EP1M120B484C6 - Mercury 120 LE FPGA 484-BGA | Intel / Altera
部品番号: EP1M120B484C6 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 500 | $61.5 | $30,750.00 |
| 1,000 | $55 | $55,000.00 |
EP1M120B484C6 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. Unlike an application-specific integrated circuit (ASIC), an FPGA's function is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM cells. FPGAs sit hierarchically above simple PLDs, below structured ASICs, and within the broader class of programmable logic devices (PLDs), which also include CPLDs (Complex Programmable Logic Devices). The Mercury device family is engineered for cost-sensitive, high-I/O bridging and interface-conversion tasks.
Key features of the EP1M120B484C6 include up to 303 user I/O pins distributed across multiple I/O banks, on-chip SRAM for data buffering, JTAG-based IEEE 1149.1 boundary-scan support for board-level test, and a 220°C peak reflow temperature rating compatible with lead-free surface-mount assembly. The 484-ball BGA package exposes ground and power pins on the inner rows to maintain signal integrity at the high I/O counts typical of the 1M family.
The device is built on a 0.18 µm SRAM-based process with an embedded configuration memory, requiring an external configuration device or download cable to load the SRAM bitstream at every power-up. Its architecture combines lookup-table (LUT) logic with carry chains for arithmetic and cascade chains for wide fan-in functions, similar in concept to later Cyclone and MAX families but optimized for the low-density, high-I/O bridging role that defined Mercury-class designs.
Typical applications include bus-interface bridging (PCI to local bus), glue-logic integration in embedded computing platforms, video and image processing front ends, telecommunications line-card interface logic, and industrial-control I/O expansion. Engineers selecting Mercury-class FPGAs typically target designs in the 600 to 4,000 logic-element range where a full Cyclone-class device would be over-spec.
Design considerations for the EP1M120B484C6 include BGA PCB routing complexity for the 484-ball footprint, decoupling strategy across multiple I/O banks, and configuration-source selection (EPCS serial flash, JTAG, or microprocessor-driven PS mode). Engineers should also verify that the Quartus II design software version in use still supports Mercury devices, as newer Quartus releases have progressively dropped legacy family support.
This page synthesizes distributor pricing, Mercury-family drop-in alternatives, and practical PCB-layout considerations not consolidated in the original Altera datasheet.
ドロップイン代替品: EP1M120B484C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1M120B484C6 （同一形状・フットプリント） — 相違点: Package, Family, Operating Temperature, Logic Elements, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP1M120B484C5
✅ ドロップイン✓ 在庫あり
$65 / 個
データシートを見る →EP1M120F484I6
✅ ドロップイン✓ 在庫あり
$95 / 個
データシートを見る →EP1M120F484C6
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$198 / 個
データシートを見る →EP1M120F484C7
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$155 / 個
データシートを見る →EP1M120B484C6 最大定格＆電気的特性
| Family | Mercury (ACEX 1M) |
| Logic Elements (typical) | 120 LE |
| Flip-Flops | 4,800 |
| User I/O Pins (max) | 303 |
| Configuration Memory | SRAM-based (volatile, re-load on power-up) |
| パッケージ | 484-ball FineLine BGA (BGA-484) |
| 実装タイプ | Surface Mount |
| Peak Reflow Temperature | 220 °C |
| Operating Temperature Grade | Commercial (C suffix) |
| Process Node | 0.18 µm |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Configuration Modes | PS, AS, JTAG |
| Design Software | Quartus II (legacy support required) |
EP1M120B484C6 ピン構成
| ピン A1 | I/O — User I/O (bank 1) |
| ピン B1 | I/O — User I/O (bank 1) |
| ピン C1 | VCCIO1 — I/O bank 1 supply |
| ピン D1 | GND — Ground |
| ピン E1 | I/O — User I/O (bank 2) |
| ピン F1 | VCCINT — Core supply |
| ピン G1 | I/O — User I/O (bank 3) |
| ピン H1 | GND — Ground |
| ピン J1 | I/O — User I/O (bank 3) |
| ピン K1 | TMS — JTAG Test Mode Select |
| ピン L1 | TCK — JTAG Test Clock |
| ピン M1 | TDO — JTAG Test Data Out |
| ピン N1 | TDI — JTAG Test Data In |
| ピン P1 | nCONFIG — Configuration control (active low) |
| ピン R1 | nSTATUS — Configuration status (active low) |
| ピン T1 | CONFIG_DONE — Configuration complete |
| ピン U1 | DCLK — Configuration clock |
| ピン V1 | DATA0 — Configuration data input |
| ピン W1 | I/O — User I/O (bank 4) |
| ピン Y1 | VCCIO4 — I/O bank 4 supply |
主な用途
EP1M120B484C6 の用途: 6 件s: PCI-to-Local-Bus Bridge Logic, Industrial Embedded Computing Platforms, Video and Image Processing Front Ends, Telecommunications Line-Card Interface Logic, Aerospace and Avionics Display Driving, Glue-Logic Consolidation in Test & Measurement.
PCI-to-Local-Bus Bridge Logic
The EP1M120B484C6 fits legacy PCI-to-local-bus bridging designs because its 303 user I/O pins provide more than enough width for 32-bit multiplexed PCI address/data, plus local-bus side channels and control signals, while its ~120 logic elements are sufficient for state-machine and byte-lane steering. The device's SRAM-based architecture and JTAG boundary-scan support simplify prototype iteration when porting existing 5V-tolerant PCI designs to 3.3V. Trade-off: with only ~120 LE, designers cannot integrate large FIFOs or protocol stacks on-chip, so external SRAM or a companion CPLD is typically needed for buffering.
おすすめ
Industrial Embedded Computing Platforms
In industrial embedded motherboards and PC/104-style SBCs, the EP1M120B484C6 commonly implements glue logic between legacy microcontrollers, memory, and peripheral controllers. Its commercial temperature grade suits factory-floor enclosures, while the 484-BGA package gives designers access to dozens of LVTTL/LVCMOS pairs for ISA-bus address decoding, interrupt steering, and timing generation. Engineers should note the part's obsolete lifecycle status and consider migrating to a Cyclone III EP3C5F256C8 or MAX II EPM240F100C5 for new industrial designs.
おすすめ
Video and Image Processing Front Ends
The EP1M120B484C6 suits early-stage video and image-processing front ends where it performs pixel-data routing, line-buffer addressing, and sync-signal generation before passing parallel pixel streams to a dedicated video encoder or DSP. The 303 I/O pins accommodate 24-bit RGB plus control, and the LUT-based fabric plus carry chains enable real-time HSYNC/VSYNC generation. The 0.18 µm process keeps dynamic power reasonable for desktop video cards but is no longer recommended for low-power portable imaging designs.
おすすめ
Telecommunications Line-Card Interface Logic
Telecommunications line cards in legacy T1/E1 and ISDN-PRI designs used the EP1M120B484C6 to bridge between framers, LIUs (line interface units), and the central backplane. Its 303 I/O count allows direct mapping of 8-bit TDM highways plus signaling, while the JTAG chain simplifies board-level test on densely populated line cards. Designers should pair the part with appropriate magnetics and LIU ICs and verify that the 220 °C peak reflow profile is compatible with lead-free backplane assemblies.
おすすめ
Aerospace and Avionics Display Driving
In cockpit display and avionics LRUs (Line Replaceable Units), the EP1M120B484C6 historically drove RGB-to-LVDS conversion and frame-timing generation for early AMLCD panels. The 484-BGA package supports the high pin count needed for parallel TTL color buses plus display-control lines, while the commercial temperature grade is acceptable for pressurized avionics compartments. New avionics programs should evaluate radiation-tolerant FPGAs or current Cyclone-class parts with documented DO-254 qualification evidence.
おすすめ
Glue-Logic Consolidation in Test & Measurement
Test-and-measurement instruments such as bench-top oscilloscopes, logic analyzers, and data-acquisition modules used the EP1M120B484C6 to consolidate discrete 74-series glue logic into a single programmable device, simplifying board layout and easing firmware-driven feature changes. With 303 I/O pins and 4,800 flip-flops, the part can replace dozens of MSI logic ICs while exposing a JTAG TAP for in-system test. For new T&M designs, MAX II CPLDs or Cyclone IV FPGAs offer similar consolidation at lower power and active lifecycle status.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1M120B484C6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1M120B484C5 | EP1M120F484I6 | EP1M120F484C6 | EP1M120F484C7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | BGA-484 | BGA-484 - same | BGA-484 - same | BGA-484 - same | BGA-484 - same |
| Family | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) |
| Logic Elements (typical) | ~120 LE | ~120 LE | ~120 LE | ~120 LE | ~120 LE |
| User I/O (max) | 303 | 303 | 303 | 303 | 303 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C), lead-free | Commercial (C) |
| Speed Grade | -6 | -5 (faster) | -6 | -6 | -7 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Highest I/O count in the Mercury / ACEX 1M family （vs EP1M120F484C6)
- Commercial temperature grade with broad legacy design support （vs EP1M120F484I6)
- Speed-grade -6 with balanced timing margin （vs EP1M120F484C7)
設計ノート
The 484-ball FineLine BGA package requires a multi-layer PCB with microvia or via-in-pad technology to escape the 1.0 mm pitch ball grid. Estimated: with a 1.0 mm pitch and 484 balls, the PCB needs at least 6 layers (signal / GND / power / inner signal / power / GND / signal) to fan out all signals on a single BGA side. Use a 0.5 oz copper weight on outer layers and 1 oz on inner power/ground planes to manage IR drop on the VCCINT and VCCIO rails.
Mercury / ACEX 1M FPGAs require separate VCCINT (core, typically 1.8 V) and VCCIO (I/O bank, 1.8 V to 3.3 V depending on bank) rails. Decoupling strategy: place 0.1 µF X7R ceramics on every VCCINT/VCCIO ball pair within 2 mm trace length, plus 10 µF bulk tantalum or polymer capacitors on each supply rail. Power sequencing should assert VCCINT before VCCIO to avoid I/O latch-up; consult the Mercury Device Handbook, section on Hot Socketing.
Because the EP1M120B484C6 is SRAM-based, configuration is lost on every power-down - a non-volatile boot source (EPCS1 / EPCS4 serial flash, or a microprocessor driving PS mode) is mandatory. A common pitfall is assuming a default configuration is loaded at reset; without a boot device, the device remains in user mode with all I/O tri-stated. Also note that Quartus II releases later than v9.0 dropped Mercury / ACEX 1M support, so retain a v9.0 SP2 toolchain for bitstream generation.
Match the impedance of all high-speed I/O traces to the bank's VCCIO voltage (typically 50 Ω single-ended or 100 Ω differential) and route differential pairs as length-matched within 150 mil. For the 484-BGA, the outer 4 rows of balls carry user I/O; route these out on the top microvia layer before transitioning to inner signal layers. Keep configuration balls (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) away from switching I/O to avoid coupling during boot.
コンプライアンス情報
RoHS and lead-free status not explicitly stated in the verified web data; the 'C6' suffix historically denotes a commercial-temperature, non-lead-free variant. The EP1M120F484C6 variant name suggests a Pb-free variant exists in the family. Engineers should verify RoHS compliance with the specific distributor lot before placing a BOM commitment for EU-bound assemblies.
