EP1S20F780C6 - 18,460-Cell Stratix FPGA | Intel | DSP
部品番号: EP1S20F780C6 ✗ 生産終了| 数量 | 単価 | 小計 |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1S20F780C6 概要
A field-programmable gate array, or FPGA, is a programmable semiconductor device that combines configurable logic blocks, routing resources, and input/output blocks on one integrated circuit. Engineers use an FPGA to implement custom digital functions after manufacturing through configuration data rather than application-specific masks. Within the electronic hierarchy, the FPGA is a programmable digital IC, belonging to programmable logic devices and semiconductor technology. Its logic density and package pin count influence whether a design can be implemented on a single device, while its I/O count determines how much external circuitry can be connected.
The EP1S20F780C6 combines 18,460 cells with 586 I/O pins, providing substantial integration for parallel datapaths and interface-heavy systems. The 1.5 V operating supply supports a high-density CMOS implementation, while the 130 nm process is associated with the listed FPGA architecture. The 780-pin FC-BGA package provides 780 terminals on a 1 mm pitch and measures 29 mm x 29 mm according to the verified package description. The device also supports digital signal-processing applications, as indicated by the distributor category data.
From an implementation perspective, the device is a configurable logic platform rather than a fixed-function controller. The architecture must be designed with verified Intel/Altera configuration and JTAG information before board bring-up. Because the package contains 780 pins, PCB land-pattern verification, power-plane planning, signal-integrity review, and thermal assessment are essential. The 1.5 V supply requirement also means that the power-management design must provide the correct rail, sequencing, and decoupling strategy for the selected configuration mode.
Typical applications include DSP accelerators, communications equipment, industrial automation, test and measurement, and interface aggregation. The 18,460-cell capacity and 586 I/O terminals are particularly relevant to designs that need many digital channels or parallel processing blocks. Designers should also consider configuration memory, clocking, I/O standards, and board-level signal integrity when planning a new design.
A key design trade-off is the balance between programmable capacity, package size, and system complexity. The 780-pin FC-BGA package offers high connectivity but requires careful BGA layout and assembly capability. The verified operating range of 0 °C to 85 °C should be considered alongside board temperature, airflow, and power dissipation during thermal validation.
This page synthesizes the verified EP1S20F780C6 specifications, package data, sourcing links, and engineering-oriented application context. Unverified electrical, pinout, configuration, and compliance details are explicitly marked for validation rather than inferred from similar Stratix devices.
ドロップイン代替品: EP1S20F780C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S20F780C6 （同一形状・フットプリント） — 相違点: Process Technology, Operating Temperature, Package, Speed Grade, DSP Blocks.
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストEP1S20F780C6 最大定格＆電気的特性
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Family | Stratix |
| Logic Cells | 18,460 cells |
| I/O Count | 586 I/O |
| 電源電圧 | 1.5 V |
| Process Technology | 130 nm |
| Listed Frequency | 450.05 MHz |
| Package Type | FBGA-780 / FC-BGA |
| Package Pin Count | 780 pins |
| Package Body Size | 29 mm x 29 mm |
| Package Pitch | 1 mm |
| Terminal Form | Ball |
| Logic Technology | CMOS |
| 動作温度 | 0 °C to 85 °C |
| 実装タイプ | SMD/SMT |
EP1S20F780C6 1 mm ピン配置ガイド
EP1S20F780C6 (1 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S20F780C6.
詳細は データシート をご参照ください。
主な用途
EP1S20F780C6 の用途: 6 件s: DSP Accelerators, Communications Equipment, Industrial Automation, Test and Measurement, Data Acquisition Systems, Interface Aggregation and Protocol Bridging.
DSP Accelerators
EP1S20F780C6 fits DSP accelerator designs that require programmable parallel processing and high external connectivity. The verified architecture is a Stratix FPGA with 18,460 logic cells, 586 I/O pins, and a 1.5 V supply, providing a large programmable fabric for filters, arithmetic pipelines, and control logic. In a typical design, the FPGA sits between high-speed data converters or communication interfaces and the system processor, implementing deterministic datapaths while the processor handles higher-level control. The 780-pin FC-BGA package supports many connections but makes BGA escape and power integrity critical. Designers must validate the exact supported DSP resources, clock rates, memory interfaces, and timing margins in the manufacturer documentation before implementation.
おすすめ
Communications Equipment
EP1S20F780C6 is applicable to communications equipment where programmable packet processing, protocol handling, and interface aggregation are required. Its verified 18,460 logic cells and 586 I/O pins can support multiple digital channels and control functions, while the 1.5 V supply and 130 nm CMOS implementation fit legacy high-density programmable logic systems. The device can be placed between physical-layer or line-interface devices and a host processor, using configuration-defined logic to perform framing, buffering, protocol transformation, and monitoring. The 780-pin FC-BGA package offers high connectivity but requires controlled impedance routing, complete power-plane analysis, and validated thermal performance. Communication-system designs should also verify supported I/O standards, transceiver details, clocking resources, and configuration interfaces.
おすすめ
Industrial Automation
EP1S20F780C6 can serve industrial automation systems that need deterministic programmable control, multiple sensor interfaces, and high-speed coordination. The listed 0 °C to 85 °C operating range and 586 I/O count support consideration for commercial industrial equipment, while the 18,460-cell fabric can implement state machines, timing logic, data aggregation, and safety-control support functions. In use, the FPGA may connect field inputs, encoders, communication controllers, and actuators to a supervisory controller. Its 780-ball package and 1 mm pitch demand careful assembly and signal-integrity planning, particularly for long board traces or noisy industrial environments. The supplied data does not establish industrial qualification, safety certification, or detailed I/O electrical limits, so those requirements must be independently verified.
おすすめ
Test and Measurement
EP1S20F780C6 is well suited to test and measurement systems requiring programmable measurement sequencing, data capture, and high channel counts. The verified 586 I/O pins allow the device to interface with multiple sensors, converters, switches, or control signals, while 18,460 logic cells support instrument control, filtering, statistics, and protocol processing. A typical instrument can use the FPGA as a real-time acquisition and timing engine between analog front-end circuitry and a host processor. The listed 450.05 MHz value is a distributor-reported specification, not a substitute for design-specific timing analysis, so clocking, setup, hold, and I/O performance must be checked against the official datasheet. The 780-pin FC-BGA package also requires a controlled BGA layout and robust power distribution.
おすすめ
Data Acquisition Systems
EP1S20F780C6 can be used in data acquisition systems that aggregate many digital channels and perform real-time processing before transferring data to a host. The device’s 18,460 logic cells provide capacity for channel control, buffering, formatting, and first-stage digital processing, while 586 I/O pins support parallel connections to converters, sensors, and interface devices. The FPGA is commonly placed after the acquisition front end and before a processor or storage subsystem, allowing deterministic processing with programmable behavior. Because the part is a 780-pin FC-BGA on a 1 mm pitch, designers should plan the land pattern, via escape strategy, decoupling network, and signal return paths before schematic release. Converter throughput, I/O standards, and timing constraints are not fully specified in the supplied data and require primary-source verification.
おすすめ
Interface Aggregation and Protocol Bridging
EP1S20F780C6 fits interface aggregation and protocol-bridging designs that need many external connections and configurable digital logic. The verified 586 I/O count is valuable when a system must combine several peripheral buses, sensor links, or control interfaces, and the 18,460-cell capacity can implement protocol conversion, FIFO control, framing, and error handling. In a representative architecture, the FPGA receives traffic from multiple sources, normalizes it into a common internal format, and forwards it to a processor or backplane interface. The 1.5 V rail must be designed with appropriate startup and decoupling behavior, while the 780-ball package requires careful fan-out and signal-integrity review. Supported I/O standards, configuration modes, clock resources, and protocol throughput must be confirmed from the manufacturer documentation.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S20F780C6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 |
|---|---|
| Brand | Intel |
| Package | 780-pin FC-BGA, 29 mm x 29 mm, 1 mm pitch |
| Logic Cells | 18,460 |
| Supply Voltage | 1.5 V |
| I/O Count | 586 |
| Process Technology | 130 nm |
| Operating Temperature | 0 °C to 85 °C |
| Listed Frequency | 450.05 MHz |
設計ノート
The 780-pin FC-BGA package uses a 1 mm pitch and a listed 29 mm x 29 mm body, so the PCB must be designed from the official land pattern rather than inferred from a generic BGA footprint. Confirm ball numbering, escape rules, via construction, and manufacturing stack-up with the Intel/Altera package documentation before release. A verified pin map is not included in the supplied data, so no signal assignment should be copied from an unconfirmed diagram.
EP1S20F780C6 is listed with a 1.5 V supply and a 130 nm CMOS process. Use a low-impedance power distribution network with local decoupling placed close to the package supply balls, and validate startup behavior for the selected configuration method. Detailed current, tolerance, sequencing, and power-consumption values are not present in the supplied evidence; they must come from the manufacturer datasheet and the actual design configuration.
The 586 I/O count creates a substantial signal-routing and return-path challenge. Plan controlled-impedance routes, continuous reference planes, differential-pair geometry where required, and careful fan-out around the 780-ball package. Avoid splitting planes beneath high-speed routes and perform signal-integrity simulation for the selected I/O standard, edge rate, clock topology, and receiver or driver technology.
The verified operating range is 0 °C to 85 °C, but the supplied data does not provide junction-to-air thermal resistance or allowable power dissipation. Estimate heat from the final configuration and operating frequency, then validate with board-level measurements under maximum ambient and airflow conditions. Consider the package body, copper area, adjacent devices, and enclosure temperature when defining the production thermal budget.
Do not select a replacement solely because another FPGA has similar cells, voltage, or FPGA category. EP1S20F780C6 has a specific 780-ball FC-BGA package, 1 mm pitch, ordering-code designation, and configuration behavior. Verify the exact ball map, package drawing, speed grade, temperature grade, I/O compatibility, configuration interface, and timing requirements. The supplied data does not support a safe drop-in alternative claim.
コンプライアンス情報
The supplied data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The operating range is listed as 0 °C to 85 °C; no automotive qualification is provided.
