EP1S20F780C6 - 18,460-Cell Stratix FPGA | Intel | DSP
MPN: EP1S20F780C6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for EP1S20F780C6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesEP1S20F780C6 Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Family | Stratix |
| Logic Cells | 18,460 cells |
| I/O Count | 586 I/O |
| Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Listed Frequency | 450.05 MHz |
| Package Type | FBGA-780 / FC-BGA |
| Package Pin Count | 780 pins |
| Package Body Size | 29 mm x 29 mm |
| Package Pitch | 1 mm |
| Terminal Form | Ball |
| Logic Technology | CMOS |
| Operating Temperature | 0 °C to 85 °C |
| Mounting Type | SMD/SMT |
EP1S20F780C6 1 mm Pin Configuration Guide
Complete pinout information for EP1S20F780C6 (1 mm package) with 780 pins pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S20F780C6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 780 pins pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S20F780C6 is suitable for 6 applications: DSP Accelerators, Communications Equipment, Industrial Automation, Test and Measurement, Data Acquisition Systems, Interface Aggregation and Protocol Bridging.
DSP Accelerators
EP1S20F780C6 fits DSP accelerator designs that require programmable parallel processing and high external connectivity. The verified architecture is a Stratix FPGA with 18,460 logic cells, 586 I/O pins, and a 1.5 V supply, providing a large programmable fabric for filters, arithmetic pipelines, and control logic. In a typical design, the FPGA sits between high-speed data converters or communication interfaces and the system processor, implementing deterministic datapaths while the processor handles higher-level control. The 780-pin FC-BGA package supports many connections but makes BGA escape and power integrity critical. Designers must validate the exact supported DSP resources, clock rates, memory interfaces, and timing margins in the manufacturer documentation before implementation.
Recommended
Communications Equipment
EP1S20F780C6 is applicable to communications equipment where programmable packet processing, protocol handling, and interface aggregation are required. Its verified 18,460 logic cells and 586 I/O pins can support multiple digital channels and control functions, while the 1.5 V supply and 130 nm CMOS implementation fit legacy high-density programmable logic systems. The device can be placed between physical-layer or line-interface devices and a host processor, using configuration-defined logic to perform framing, buffering, protocol transformation, and monitoring. The 780-pin FC-BGA package offers high connectivity but requires controlled impedance routing, complete power-plane analysis, and validated thermal performance. Communication-system designs should also verify supported I/O standards, transceiver details, clocking resources, and configuration interfaces.
Recommended
Industrial Automation
EP1S20F780C6 can serve industrial automation systems that need deterministic programmable control, multiple sensor interfaces, and high-speed coordination. The listed 0 °C to 85 °C operating range and 586 I/O count support consideration for commercial industrial equipment, while the 18,460-cell fabric can implement state machines, timing logic, data aggregation, and safety-control support functions. In use, the FPGA may connect field inputs, encoders, communication controllers, and actuators to a supervisory controller. Its 780-ball package and 1 mm pitch demand careful assembly and signal-integrity planning, particularly for long board traces or noisy industrial environments. The supplied data does not establish industrial qualification, safety certification, or detailed I/O electrical limits, so those requirements must be independently verified.
Recommended
Test and Measurement
EP1S20F780C6 is well suited to test and measurement systems requiring programmable measurement sequencing, data capture, and high channel counts. The verified 586 I/O pins allow the device to interface with multiple sensors, converters, switches, or control signals, while 18,460 logic cells support instrument control, filtering, statistics, and protocol processing. A typical instrument can use the FPGA as a real-time acquisition and timing engine between analog front-end circuitry and a host processor. The listed 450.05 MHz value is a distributor-reported specification, not a substitute for design-specific timing analysis, so clocking, setup, hold, and I/O performance must be checked against the official datasheet. The 780-pin FC-BGA package also requires a controlled BGA layout and robust power distribution.
Recommended
Data Acquisition Systems
EP1S20F780C6 can be used in data acquisition systems that aggregate many digital channels and perform real-time processing before transferring data to a host. The device’s 18,460 logic cells provide capacity for channel control, buffering, formatting, and first-stage digital processing, while 586 I/O pins support parallel connections to converters, sensors, and interface devices. The FPGA is commonly placed after the acquisition front end and before a processor or storage subsystem, allowing deterministic processing with programmable behavior. Because the part is a 780-pin FC-BGA on a 1 mm pitch, designers should plan the land pattern, via escape strategy, decoupling network, and signal return paths before schematic release. Converter throughput, I/O standards, and timing constraints are not fully specified in the supplied data and require primary-source verification.
Recommended
Interface Aggregation and Protocol Bridging
EP1S20F780C6 fits interface aggregation and protocol-bridging designs that need many external connections and configurable digital logic. The verified 586 I/O count is valuable when a system must combine several peripheral buses, sensor links, or control interfaces, and the 18,460-cell capacity can implement protocol conversion, FIFO control, framing, and error handling. In a representative architecture, the FPGA receives traffic from multiple sources, normalizes it into a common internal format, and forwards it to a processor or backplane interface. The 1.5 V rail must be designed with appropriate startup and decoupling behavior, while the 780-ball package requires careful fan-out and signal-integrity review. Supported I/O standards, configuration modes, clock resources, and protocol throughput must be confirmed from the manufacturer documentation.
Recommended
Recommended Products Summary
Engineering reference data for EP1S20F780C6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Intel |
| Package | 780-pin FC-BGA, 29 mm x 29 mm, 1 mm pitch |
| Logic Cells | 18,460 |
| Supply Voltage | 1.5 V |
| I/O Count | 586 |
| Process Technology | 130 nm |
| Operating Temperature | 0 °C to 85 °C |
| Listed Frequency | 450.05 MHz |
Design Notes
The 780-pin FC-BGA package uses a 1 mm pitch and a listed 29 mm x 29 mm body, so the PCB must be designed from the official land pattern rather than inferred from a generic BGA footprint. Confirm ball numbering, escape rules, via construction, and manufacturing stack-up with the Intel/Altera package documentation before release. A verified pin map is not included in the supplied data, so no signal assignment should be copied from an unconfirmed diagram.
EP1S20F780C6 is listed with a 1.5 V supply and a 130 nm CMOS process. Use a low-impedance power distribution network with local decoupling placed close to the package supply balls, and validate startup behavior for the selected configuration method. Detailed current, tolerance, sequencing, and power-consumption values are not present in the supplied evidence; they must come from the manufacturer datasheet and the actual design configuration.
The 586 I/O count creates a substantial signal-routing and return-path challenge. Plan controlled-impedance routes, continuous reference planes, differential-pair geometry where required, and careful fan-out around the 780-ball package. Avoid splitting planes beneath high-speed routes and perform signal-integrity simulation for the selected I/O standard, edge rate, clock topology, and receiver or driver technology.
The verified operating range is 0 °C to 85 °C, but the supplied data does not provide junction-to-air thermal resistance or allowable power dissipation. Estimate heat from the final configuration and operating frequency, then validate with board-level measurements under maximum ambient and airflow conditions. Consider the package body, copper area, adjacent devices, and enclosure temperature when defining the production thermal budget.
Do not select a replacement solely because another FPGA has similar cells, voltage, or FPGA category. EP1S20F780C6 has a specific 780-ball FC-BGA package, 1 mm pitch, ordering-code designation, and configuration behavior. Verify the exact ball map, package drawing, speed grade, temperature grade, I/O compatibility, configuration interface, and timing requirements. The supplied data does not support a safe drop-in alternative claim.
Compliance Information
The supplied data does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The operating range is listed as 0 °C to 85 °C; no automotive qualification is provided.
