EP1M120F484I6N - Mercury FPGA, 120K Gates, 484-FBGA | Intel
部品番号: EP1M120F484I6N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215 | $107,500.00 |
| 1,000 | $188 | $188,000.00 |
EP1M120F484I6N 概要
A Field Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O and memory resources that engineers can re-program after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> programmable logic -> digital logic ICs -> integrated circuits, distinguishing themselves from CPLDs by offering higher logic density, embedded Block RAM, and hardened transceiver/PLL silicon for parallel and serial data-path designs.
The Mercury architecture combines Look-Up Table (LUT)-based logic with distributed and block memory, providing 12 LABs (Logic Array Blocks) per row and on-chip CDR-assisted serial channels for low-jitter serial I/O. Embedded PLLs multiply and condition reference clocks, while per-pin LVDS/LVCMOS/LVTTL support and high-speed row-I/O buffers simplify interfacing to DDR-style memory and parallel ADC/DAC buses. The 484-FBGA package exposes the full user-I/O count and high-speed serial channels while keeping board area manageable for high-density designs.
Typical applications for the EP1M120F484I6N include high-speed serial-interface bridging, custom protocol conversion, glue logic in DSP pipelines, and parallel data-acquisition front-ends. With 49,152 RAM bits the device can absorb multi-byte FIFOs for rate matching between asynchronous clock domains, and the 1.25 Gbps CDR-capable transceivers enable backplane links, multi-gigabit serial fan-out, and telecom-grade line-card glue logic.
A key design consideration is the 0C to +85C commercial/industrial temperature window versus the -40C to +85C extended-industrial grade; pick the EP1M120F484I6N for benign, controlled-thermal environments such as lab instrumentation and indoor telecom shelves, and reserve the wider-grade sibling for outdoor or automotive-adjacent deployments.
This page synthesizes Mercury family variant coverage, drop-in alternatives, parametric comparisons, and practical PCB thermal guidance not consolidated in any single manufacturer or distributor datasheet.
ドロップイン代替品: EP1M120F484I6N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1M120F484I6N （同一形状・フットプリント） — 相違点: Family, Operating Temperature, Package, Speed Grade, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP1M120F484I6
✅ ドロップイン✓ 在庫あり
$95 / 個
データシートを見る →EP1M120F484I5N
✅ ドロップイン✓ 在庫あり
$180 / 個
データシートを見る →EP1M120F484C6N
✅ ドロップイン✓ 在庫あり
$56.5 / 個
データシートを見る →EP1M120F484C7N
✅ ドロップイン✓ 在庫あり
$108 / 個
データシートを見る →EP1M120F484C8N
✅ ドロップイン✓ 在庫あり
$142 / 個
データシートを見る →EP1M120F48416
✅ ドロップイン✓ 在庫あり
$97.4 / 個
データシートを見る →EP1M120F484I6N 最大定格＆電気的特性
| Family | Mercury |
| Manufacturer | Intel (formerly Altera) |
| System Gates | 120,000 |
| Logic Elements / Cells | 4,800 |
| Logic Array Blocks (LABs) | 480 |
| Total RAM Bits | 49,152 |
| User I/Os | 303 |
| パッケージ | 484-ball FBGA (FineLine BGA) |
| Package Code | BGA-484 / FC-FBGA |
| Logic Family | CMOS |
| Core Supply Voltage | 1.8 V |
| 動作温度 | 0C to +85C |
| Transceivers | Integrated high-speed transceivers with CDR to 1.25 Gbps |
| 実装タイプ | Surface Mount |
EP1M120F484I6N bga-484 / fc-fbga ピン配置ガイド
EP1M120F484I6N (bga-484 / fc-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1M120F484I6N.
詳細は データシート をご参照ください。
主な用途
EP1M120F484I6N の用途: 6 件s: High-Speed Serial Backplane Bridge, Telecom Line-Card Glue Logic, DSP Pipeline Pre-Processing, Protocol Conversion / Interface Bridge, Test and Measurement Instrumentation Front-End, Industrial Control Glue Logic with Custom I/O.
High-Speed Serial Backplane Bridge
The EP1M120F484I6N's integrated 1.25 Gbps transceivers with on-chip clock data recovery make it a strong fit for high-speed serial backplane bridging between line cards, chassis mid-planes, and adjacent FPGAs/ASICs. The 4,800 logic elements and 49,152 RAM bits allow protocol conversion (for example, custom backplane SERDES to LVDS parallel) entirely inside the Mercury fabric, eliminating a dedicated PHY. Place the part near the board edge connector to minimize serial-channel stub length, and use matched-length differential pairs with controlled 100-ohm impedance for each transceiver channel.
おすすめ
Telecom Line-Card Glue Logic
Telecom line-card designs require wide parallel buses to TDM framers, SERDES backplanes, and clock-distribution ASICs, all of which the EP1M120F484I6N can absorb with 303 user I/Os. The 49,152-bit Block RAM is sufficient for multi-channel elastic FIFOs that buffer between the line-card system clock and the backplane recovered clock. Use the on-chip PLLs to generate multiple related frequencies from one reference, and leverage the 1.25 Gbps transceivers for chip-to-chip serial interconnect to the framer.
おすすめ
DSP Pipeline Pre-Processing
The Mercury fabric's 4,800 logic elements and 49,152 bits of Block RAM can implement FIR filters, correlators, and FFT pre-processing stages for DSP pipelines preceding a dedicated DSP or ADC/DAC pair. The high user-I/O count (303 pins) supports wide parallel ADC capture buses, and the on-chip PLLs generate the ADC sampling clock with deterministic phase relationship to the fabric logic. Plan logic utilization at 70% of nominal to leave headroom for timing closure on the I6 speed grade.
おすすめ
Protocol Conversion / Interface Bridge
The EP1M120F484I6N is frequently deployed as a protocol converter (for example, custom LVDS-to-LVCMOS bridges, parallel RapidIO fan-out, or UART/SPI aggregation) where ASIC alternatives would be too expensive. With 303 user I/Os and 4,800 logic elements, a single Mercury device can host multiple independent bridge channels simultaneously. The 484-FBGA package keeps the footprint compact even at this I/O density, enabling dense multi-protocol cards for industrial control or test-instrument front-ends.
おすすめ
Test and Measurement Instrumentation Front-End
Laboratory instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators benefit from the EP1M120F484I6N's mix of parallel I/O, Block RAM, and serial transceivers. The 49,152-bit Block RAM is large enough to capture multi-sample waveform segments for inline pre-trigger storage, and the 1.25 Gbps transceivers can drive external high-speed DACs and ADCs. Use the Mercury PLLs to derive all timing from one low-jitter reference to keep channel-to-channel skew tight.
おすすめ
Industrial Control Glue Logic with Custom I/O
Industrial PLCs, motor controllers, and custom I/O concentrators often need many LVCMOS/LVTTL signals driving relays, optocouplers, and parallel LCD/keypad interfaces - exactly the use case where 303 user I/Os shine. The Mercury fabric's CMOS logic cells interface directly to 3.3V/2.5V/1.8V I/O standards with selectable drive strengths. For noisy industrial environments, add external ESD/TVS protection on user I/O and keep the 484-FBGA decoupling network tight: one bulk cap per VCC pin and 0.1 uF + 0.01 uF per power-pair is a good starting point.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1M120F484I6N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1M120F484I6 | EP1M120F484I5N | EP1M120F484C6N | EP1M120F484C7N | EP1M120F484C8N | EP1M120F48416 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Family | Mercury | Mercury | Mercury | Mercury | Mercury | Mercury | Mercury |
| Operating Temperature | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +85C |
| Logic Elements / Cells | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 |
| User I/Os | 303 | 303 | 303 | 303 | 303 | 303 | 303 |
| Total RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| Transceiver Data Rate | 1.25 Gbps CDR | 1.25 Gbps CDR | 1.25 Gbps CDR | 1.25 Gbps CDR | 1.25 Gbps CDR | 1.25 Gbps CDR | 1.25 Gbps CDR |
主な差別化要因
- Lead-free terminal finish on the EP1M120F484I6N （vs EP1M120F484I6)
- Industrial-temperature 0C to +85C operating window （vs EP1M120F484C6N)
- Faster I6 speed grade for high-Fmax timing closure （vs EP1M120F484I5N)
設計ノート
The 484-ball FineLine BGA concentrates thermal dissipation in a small footprint; even with a relatively low FPGA core power of approximately 0.5-1 W typical, the FBGA package thermal resistance depends strongly on the PCB copper count. For reliable operation across the 0C to +85C industrial range, dedicate at least one full inner copper plane under the BGA footprint connected to GND, and add thermal vias in the BGA land pattern. In thermally harsh enclosures, derate ambient by 10C or specify the wider -40C to +85C extended-industrial EP1M120F484I6 sibling.
Lay out the 484-FBGA with via-in-pad or dog-bone fan-out to escape the 1.0 mm ball pitch; standard 4- or 6-layer stack-ups with 0.5 oz copper on outer layers are acceptable, but inner planes should be 1 oz for thermal spreading. Match the length and impedance (typically 100 ohms differential for the LVDS/serial channels, 50 ohms single-ended for LVCMOS clocks) of every transceiver pair to within 5 mil. Provide a complete GND reference under all serial-pair traces to keep return paths continuous.
Do not assume EP1M120F484I6N drop-in compatibility with EP1M120F484I6 for RoHS-critical builds: the 'N' suffix indicates a lead-free terminal finish, while the non-'N' part may use a leaded finish. Mixing them on a RoHS-declared product invalidates the declaration. Also, when migrating to the EP1M120F484I5N or EP1M120F484C7N drop-in parts for relaxed timing, verify your design meets the slower speed-grade Fmax targets before committing - timing closure is design-dependent and not automatically guaranteed by silicon-grade swap.
コンプライアンス情報
The 'N' suffix in EP1M120F484I6N indicates lead-free terminal finish per Altera/Intel ordering convention. RoHS, REACH, halogen-free, and conflict-minerals declarations were not present in the captured web data and require confirmation against the manufacturer's current product declaration document. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC.