EP1M120B484C6 - Mercury 120 LE FPGA 484-BGA | Intel / Altera
MPN: EP1M120B484C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68 | $6,800.00 |
| 500 | $61.5 | $30,750.00 |
| 1,000 | $55 | $55,000.00 |
Drop-in alternatives for EP1M120B484C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M120B484C5
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View Datasheet →EP1M120F484I6
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View Datasheet →EP1M120F484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1M120F484C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP1M120B484C6 Maximum Ratings & Electrical Characteristics
| Family | Mercury (ACEX 1M) |
| Logic Elements (typical) | 120 LE |
| Flip-Flops | 4,800 |
| User I/O Pins (max) | 303 |
| Configuration Memory | SRAM-based (volatile, re-load on power-up) |
| Package | 484-ball FineLine BGA (BGA-484) |
| Mounting Type | Surface Mount |
| Peak Reflow Temperature | 220 °C |
| Operating Temperature Grade | Commercial (C suffix) |
| Process Node | 0.18 µm |
| JTAG Support | IEEE 1149.1 boundary-scan |
| Configuration Modes | PS, AS, JTAG |
| Design Software | Quartus II (legacy support required) |
EP1M120B484C6 Pin Configuration
| Pin A1 | I/O — User I/O (bank 1) |
| Pin B1 | I/O — User I/O (bank 1) |
| Pin C1 | VCCIO1 — I/O bank 1 supply |
| Pin D1 | GND — Ground |
| Pin E1 | I/O — User I/O (bank 2) |
| Pin F1 | VCCINT — Core supply |
| Pin G1 | I/O — User I/O (bank 3) |
| Pin H1 | GND — Ground |
| Pin J1 | I/O — User I/O (bank 3) |
| Pin K1 | TMS — JTAG Test Mode Select |
| Pin L1 | TCK — JTAG Test Clock |
| Pin M1 | TDO — JTAG Test Data Out |
| Pin N1 | TDI — JTAG Test Data In |
| Pin P1 | nCONFIG — Configuration control (active low) |
| Pin R1 | nSTATUS — Configuration status (active low) |
| Pin T1 | CONFIG_DONE — Configuration complete |
| Pin U1 | DCLK — Configuration clock |
| Pin V1 | DATA0 — Configuration data input |
| Pin W1 | I/O — User I/O (bank 4) |
| Pin Y1 | VCCIO4 — I/O bank 4 supply |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M120B484C6 is suitable for 6 applications: PCI-to-Local-Bus Bridge Logic, Industrial Embedded Computing Platforms, Video and Image Processing Front Ends, Telecommunications Line-Card Interface Logic, Aerospace and Avionics Display Driving, Glue-Logic Consolidation in Test & Measurement.
PCI-to-Local-Bus Bridge Logic
The EP1M120B484C6 fits legacy PCI-to-local-bus bridging designs because its 303 user I/O pins provide more than enough width for 32-bit multiplexed PCI address/data, plus local-bus side channels and control signals, while its ~120 logic elements are sufficient for state-machine and byte-lane steering. The device's SRAM-based architecture and JTAG boundary-scan support simplify prototype iteration when porting existing 5V-tolerant PCI designs to 3.3V. Trade-off: with only ~120 LE, designers cannot integrate large FIFOs or protocol stacks on-chip, so external SRAM or a companion CPLD is typically needed for buffering.
Recommended
Industrial Embedded Computing Platforms
In industrial embedded motherboards and PC/104-style SBCs, the EP1M120B484C6 commonly implements glue logic between legacy microcontrollers, memory, and peripheral controllers. Its commercial temperature grade suits factory-floor enclosures, while the 484-BGA package gives designers access to dozens of LVTTL/LVCMOS pairs for ISA-bus address decoding, interrupt steering, and timing generation. Engineers should note the part's obsolete lifecycle status and consider migrating to a Cyclone III EP3C5F256C8 or MAX II EPM240F100C5 for new industrial designs.
Recommended
Video and Image Processing Front Ends
The EP1M120B484C6 suits early-stage video and image-processing front ends where it performs pixel-data routing, line-buffer addressing, and sync-signal generation before passing parallel pixel streams to a dedicated video encoder or DSP. The 303 I/O pins accommodate 24-bit RGB plus control, and the LUT-based fabric plus carry chains enable real-time HSYNC/VSYNC generation. The 0.18 µm process keeps dynamic power reasonable for desktop video cards but is no longer recommended for low-power portable imaging designs.
Recommended
Telecommunications Line-Card Interface Logic
Telecommunications line cards in legacy T1/E1 and ISDN-PRI designs used the EP1M120B484C6 to bridge between framers, LIUs (line interface units), and the central backplane. Its 303 I/O count allows direct mapping of 8-bit TDM highways plus signaling, while the JTAG chain simplifies board-level test on densely populated line cards. Designers should pair the part with appropriate magnetics and LIU ICs and verify that the 220 °C peak reflow profile is compatible with lead-free backplane assemblies.
Recommended
Aerospace and Avionics Display Driving
In cockpit display and avionics LRUs (Line Replaceable Units), the EP1M120B484C6 historically drove RGB-to-LVDS conversion and frame-timing generation for early AMLCD panels. The 484-BGA package supports the high pin count needed for parallel TTL color buses plus display-control lines, while the commercial temperature grade is acceptable for pressurized avionics compartments. New avionics programs should evaluate radiation-tolerant FPGAs or current Cyclone-class parts with documented DO-254 qualification evidence.
Recommended
Glue-Logic Consolidation in Test & Measurement
Test-and-measurement instruments such as bench-top oscilloscopes, logic analyzers, and data-acquisition modules used the EP1M120B484C6 to consolidate discrete 74-series glue logic into a single programmable device, simplifying board layout and easing firmware-driven feature changes. With 303 I/O pins and 4,800 flip-flops, the part can replace dozens of MSI logic ICs while exposing a JTAG TAP for in-system test. For new T&M designs, MAX II CPLDs or Cyclone IV FPGAs offer similar consolidation at lower power and active lifecycle status.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120B484C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120B484C5 | EP1M120F484I6 | EP1M120F484C6 | EP1M120F484C7 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | BGA-484 | BGA-484 - same | BGA-484 - same | BGA-484 - same | BGA-484 - same |
| Family | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) | Mercury (ACEX 1M) |
| Logic Elements (typical) | ~120 LE | ~120 LE | ~120 LE | ~120 LE | ~120 LE |
| User I/O (max) | 303 | 303 | 303 | 303 | 303 |
| Temperature Grade | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C), lead-free | Commercial (C) |
| Speed Grade | -6 | -5 (faster) | -6 | -6 | -7 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest I/O count in the Mercury / ACEX 1M family (vs EP1M120F484C6)
- Commercial temperature grade with broad legacy design support (vs EP1M120F484I6)
- Speed-grade -6 with balanced timing margin (vs EP1M120F484C7)
Design Notes
The 484-ball FineLine BGA package requires a multi-layer PCB with microvia or via-in-pad technology to escape the 1.0 mm pitch ball grid. Estimated: with a 1.0 mm pitch and 484 balls, the PCB needs at least 6 layers (signal / GND / power / inner signal / power / GND / signal) to fan out all signals on a single BGA side. Use a 0.5 oz copper weight on outer layers and 1 oz on inner power/ground planes to manage IR drop on the VCCINT and VCCIO rails.
Mercury / ACEX 1M FPGAs require separate VCCINT (core, typically 1.8 V) and VCCIO (I/O bank, 1.8 V to 3.3 V depending on bank) rails. Decoupling strategy: place 0.1 µF X7R ceramics on every VCCINT/VCCIO ball pair within 2 mm trace length, plus 10 µF bulk tantalum or polymer capacitors on each supply rail. Power sequencing should assert VCCINT before VCCIO to avoid I/O latch-up; consult the Mercury Device Handbook, section on Hot Socketing.
Because the EP1M120B484C6 is SRAM-based, configuration is lost on every power-down - a non-volatile boot source (EPCS1 / EPCS4 serial flash, or a microprocessor driving PS mode) is mandatory. A common pitfall is assuming a default configuration is loaded at reset; without a boot device, the device remains in user mode with all I/O tri-stated. Also note that Quartus II releases later than v9.0 dropped Mercury / ACEX 1M support, so retain a v9.0 SP2 toolchain for bitstream generation.
Match the impedance of all high-speed I/O traces to the bank's VCCIO voltage (typically 50 Ω single-ended or 100 Ω differential) and route differential pairs as length-matched within 150 mil. For the 484-BGA, the outer 4 rows of balls carry user I/O; route these out on the top microvia layer before transitioning to inner signal layers. Keep configuration balls (nCONFIG, nSTATUS, CONFIG_DONE, DCLK, DATA0) away from switching I/O to avoid coupling during boot.
Compliance Information
RoHS and lead-free status not explicitly stated in the verified web data; the 'C6' suffix historically denotes a commercial-temperature, non-lead-free variant. The EP1M120F484C6 variant name suggests a Pb-free variant exists in the family. Engineers should verify RoHS compliance with the specific distributor lot before placing a BOM commitment for EU-bound assemblies.
