedicated pins - assign high-fanout clocks to these pins during pin planning. DDR interfaces require manual 90-degree phase shifting via PLL outputs; Quartus II altmemphy IP supports this with manual calibration. Reference Cyclone Device Handbook chapter on PLL usage and clock network.
Estimated: with 249 user I/Os on a 19x19 mm FBGA, average pin-to-pin spacing is approximately 0.85 mm. Trace impedance of 50 ohm single-ended (microstrip on FR-4 with 4-mil dielectric) is achievable; for LVDS use 100 ohm differential. For toggle rates above 100 MHz, use the Quartus II Signal Integrity analysis to identify over-driven or under-terminated nets before sign-off. SSO (Simultaneous Switching Output) noise on banks of >16 switching outputs requires de-population of those banks to limit ground bounce.
コンプライアンス情報
Pb-free N-suffix denotes RoHS compliance. Not AEC-Q100 qualified - for engine-bay automotive, choose AEC-Q100 qualified Cyclone IV Auto or Cyclone V Auto grade parts. Halogen-free status not stated in datasheet snippet; verify with Intel product compliance team.
