EP1S30F780C6GA - Stratix FPGA 32470 LEs 780-FBGA | Intel
部品番号: EP1S30F780C6GA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1337.09 | $1,337.09 |
| 10 | $1280 | $12,800.00 |
| 100 | $1200 | $120,000.00 |
| 500 | $1150 | $575,000.00 |
| 1,000 | $1100 | $1,100,000.00 |
EP1S30F780C6GA 概要
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon IP such as block RAM, DSP slices, PLLs, and high-speed serial transceivers. FPGAs sit above fixed-function ASICs and microcontrollers in the silicon hierarchy because they offer hardware-level parallelism with the ability to be re-programmed in-system, placing them in the broader category of programmable logic devices (PLDs) within digital semiconductors.
Key features of the EP1S30F780C6GA include 32,470 logic elements, 3,317,184 RAM bits, 597 maximum user I/O pins, embedded DSP blocks for high-throughput multiplication-accumulation, multiple phase-locked loops for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The 780-FBGA package exposes all user I/O through a high-density ball grid that supports dense board layouts.
The EP1S30F780C6GA uses Altera's Stratix architecture with embedded memory and dedicated signal-processing blocks. Designers configure logic and routing through the Quartus II design software, which is also used for timing closure, floorplanning, and bitstream generation. The architecture targets high-throughput parallel processing where conventional processors would bottleneck.
Typical applications include communications infrastructure such as base station baseband and protocol bridging, industrial automation controllers, high-speed data acquisition front-ends, and military/aerospace signal processing. The 597-I/O capacity also makes the device suitable for prototyping ASIC designs and for high-density test and measurement instrumentation.
When designing with this part, pay close attention to power planning: the 1.5 V core supply must be tightly decoupled with bulk and ceramic capacitors close to each supply pin. The 780-BGA footprint requires careful PCB stack-up and via-in-pad or microvia technology for reliable assembly. Signal integrity must be simulated for high-speed LVDS pairs and external memory interfaces to maintain timing margins.
This product page consolidates distributor pricing, parametric comparison, and a drop-in alternative list to streamline sourcing and design decisions, supplementing the official Intel datasheet.
ドロップイン代替品: EP1S30F780C6GA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S30F780C6GA （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Process Technology, DSP Blocks.
クイック比較ツール — 並列比較する代替部品を選択:
EP1S30F780C6
✅ ドロップイン✓ 在庫あり
$1125 / 個
データシートを見る →EP1S25F780C6
✅ ドロップイン✓ 在庫あり
$791.02 / 個
データシートを見る →EP1S25F780C6N
✅ ドロップイン✓ 在庫あり
$780 / 個
データシートを見る →EP1S20F780C6
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP1S20F780C6N
✅ ドロップイン✓ 在庫あり
$188.75 / 個
データシートを見る →EP1S30F780C6GA 最大定格＆電気的特性
| Series | Stratix |
| Family | Stratix FPGA |
| Logic Elements | 32,470 |
| Total RAM Bits | 3,317,184 |
| Number of I/O | 597 (maximum user I/O) |
| Core Voltage | 1.425 V to 1.575 V |
| Process Technology | 0.13 um |
| パッケージ / ケース | 780-BBGA, FCBGA |
| Supplier Device Package | 780-FBGA (29 x 29 mm) |
| 実装タイプ | Surface Mount |
| DSP Blocks | Integrated dedicated multipliers |
| PLL Count | Multiple (per Stratix family) |
| Configuration Memory | SRAM-based, volatile |
| Architecture | Altera Stratix (programmable logic + TriMatrix memory + DSP blocks) |
EP1S30F780C6GA 780-fbga (29 x 29 mm) ピン配置ガイド
EP1S30F780C6GA (780-fbga (29 x 29 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S30F780C6GA.
詳細は データシート をご参照ください。
主な用途
EP1S30F780C6GA の用途: 6 件s: Communications Baseband Processing, Industrial Automation and Control, High-Speed Data Acquisition Front-Ends, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Communications Baseband Processing
The EP1S30F780C6GA suits communications baseband and protocol-bridging designs because of its 32,470 logic elements and dedicated DSP blocks for high-throughput multiply-accumulate operations. Its 597 user I/O accommodate multiple external memory interfaces (DDR, QDR, SRAM) and high-speed LVDS links to RF front-ends. The 1.5 V core and Stratix TriMatrix memory deliver deterministic latency for symbol-rate processing in 3G/4G base stations.
おすすめ
Industrial Automation and Control
Industrial controllers, programmable logic controllers (PLCs), and motion-control systems benefit from the EP1S30F780C6GA's high logic density and abundant I/O. The 597 available user I/O can drive dozens of sensor inputs, encoder feedback channels, and actuator outputs concurrently. Integrated PLLs provide deterministic clocking for multi-axis servo loops, and Quartus II enables deterministic real-time firmware development for safety-critical machinery.
おすすめ
High-Speed Data Acquisition Front-Ends
The EP1S30F780C6GA's 3,317,184 RAM bits provide buffering for streaming ADC data at hundreds of MSPS, while 597 user I/O support wide LVDS or parallel CMOS interfaces to high-resolution converters. The dedicated DSP blocks accelerate FIR filtering and FFT pipelines commonly required in oscilloscopes, spectrum analyzers, and software-defined radio front-ends. Pin counts at 597 leave ample margin for downstream processing and storage links.
おすすめ
ASIC Prototyping and Emulation
Designers use the EP1S30F780C6GA for ASIC prototyping and hardware emulation because the 32,470 LEs can map large RTL blocks before committing to silicon. The 780-FBGA package exposes enough I/O to bring out test points, memory buses, and emulation headers. Quartus II integration with synthesis tools allows rapid incremental compilation cycles that speed verification of multi-million-gate ASIC designs.
おすすめ
Military and Aerospace Signal Processing
The EP1S30F780C6GA, when ordered with industrial or military temperature grades, serves in avionics, radar processing, and electronic-warfare subsystems. Its high logic density implements parallel beamforming and pulse-Doppler processing at sample rates unattainable with general-purpose processors. The 780-BGA package supports ruggedized board stacks with underfill and is documented in the Stratix Device Handbook for defense applications.
おすすめ
Test and Measurement Instrumentation
Logic analyzers, protocol testers, and bit-error-rate testers leverage the EP1S30F780C6GA's 597 I/O for multi-channel pattern generation and capture. On-chip TriMatrix memory buffers deep acquisition records, while DSP blocks accelerate real-time protocol decoding. Quartus II IP cores for PCIe, Ethernet, and serial RapidIO simplify integrating the FPGA into modular instrumentation chassis.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S30F780C6GA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1S30F780C6 | EP1S25F780C6 | EP1S25F780C6N | EP1S20F780C6 | EP1S20F780C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same |
| Logic Elements | 32,470 | 32,470 (same) | 25,660 | 25,660 | 18,460 | 18,460 |
| Total RAM Bits | 3,317,184 | 3,317,184 (same) | 1,922,048 | 1,922,048 | 1,663,696 | 1,663,696 |
| User I/O (max) | 597 | 597 | 597 | 597 | 586 | 586 |
| Core Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Speed Grade | C6 | C6 | C6 | C6 | C6 | C6 |
| Lead-Free (N suffix) | Unknown | Unknown | Unknown | Yes (N suffix) | Unknown | Yes (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
主な差別化要因
- Higher logic capacity in same 780-FBGA footprint （vs EP1S25F780C6)
- Larger TriMatrix memory than smaller density siblings （vs EP1S20F780C6)
- Single-supply 1.5 V core simplifies power architecture （vs Cross-brand SRAM FPGAs)
設計ノート
Estimated: at a typical Stratix core current of approximately 1.5 A at 1.5 V plus I/O bank power, the EP1S30F780C6GA can draw 3 to 5 W depending on toggle rate. Use a buck regulator with at least 10 percent headroom on the 1.5 V rail, and decouple with 100 nF X7R ceramic capacitors within 5 mm of every supply pin plus bulk polymer or tantalum capacitors on each power plane. The 780-FBGA exposes dozens of GND balls; connect all to a continuous ground plane for thermal dissipation.
The 780-FBGA package has a fine 1.0 mm ball pitch, which typically requires 0.4 mm laser-drilled microvias and via-in-pad technology for reliable assembly. Use a high-Tg FR-4 or low-loss PCB laminate to manage z-axis expansion, and apply underfill during board-level reliability qualification. Per the Stratix Device Handbook pinout guide, all 597 user I/O are assigned to banks; place bank reference voltage pins with local decoupling and verify with the Quartus II pin planner before tape-out.
Stratix SRAM-based FPGAs are volatile and must be configured at every power-up from a configuration device such as an EPC16 or EPCS serial flash; forgetting the configuration source renders the device non-functional. JTAG and passive serial configuration modes are supported but require dedicated pins that must be reserved in the pin planner. Mixing I/O standards across banks without matching VREF voltages causes input latch-up, and exceeding the 1.575 V maximum core voltage instantly destroys the die.
コンプライアンス情報
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance were not present in the verified distributor snippets for EP1S30F780C6GA. Intel/Altera discontinued the original Stratix family long before these compliance fields were systematically published, so most reseller listings do not surface them. Industrial (I) temperature grade variants exist for the same die.