Intel

EP1C12F256C8 - Cyclone FPGA, 12,060 LEs, 256-BGA | Intel

部品番号: EP1C12F256C8 ✓ 生産中
在庫あり 1〜3営業日以内に発送
1.5 V Vdss 256-BGA (FBGA) Package 239,616 Memory
開始価格 $35.2 USD / 個
MOQ: 1 |
価格更新日: 2026-09-06
ボリューム価格
数量 単価 小計
1 $48.6 $48.60
10 $45.2 $452.00
100 $41.85 $4,185.00
500 $38.5 $19,250.00
1,000 $35.2 $35,200.00
ℹ️ すべての価格はUSDです

EP1C12F256C8 概要

The Intel (formerly Altera) EP1C12F256C8 is a Cyclone-family Field Programmable Gate Array (FPGA) housed in a 256-ball FineLine BGA (FBGA) package, delivering 12,060 logic elements, 239,616 RAM bits, and 185 user I/O pins in a low-cost SRAM-based architecture. The part integrates up to two PLLs and supports configuration via passive serial, active serial, or JTAG modes. The device operates from a 1.5 V core with 3.3 V I/O support.

An FPGA (Field Programmable Gate Array) is a class of programmable logic device whose logic fabric, interconnect, and I/O behaviour can be reconfigured after manufacture, making it the workhorse of digital prototyping, hardware acceleration, glue logic, and high-volume programmable SOC prototyping. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as the three major programmable-logic families; the Cyclone family is Altera's (now Intel FPGA's) low-cost, high-volume branch, optimized for price-sensitive designs where the highest-speed transceivers of Stratix are not required.

Key features include 12,060 logic elements, 239,616 bits of embedded RAM distributed across 52 M4K blocks (4,608 bits each plus 576 parity bits), 185 user I/O pins spread across multiple I/O banks, and two PLLs for clock synthesis and skew management. The 256-pin FBGA package supports surface-mount assembly, with the 'F' suffix denoting the FBGA ball pattern and the trailing 'C8' indicating the commercial 0 to 85°C temperature grade.

The Cyclone architecture uses a four-input look-up table (LUT4) as the basic logic element, with embedded multiplier support and dedicated DDR SDRAM / FCRAM interface circuitry. Embedded RAM blocks support true dual-port, simple dual-port, and single-port modes with configurable aspect ratios, enabling efficient implementation of FIFOs, shift registers, and lookup-table based DSP functions.

Typical applications include industrial control and machine vision, communications bridges, video processing pipelines, embedded processor prototyping, motor control and robotics, and consumer electronics requiring programmable logic. The Cyclone I family is especially common in education and legacy systems where a low-cost, widely-supported device is preferred over newer families.

When designing with the EP1C12F256C8, ensure the Quartus II design software (web edition or subscription) supports the EP1C12 device variant and that the bank-voltage supply rails match the I/O standard selected for each bank. Decoupling and bank sequencing are critical - consult the Cyclone Device Handbook for bank-specific power requirements.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the standalone manufacturer datasheet.

ドロップイン代替品: EP1C12F256C8 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。

このシリーズのバリエーション

同一シリーズでドロップイン互換のモデル: EP1C12F256C8 (同一形状・フットプリント) — 相違点: Process Technology, Family, Package, Speed Grade, Operating Temperature.

Intel
Process Technology: 130 nm SRAM, 1.5 V core
Package: 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
Speed Grade: C6 (mid-tier)
比較対象 EP1C12F256C8 →
Altera
Process Technology: 0.13 µm SRAM
Family: Cyclone FPGA
Package: 256-ball FineLine BGA (17 mm x 17 mm)
比較対象 EP1C12F256C8 →
Intel
Process Technology: 0.13 µm SRAM
Family: Cyclone®
Package: 256-ball FBGA (F256)
比較対象 EP1C12F256C8 →
Intel
Process Technology: 130 nm
Family: Cyclone I (EP1C12)
Package: 256-ball FineLine BGA (FBGA-256)
比較対象 EP1C12F256C8 →
Altera
Process Technology: 130 nm CMOS
Family: Cyclone
Package: 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch
比較対象 EP1C12F256C8 →
Altera
Process Technology: 0.13-µm, all-layer copper SRAM
Package: 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch
Speed Grade: C8 (commercial, -8)
比較対象 EP1C12F256C8 →
Intel
Process Technology: 130 nm
Family: Cyclone (1st generation)
Package: 256-ball FBGA (FineLine BGA)
比較対象 EP1C12F256C8 →
Intel
Process Technology: 0.13 μm SRAM
Family: Cyclone (original)
比較対象 EP1C12F256C8 →

クイック比較ツール — 並列比較する代替部品を選択:

EP1C12F256C8N

✅ ドロップイン
Altera
📦 256-FBGA
Cyclone I · 12,060 · 239,616 bits · 52 M4K (4,608 bits each) · 185 · 2 · 256-ball FBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch · 1.5 V

✓ 在庫あり

$15.1 / 個

データシートを見る →

EP1C12F256C7N

✅ ドロップイン
Altera
📦 256-FBGA
Cyclone · Cyclone I · 12060 · 12060 · 239616 · 185 · 1206 · 52

✓ 在庫あり

$27.95 / 個

データシートを見る →

EP1C12F256C7

✅ ドロップイン
Intel
📦 256-FBGA
Cyclone · Cyclone I (EP1C12) · 12,060 · 1,206 · 239,616 · 52 · 185 · 4

✓ 在庫あり

$46.3 / 個

データシートを見る →

EP1C12F256C6N

✅ ドロップイン
Intel
📦 256-FBGA
Cyclone® · 12,060 · 1,206 · 239,616 bits · 52 · Yes · 2 · 185

✓ 在庫あり

$51.9 / 個

データシートを見る →

EP1C12F256C6

✅ ドロップイン
Intel
📦 256-FBGA
Cyclone I · 12,060 · 1,206 · 239,616 bits (52 M4K blocks) · 17 · 185 · 2 · 130 nm SRAM, 1.5 V core

✓ 在庫あり

$48.29 / 個

データシートを見る →

EP1C12F256C6AA

✅ ドロップイン
Altera
📦 256-FBGA
Cyclone · Cyclone FPGA · 12,060 · 239,616 · 185 · 2

✓ 在庫あり

$21.4 / 個

データシートを見る →

EP1C12F256C8 最大定格&電気的特性

Series Cyclone
Family Cyclone I
Logic Elements (LE) 12,060
Total RAM Bits 239,616
Number of LABs/CLBs 1,206
Number of Logic Elements/Cells 12,060
Number of I/O 185
Number of PLLs 2
Total Memory Bits 239,616
パッケージ / ケース 256-BGA (FBGA)
実装タイプ Surface Mount
動作温度 0°C to +85°C (commercial grade)
Core Voltage 1.5 V
I/O Voltage Range 1.5 V to 3.3 V
Supplier Device Package 256-FBGA (17x17 mm)
Process Technology 130 nm SRAM
Configuration Method Passive Serial / Active Serial / JTAG

EP1C12F256C8 256-fbga (17x17 mm) ピン配置ガイド

EP1C12F256C8 (256-fbga (17x17 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。

EP1C12F256C8 の 256-fbga (17x17 mm) パッケージピン配置図

詳細なピン配置データはありません: EP1C12F256C8.

詳細は データシート をご参照ください。

主な用途

EP1C12F256C8 の用途: 6 件s: Industrial Motor Control, Machine Vision and Video Bridging, Communications Bridge and Protocol Conversion, Embedded Processor Prototyping and Education, Consumer Electronics Glue Logic, Legacy Industrial PLC and Test Equipment.

🏭

Industrial Motor Control

The EP1C12F256C8's 12,060 logic elements and 52 M4K RAM blocks deliver enough headroom to implement field-oriented control (FOC), PWM generation, and encoder interfaces for multi-axis industrial motor drives. The 185 user I/O pins in the 256-FBGA package accommodate three-phase gate-drive signals, Hall/quadrature encoder inputs, current-sense ADCs, and CAN or RS-485 communications without external logic expanders. According to the Cyclone Device Handbook, the two on-chip PLLs synthesize the high-resolution PWM carrier and resolver excitation frequencies from a single 50 MHz crystal, and the commercial 0-85°C junction range fits most factory-cabinet environments. Verified cross-reference data confirms that the EP1C12F256C7N is a drop-in substitute for designs needing longer lead-time flexibility.

🎥

Machine Vision and Video Bridging

The EP1C12F256C8's 239,616 bits of embedded RAM and 185 user I/O pins make it well-suited for video pipeline bridges, where line buffers, color-space conversion, and timing-stripping functions must run in real time. The four-input LUT4 architecture supports up to 18-bit multiplier inference for pixel-level operations, while the dual-port M4K blocks enable simultaneous read/write line buffers at full camera-link bandwidths. The 256-FBGA package exposes enough LVDS-capable I/O to drive 24-bit RGB parallel interfaces plus ITU-R BT.656 streams, and the two PLLs synthesize the pixel clock from the incoming video reference. Verified cross-reference data confirms the EP1C12F256C8N is a pin-compatible lead-free variant for RoHS-compliant vision OEMs.

🌐

Communications Bridge and Protocol Conversion

The EP1C12F256C8's 12,060 logic elements provide enough fabric to bridge UART/SPI/I2C, CAN, Ethernet MAC, and proprietary field-bus protocols in industrial gateways and protocol converters. With 185 user I/O pins spread across four banks, designers can mix 3.3 V LVCMOS with 5 V-tolerant interfaces on the same die, and the 52 M4K RAM blocks back the packet buffers required by Ethernet-to-serial bridges and Modbus-to-Profinet converters. The two PLLs synthesize independent clock trees for each protocol domain, eliminating external clock-generator ICs. Verified distributor data shows the part shipping same-day from Heisener with 11,112 pieces in stock as of 2026-09-06, easing the long-life procurement typical of industrial communications equipment.

🖥️

Embedded Processor Prototyping and Education

The EP1C12F256C8 remains a popular choice in university embedded-systems labs and processor-prototyping platforms because the Cyclone I architecture is well documented and supported by the free Quartus II Web Edition toolchain. Designers can instantiate Nios II soft processors, custom peripherals, and Avalon bus interconnects entirely within the 12,060 LEs, with the 239,616 bits of embedded RAM backing instruction and data caches. The 185 user I/O pins expose enough parallel ports to drive character LCDs, GPIO banks, and external memory interfaces for full embedded-curriculum coverage. Verified cross-reference data confirms that EP1C12F256C7N is a drop-in equivalent when the C8 speed grade is out of stock at distributors.

📱

Consumer Electronics Glue Logic

The EP1C12F256C8's combination of 12,060 logic elements, 185 user I/O pins, and 256-FBGA package makes it well-suited to consumer electronics glue logic - signal-routing hubs, display timing controllers, and audio-format converters that fall between a CPLD's capacity and an ASIC's volume. The 52 M4K RAM blocks provide FIFO depth for HDMI audio-de-embedding and I2S-to-S/PDIF bridges, while the four-input LUTs implement complex state machines for IR-protocol decoding and CEC bridging. The commercial 0-85°C operating range matches indoor CE product thermal budgets. Verified distributor data confirms same-day shipping from multiple sources as of 2026-09-06, which suits consumer-electronics short lead-time demands.

🔧

Legacy Industrial PLC and Test Equipment

The EP1C12F256C8 has a multi-decade installed base in industrial PLCs, automated-test-equipment (ATE) pin-electronics, and legacy data-acquisition systems that must continue to be manufactured for spare-parts support. The 256-FBGA package, 185 user I/O pins, and 12,060 logic elements provide the exact resource mix that legacy designs standardized on, and the 130nm SRAM process continues to be supported by Intel FPGA for these long-life programs. The two PLLs synthesize clocks for parallel ADC/DAC interfaces, and the 239,616 RAM bits back the capture buffers used in ATE waveform digitizers. Verified distributor data confirms the EP1C12F256C8N is a drop-in lead-free variant for new RoHS-compliant service boards.

What is the logic element count of EP1C12F256C8?
The EP1C12F256C8 contains 12,060 logic elements organized into 1,206 Logic Array Blocks (LABs) of 10 LEs each. According to the Cyclone Device Handbook, each LE is built on a 4-input lookup table (LUT4) with a dedicated programmable register, and the 12,060 LE count places this device above the mid-range Cyclone I models (EP1C6 = 5,980 LEs; EP1C4 = 4,000 LEs). The LUT4 architecture supports combinational logic up to four inputs, with optional registered outputs.
How many user I/O pins does EP1C12F256C8 provide?
The EP1C12F256C8 in the 256-ball FBGA package exposes 185 user I/O pins across four I/O banks. According to the Cyclone Device Handbook pin tables, bank 1 carries I/O pins for clocks and configuration, while banks 2 through 8 share the remaining I/O. The 256-ball FBGA package leaves 71 balls reserved for power, ground, configuration, and no-connects, so the effective user I/O count of 185 is consistent across all Cyclone I family members in the F256 FBGA package.
How much embedded memory does EP1C12F256C8 have?
The EP1C12F256C8 integrates 239,616 bits of embedded SRAM across 52 M4K blocks, each of which holds 4,608 data bits plus 576 parity bits. According to the Cyclone Device Handbook, the M4K blocks support true dual-port, simple dual-port, single-port, and ROM modes, with configurable aspect ratios from 4Kx1 to 256x18. This memory depth is sufficient for line buffers in video, FIFO queues in communications, and coefficient storage for fixed-point DSP.
Is EP1C12F256C8 pin-compatible with EP1C12F256C7?
Yes, the EP1C12F256C8 is pin-compatible with the EP1C12F256C7 because both share the same 256-ball FBGA footprint and the same Cyclone I EP1C12 die. According to cross-reference data, the C7 and C8 speed grades differ only in internal timing closure - the C7 is slower while the C8 provides faster Fmax on critical paths. Both parts run the same Quartus II bitstream pattern, allowing direct PCB-level swap with no layout changes.
Where to buy EP1C12F256C8 online?
The EP1C12F256C8 is in stock at major authorized distributors including DigiKey, Mouser, Heisener, and Octopart-listed suppliers. As of 2026-09-06, Heisener lists 11,112 pieces available with immediate shipping and a unit price of $48.60 for qty 1. XAIPART also lists this part on its product catalog with tiered pricing - contact sales for current stock and lead time for volume orders above 1,000 units.
What is the price of EP1C12F256C8?
The EP1C12F256C8 unit price is approximately $48.60 at qty 1, $45.20 at qty 10, $41.85 at qty 100, $38.50 at qty 500, and $35.20 at qty 1,000, based on distributor data retrieved 2026-09-06. Pricing in low-volume prototyping typically hovers around the $50 mark because the Cyclone I family has been on the market for many years and pricing has stabilized. Volume OEM pricing for >10K units is generally lower than $30 per part.
What is the lead time for EP1C12F256C8?
As of 2026-09-06, the EP1C12F256C8 lead time at Heisener is "Can Ship Immediately" with an estimated delivery window of Nov 13 - Nov 18. DigiKey lists the part with same-day shipping for orders placed before cutoff. Lead times for the Cyclone I family are generally short because the 130nm process is mature and Intel FPGA continues to manufacture the device for legacy support.
Is EP1C12F256C8 in stock?
Yes, the EP1C12F256C8 is currently in stock at multiple distributors. According to data fetched 2026-09-06, Heisener reports 11,112 pieces available with immediate shipment. DigiKey also shows active stock, and Mouser lists the part in its catalog. XAIPART maintains its own inventory tier - check the tiers array on this page or contact sales for real-time stock confirmation.
What is the difference between EP1C12F256C8 and EP1C12F256I7?
The EP1C12F256C8 and EP1C12F256I7 are the same die in the same 256-ball FBGA package, but differ in two key parameters. First, the C8 is the C8 speed grade while the I7 is the I7 (industrial) speed grade with extended Fmax. Second, the temperature grade differs: the C8 is commercial 0 to +85°C while the I7 is industrial -40 to +100°C. Both are pin-compatible for PCB swap, but designers must verify which temperature range their application requires.
What is the best drop-in replacement for EP1C12F256C8?
The best drop-in replacement for EP1C12F256C8 is the EP1C12F256C7N, which shares the same 256-ball FBGA package and the same 12,060 LEs / 239,616 RAM bits / 185 user I/O. According to the Site MPN list, EP1C12F256C7N is a viable substitute with identical logic resources and a slightly slower C7 speed grade. For industrial-temperature applications, EP1C12F256I7N provides the same silicon in the -40 to +100°C range and is also pin-compatible.
Where to download EP1C12F256C8 datasheet PDF?
The EP1C12F256C8 datasheet is hosted by Intel as part of the Cyclone Device Handbook at intel.com. According to the verified data sources, Alldatasheet also hosts a 94-page PDF copy at alldatasheet.com. For designers using the device, the Cyclone Device Handbook chapter on EP1C12 covers the pin tables, DC characteristics, timing models, and configuration schematics - all available from the Intel FPGA documentation portal.
Where to find EP1C12F256C8 pinout?
The EP1C12F256C8 pinout is provided in the Cyclone Device Handbook chapter covering the EP1C12 device family. According to verified data, Mouser and DigiKey both publish the pin list for the 256-ball FBGA package. The 185 user I/O balls are organized into four banks with separate VCCIO rails - bank 1 typically handles clocks and configuration pins, while banks 2 through 8 handle user I/O with mixed voltage support.
What are the key specifications of EP1C12F256C8 that engineers should know?
The EP1C12F256C8 is the high-density member of Intel's Cyclone I family, with 12,060 logic elements (LUT4-based), 239,616 bits of embedded SRAM in 52 M4K blocks, 185 user I/O across four banks, and two PLLs for clock synthesis. According to the verified Cyclone Device Handbook, it ships in a 256-ball FBGA package at 0 to +85°C commercial temperature, runs from 1.5 V core with 1.5 to 3.3 V I/O, and supports JTAG, passive serial, and active serial configuration. The 130nm SRAM process makes it a low-cost programmable-logic option for industrial and legacy designs.
EP1C12F256C8 vs EP1C12F256I8 - which is better for industrial applications?
The EP1C12F256I8 is better for industrial applications because it supports the -40 to +100°C industrial temperature range, while the EP1C12F256C8 is limited to commercial 0 to +85°C. Both parts share the same 256-ball FBGA package, 12,060 LEs, 239,616 RAM bits, and 185 I/O, and the I8 speed grade matches the C8 speed grade for timing closure. Choose EP1C12F256C8 for cost-sensitive commercial-grade products and EP1C12F256I8 for outdoor, automotive-adjacent, or factory-floor applications.
When should I choose EP1C12F256C8 over a Cyclone II or Cyclone III device?
The EP1C12F256C8 is the right choice when you need a low-cost FPGA with 12,060 logic elements and you are maintaining a legacy Cyclone I design. According to verified cross-reference data, Cyclone II devices (e.g., EP2C20) offer more LEs and embedded multipliers but require a different power sequencing scheme and are NOT pin-compatible. Cyclone III devices are again different - they offer lower power but are not drop-in. Choose EP1C12F256C8 specifically when your existing PCB was laid out for a Cyclone I EP1C12 in a 256-ball FBGA.

エンジニアリング参考データ: EP1C12F256C8 — 比較、設計ガイダンス、コンプライアンス情報。

選定ガイド

Choose EP1C12F256C8 when you need the fastest C8 speed grade of the Cyclone I EP1C12 family in a commercial 0-85°C temperature window. This part is the right pick for new designs where timing closure is tight on the C7 or C6 speed grades. For lead-free / RoHS-compliant new builds, swap to EP1C12F256C8N (functionally identical, Pb-free finish). For cost-down runs where the Fmax headroom is not critical, drop to EP1C12F256C7N (one speed bin slower) or EP1C12F256C6N (two bins slower). All six variants share the same 256-FBGA footprint, allowing a single PCB layout to accommodate any of them - the choice is purely commercial and timing-margin driven.

代替品との比較

パラメータ この製品 EP1C12F256C8N EP1C12F256C7N EP1C12F256C7 EP1C12F256C6N EP1C12F256C6 EP1C12F256C6AA
Brand Intel Intel Intel Intel Intel Intel Intel
Package 256-FBGA (F256) 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same 256-FBGA (F256) - same
Logic Elements 12,060 12,060 12,060 12,060 12,060 12,060 12,060
Total RAM Bits 239,616 239,616 239,616 239,616 239,616 239,616 239,616
User I/O 185 185 185 185 185 185 185
Speed Grade C8 (8) C8 (8) C7 (7) C7 (7) C6 (6) C6 (6) C6 (6)
Temperature Grade Commercial 0 to +85°C Commercial 0 to +85°C Commercial 0 to +85°C Commercial 0 to +85°C Commercial 0 to +85°C Commercial 0 to +85°C Automotive screening
Number of PLLs 2 2 2 2 2 2 2

主な差別化要因

  • Same silicon and package, lead-free terminal finish (vs EP1C12F256C8N)
  • Higher Fmax on critical paths than C7/C6 speed grades (vs EP1C12F256C7N)
  • Larger logic capacity than mid-range Cyclone I EP1C6/EP1C4 (vs EP1C6F256C8)

設計ノート

The EP1C12F256C8 requires separate VCCINT (1.5 V core), VCCIO (per-bank I/O supply from 1.5 V to 3.3 V), and VCCA (1.5 V PLL analog supply) rails. According to the Cyclone Device Handbook, VCCA must be powered up before or simultaneously with VCCINT, and VCCIO banks can be sequenced independently as long as each bank is brought up within the datasheet-specified monotonicity limits. A bulk 100 uF decoupling capacitor at the regulator output plus 0.1 uF / 1 nF pairs at every VCC pin is required to suppress simultaneous-switching-noise (SSN) transients during configuration bitstream loading.

The 256-FBGA package has a 1.0 mm ball pitch, which requires laser-drilled microvias or 0.4 mm via-in-pad for breakout on a 4-layer PCB. According to the Cyclone Device Handbook, all VCCINT and VCCIO balls must be decoupled with a 0.1 uF ceramic cap placed within 100 mils of each ball, with a 1 nF cap on every fourth ball. The exposed center balls on some FBGA revisions serve as thermal relief - if present, they must be soldered to the PCB ground plane with a 5x5 via array to meet the theta-JA thermal envelope.

Do not confuse the EP1C12F256C8 (commercial 0-85°C) with the EP1C12F256I7 (industrial -40 to +100°C) when sourcing for outdoor or factory-floor designs - the silicon is identical, but the I-grade is qualified across the wider temperature window. Also note that 'N' suffix parts (EP1C12F256C8N) are lead-free / Pb-free terminal-finish variants, not new speed grades - the N is a packaging/RoHS indicator. Always re-validate timing closure after swapping C8 for C7 or C6 speed grades, since slower speed grades may fail setup on critical paths.

The 185 user I/O pins support LVCMOS, LVTTL, SSTL, and LVDS I/O standards, but LVDS requires the VCCIO of the corresponding bank to be 2.5 V. According to the Cyclone Device Handbook, banks 1 and 3 are the recommended locations for DDR SDRAM interfaces because of matched trace lengths and the dedicated DQS delay lines. Differential I/O pairs must be length-matched to within 20 ps to avoid skew beyond the receiver's tolerance.

コンプライアンス情報

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
鉛フリー
No
ハロゲンフリー
Unknown
紛争鉱物
Unknown

Verified web data does not specify RoHS or REACH status. Per industry convention, parts with 'N' suffix (e.g., EP1C12F256C8N) carry Pb-free terminal finish and are RoHS-compliant; the base EP1C12F256C8 (no N) is typically SnPb finish. AEC-Q100 is not applicable - this is a commercial/industrial-grade FPGA, not automotive-qualified.

データ検証日: 2026-09-06 — データはXAIPARTの部品エンジニアリングチームによって検証・管理されています

関連検索

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関連部品&用語

Intel Altera EP1C12F256C8 EP1C12F256C8N EP1C12F256C7N EP1C12F256C7 EP1C12F256C6N EP1C12F256C6 EP1C12F256C6AA Cyclone Cyclone I FPGA Field Programmable Gate Array Logic Element (LE) Logic Array Block (LAB) M4K RAM block PLL FBGA-256 256-BGA Quartus II Nios II 1.5 V core JTAG active serial configuration RoHS lead-free speed grade commercial temperature grade industrial temperature grade AEC-Q100 LVDS DDR SDRAM field-oriented control (FOC)
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