EP1AGX50CF484C3 - 50K LE Arria GX FPGA, 484-BGA | Intel
部品番号: EP1AGX50CF484C3 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 25 | $245 | $6,125.00 |
| 50 | $232 | $11,600.00 |
| 100 | $218 | $21,800.00 |
EP1AGX50CF484C3 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit in the digital logic hierarchy alongside ASICs and CPLDs, offering hardware-level parallelism and post-fabrication reprogrammability. The Arria GX family specifically targets protocol-rich serial-interface applications bridging between Stratix-class performance and Cyclone-class cost.
Key features include 50,160 logic elements, 2,475,072 RAM bits (4,506 M4K memory blocks plus 252 M-RAM blocks), 12 full-duplex transceiver channels up to 3.125 Gbps supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and XAUI, and 232 user I/O pins. The device also integrates dedicated DSP blocks (variable-precision multipliers), phase-locked loops (PLLs), and 4 phase-rotated transceiver clock pins. The CF484 BGA package provides a compact footprint suitable for high-density PCB designs.
The architecture combines a 1.2V core supply (with 3.3V/2.5V I/O compatibility through banked supplies) with hardened PCIe hard IP and SERDES blocks. The C3 speed grade denotes a commercial temperature rating (0C to +85C) with a -3 speed bin. Compared with the C6 speed grade, C3 is faster but more expensive, and is the highest-performance commercial tier offered for this package.
Typical applications include PCI Express Gen1 endpoint and root-complex designs, XAUI / 10 GbE backplanes, Serial RapidIO bridges, broadcast video processing, and wireless baseband prototyping. The combination of transceiver density and moderate logic capacity suits mid-complexity protocol bridging cards.
When designing with this device, ensure the board provides clean transceiver analog supplies (VCCA_PLL, VCCA_TX, VCCA_RX) per the Arria GX hardware reference. Reference the Quartus II pin planner and the device pin-out file (PDF) to validate pin assignments against the chosen BGA fan-out, since 484-FBGA routing demands a 1.0 mm or 0.8 mm pitch PCB stack-up with microvia technology.
This page synthesizes authorized distributor pricing, drop-in alternatives within the same Arria GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for sourcing, replacement, and PCB implementation decisions.
ドロップイン代替品: EP1AGX50CF484C3 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1AGX50CF484C3 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded Memory, RoHS Status, Logic Elements (LE).
クイック比較ツール — 並列比較する代替部品を選択:
EP1AGX50CF484C6N
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP1AGX50CF484I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1AGX50CF484C7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP1AGX35CF484C6N
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP1AGX35CF484C6
✅ ドロップイン✓ 在庫あり
$295 / 個
データシートを見る →EP1AGX50CF484C3 最大定格＆電気的特性
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 bits |
| M4K Memory Blocks | 4,506 |
| M-RAM Blocks | 252 |
| Transceiver Channels | 12 (up to 3.125 Gbps) |
| User I/O Pins | 232 |
| パッケージ | 484-ball FBGA (FineLine BGA) |
| Speed Grade | C3 (commercial, fastest) |
| 動作温度 | 0C to +85C (commercial) |
| Core Voltage | 1.2 V |
| Configuration Method | Passive serial, Fast passive parallel, JTAG |
| RoHS ステータス | Compliant |
| Process Technology | 90 nm |
EP1AGX50CF484C3 484-ball fbga (fineline bga) ピン配置ガイド
EP1AGX50CF484C3 (484-ball fbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1AGX50CF484C3.
詳細は データシート をご参照ください。
主な用途
EP1AGX50CF484C3 の用途: 6 件s: PCI Express Gen1 Endpoint Card, XAUI / 10 Gigabit Ethernet Bridge, Serial RapidIO Switch Fabric, Broadcast Video Processing Engine, Wireless Baseband Prototyping Platform, Industrial Protocol Bridge / Gateway.
PCI Express Gen1 Endpoint Card
The EP1AGX50CF484C3 is a classic mid-complexity PCI Express Gen1 endpoint solution for add-in cards and embedded host boards. Its 12 integrated 3.125 Gbps transceivers comfortably support x1/x4/x8 Gen1 links with 2.5 Gbps signaling, and the hardened PCIe hard IP block eliminates fabric logic for the PHY/MAC layers. The 50K logic elements are sufficient for a complete DMA engine plus application-layer payload. Designers should use the 484-FBGA package to route PCIe lanes on the top layers with reference-clock and PERST signals properly length-matched per the Arria GX hardware reference design.
おすすめ
XAUI / 10 Gigabit Ethernet Bridge
The EP1AGX50CF484C3 fits well in 10 Gigabit Ethernet bridging and aggregation applications using XAUI (4 x 3.125 Gbps lanes) interfaces. With 12 transceivers, designers can implement two full XAUI ports plus a sideband management channel without fabric SERDES, leaving the 50K logic elements free for bridging logic, MAC framing, and forward-error correction. The 484-FBGA package with 232 user I/O pins exposes ample GPIO for PHY management interfaces, MDIO buses, and LEDs. Industrial-grade variant EP1AGX50CF484I7N extends operation to -40C to +100C for outdoor switch deployments.
おすすめ
Serial RapidIO Switch Fabric
Serial RapidIO (SRIO) at 1.25/2.5/3.125 Gbps per lane is well-served by the EP1AGX50CF484C3, especially for DSP-cluster backplanes and baseband processing cards. The hardened SERDES blocks deliver deterministic low-latency RapidIO physical-layer performance, while the 50K logic elements and 2.4 Mbit embedded RAM are sufficient for a 4-port SRIO switch with non-blocking cut-through forwarding. The 484-FBGA package supports the high-speed SRIO lane routing required for signal integrity at 3.125 Gbps, with reference clocks sourced from dedicated transceiver clock pins.
おすすめ
Broadcast Video Processing Engine
Broadcast video applications such as SDI (Serial Digital Interface) embedders, de-embedders, and format converters leverage the EP1AGX50CF484C3's transceiver density and fabric throughput. The 12 transceivers handle multiple SD/HD/3G-SDI streams at up to 2.97 Gbps, while the 50K logic elements implement pixel-domain processing, audio embedding, and ancillary data extraction. The 484-FBGA package exposes 232 user I/O pins for parallel video interfaces, GPIO for board control, and DDR2 memory controller pins. Designers should reference the Altera video reference design for SDI PHY implementation patterns.
おすすめ
Wireless Baseband Prototyping Platform
The EP1AGX50CF484C3 is widely deployed as a wireless baseband prototyping platform for 3G/4G reference designs, CPRI/OBSAI fronthaul interfaces, and DSP algorithm development. Its 12 transceivers at 3.125 Gbps accommodate multiple CPRI links to remote radio heads, while the embedded DSP blocks accelerate chip-rate and symbol-rate processing. The 50K logic elements host complete PHY-layer implementations plus MAC prototypes. With the 484-FBGA package offering 232 user I/O pins, designers can interface to external ADCs/DACs, DDR2 memory, and backplane connectors without I/O contention.
おすすめ
Industrial Protocol Bridge / Gateway
The EP1AGX50CF484C3 is suitable for industrial protocol bridge designs that convert between Ethernet, Serial RapidIO, CAN, Profibus, and other industrial protocols on a single board. With 12 transceivers supporting multiple Ethernet or RapidIO links simultaneously, plus 232 user I/O pins for CAN controllers, RS-485 transceivers, and GPIO, the device integrates bridge logic, protocol stack offload, and packet buffering on a single chip. The industrial-temperature variant EP1AGX50CF484I7N is preferred for harsh environments such as factory floors with extended temperature ranges from -40C to +100C.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1AGX50CF484C3 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1AGX50CF484C6N | EP1AGX50CF484I7N | EP1AGX35CF484C6N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 50,160 | 50,160 (same) | 50,160 (same) | 35,160 (-30%) |
| Total RAM Bits | 2,475,072 | 2,475,072 (same) | 2,475,072 (same) | 1,349,376 (-45%) |
| Transceiver Channels | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) | 12 (3.125 Gbps) |
| User I/O Pins | 232 | 232 (same) | 232 (same) | 232 (same) |
| Speed Grade | C3 (fastest) | C6 (slower) | I7 (industrial temp, slower) | C6 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
主な差別化要因
- Highest speed grade (C3) within the EP1AGX50 family （vs EP1AGX50CF484C6N)
- Commercial temperature range with full transceiver performance （vs EP1AGX50CF484I7N)
- Mid-density with full 12-transceiver count （vs EP1AGX35CF484C6N)
設計ノート
Estimated: The EP1AGX50CF484C3 has separate analog and digital supply rails. The 1.2V VCCINT (core) rail typically draws 800 mA to 1.5 A under full logic utilization; VCCA_PLL, VCCA_TX, and VCCA_RX each need isolated filtering from VCCINT to prevent PLL and SERDES jitter. Use a four-layer PCB with dedicated power planes, ferrite-bead-isolated analog supplies, and bulk + decoupling per the Arria GX hardware reference. Designers should budget 5-8W typical power consumption and provide thermal relief via thermal vias under the BGA thermal pad.
The 484-FBGA package uses a 1.0 mm ball pitch and requires multilayer PCB fabrication with microvia (laser-drilled) technology for breakout routing. Route all transceiver channels on the top layers with continuous ground reference and length-match within 0.127 mm per the Arria GX hardware reference. Maintain 100-ohm differential impedance for SERDES pairs and 50-ohm single-ended for clock signals. Place the configuration flash (EPCS16/EPCS64) within 2 cm of the FPGA DATA0/DCLK/ASDO/nCSO pins to avoid configuration timing failures.
Common pitfalls when designing with the EP1AGX50CF484C3 include: (1) failing to power-up VCCINT before VCCA_PLL - causes PLL lock failures and intermittent transceiver errors; (2) not terminating the REFCLK inputs with proper AC coupling - degrades SERDES jitter to the point of link failure at 3.125 Gbps; (3) using NRND lifecycle parts without securing last-time-buy inventory - leading to production line-down scenarios. Always validate bitstream generation in Quartus II v13.1 (final version with Arria GX support) before committing to production.
コンプライアンス情報
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified (FPGA not intended for automotive functional safety). Lead-free (Pb-free) finish on C-grade and N-suffix parts. Conflict-mineral compliance maintained per Intel's supply chain policy.