EP1S40F1020C5GA - Stratix FPGA 41K LE 1020-BGA | Altera / Intel
部品番号: EP1S40F1020C5GA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $199.5 | $49,875.00 |
| 500 | $171 | $85,500.00 |
EP1S40F1020C5GA 概要
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the customer after manufacture to implement arbitrary digital logic, from glue logic and protocol bridges to full processor subsystems and signal-processing pipelines. FPGAs sit hierarchically above ASICs in flexibility and below microcontrollers in per-unit cost, while offering parallel hardware execution that microcontrollers cannot match. The Stratix family specifically targets high-performance applications by combining a logic fabric, dedicated DSP blocks, M512/M4K/M-RAM memory blocks, and high-speed serial transceivers on a single die.
Key features of the EP1S40F1020C5GA include 41,250 logic elements, 773 user I/O pins, 3,423,744 total RAM bits, embedded DSP blocks, and up to 12 high-speed transceiver channels depending on variant. The 1020-ball FineLine BGA package supports 4 dedicated PLL clock networks per device quadrant and supports LVDS, LVPECL, HSTL, SSTL, and PCI I/O standards. Configuration is handled via JTAG, passive serial, or Altera EPC configuration devices, and the device supports remote update and CRC-based configuration error detection.
Typical applications include telecommunication line cards, high-speed serial protocol bridging, video and image processing, ASIC prototyping, and military/aerospace signal processing. The 1020-BGA package is targeted at high-density PCB designs with controlled-impedance routing, and the FineLine BGA ball pitch requires multi-layer PCB stack-up with microvia technology for breakout.
When designing with this device, engineers should plan for power integrity with multiple decoupling capacitors per I/O bank, use IBIS simulation for high-speed LVDS interfaces, and verify the Quartus II / Quartus Prime device support status since this part is end-of-life. Always check the latest Altera/Intel product change notifications before committing the EP1S40F1020C5GA to new designs.
ドロップイン代替品: EP1S40F1020C5GA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S40F1020C5GA （同一形状・フットプリント） — 相違点: Package, DSP Blocks, Embedded Memory, Mounting Type, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP1S40F1020C5
✅ ドロップイン✓ 在庫あり
$165 / 個
データシートを見る →EP1S40F1020C5AA
✅ ドロップイン✓ 在庫あり
$195.4 / 個
データシートを見る →EP1S40F1020C5DM
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP1S40F1020C5N
✅ ドロップイン✓ 在庫あり
$280 / 個
データシートを見る →EP1S40B956C6N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1050 / 個
データシートを見る →EP1S40F1020C5GA 最大定格＆電気的特性
| Series | Stratix |
| Logic Elements (LE) | 41,250 |
| Total RAM Bits | 3,423,744 |
| User I/O Count | 773 |
| パッケージ | 1020-BBGA (FineLine BGA) |
| 実装タイプ | Surface Mount |
| 動作温度 | 0C to +85C (Commercial) |
| Speed Grade | C5 |
| Process Node | 0.13 µm CMOS with 9-layer metal |
| DSP Blocks | Embedded multiplier blocks (count per Stratix datasheet family) |
| PLL Count | Up to 12 enhanced PLLs (per Stratix family) |
| High-Speed Transceivers | Up to 12 channels (per Stratix family, variant dependent) |
| Configuration Method | JTAG, Passive Serial, Altera EPC device |
| RoHS ステータス | Unknown - non-GA suffix commercial part |
| Lead-Free | Yes (per Altera/Intel policy at release) |
EP1S40F1020C5GA 1020-bbga (fineline bga) ピン配置ガイド
EP1S40F1020C5GA (1020-bbga (fineline bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S40F1020C5GA.
詳細は データシート をご参照ください。
主な用途
EP1S40F1020C5GA の用途: 7 件s: Telecom Line Card Processing, High-Speed Serial Protocol Bridging, Video and Image Processing Pipeline, ASIC Prototyping Platform, DSP Co-Processor for Radar and Sonar, Industrial Control and Test Equipment, Legacy Networking Switch Fabric.
Telecom Line Card Processing
The EP1S40F1020C5GA's 41,250 logic elements, 3.4 Mbit on-chip RAM, and 773 user I/Os make it well-suited for telecom line card processing where packet classification, traffic shaping, and protocol bridging must be implemented in parallel hardware. The 1020-BGA package exposes enough I/O for multiple SGMII/SPI interfaces alongside DDR memory controller data and address buses. Embedded DSP blocks accelerate VoIP echo cancellation and packet header CRC computation. Designers should plan for IBIS simulation of LVDS interfaces and multi-bank I/O timing closure in Quartus II 13.1.
おすすめ
High-Speed Serial Protocol Bridging
The original Stratix family's high-speed transceiver channels support multi-gigabit serial protocols such as SPI-4.2, XAUI, and PCI Express. With up to 12 transceiver channels and 41K LEs, the EP1S40F1020C5GA can implement complex bridging functions between SPI-4.2 PHY devices and backplane ASICs. The 1020-BGA's 773 user I/Os accommodate parallel data bus connections to companion chips. Designers must verify channel count for the specific lot code since transceiver availability varies across Stratix SKUs.
おすすめ
Video and Image Processing Pipeline
With 3.4 Mbit block RAM and embedded DSP blocks, the EP1S40F1020C5GA supports video processing pipelines at SD and HD resolutions including color space conversion, scaling, deinterlacing, and motion compensation. The 41K logic elements accommodate multi-tap FIR filters and 2D convolution kernels while block RAM buffers line buffers and frame stores. The 1020-BGA package supports LVDS signaling for direct connection to DVI/HDMI TMDS transmitters and camera interfaces. Quartus II DSP Builder provides a model-based design flow for filter design.
おすすめ
ASIC Prototyping Platform
The EP1S40F1020C5GA's 41K logic elements and embedded memory make it a viable ASIC prototyping platform for validating SOC designs before tape-out. Multiple FPGAs can be tiled together using LVDS-based multi-FPGA partitioning, with the 1020-BGA's high I/O count enabling chip-to-chip interconnect. The 0.13 µm Stratix fabric is timing-accurate for ASIC emulation at typical 100-150 MHz operation. Designers should use Quartus II's LogicLock regions and the Synopsys Design Compiler FPGA compiler flow for repeatable prototype builds.
おすすめ
DSP Co-Processor for Radar and Sonar
The Stratix family's embedded DSP blocks support 9-bit, 18-bit, and 36-bit signed multiplication with accumulation, enabling radar pulse compression, beamforming, and FFT processing. The EP1S40F1020C5GA can implement a 1024-point FFT in a single device and process multiple simultaneous beam channels. Block RAM stores twiddle factors and range-Doppler maps. The C5 speed grade trades off DSP block throughput against cost, suitable for systems where sample rates are below 100 MSPS.
おすすめ
Industrial Control and Test Equipment
With 773 user I/Os and on-chip RAM, the EP1S40F1020C5GA can interface to multiple industrial buses including parallel ADC/DAC arrays, camera link, and proprietary backplanes while executing real-time control algorithms in dedicated hardware. The commercial temperature grade suits factory-floor equipment. Designers should provide robust thermal management since 0.13 µm Stratix devices can dissipate 5-15 W under typical loading, and the 1020-BGA requires thermal vias to internal copper planes for heat extraction.
おすすめ
Legacy Networking Switch Fabric
The EP1S40F1020C5GA was deployed in early-2000s networking switches as a queuing and forwarding engine, where its 3.4 Mbit buffer memory and high I/O count enabled wire-speed packet processing. Modern redesigns should consider Cyclone III EP3C120 or Stratix III EP3SL110 as migration targets, accepting that the 1020-BGA footprint is not preserved and PCB redesign is required. Maintain legacy designs by sourcing the EP1S40 through distributors carrying obsolete stock.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S40F1020C5GA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1S40F1020C5 | EP1S40F1020C5AA | EP1S40F1020C5DM | EP1S40F1020C5N | EP1S40B956C6N |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA FineLine BGA | 1020-BBGA FineLine BGA (same) | 1020-BBGA FineLine BGA (same) | 1020-BBGA FineLine BGA (same) | 1020-BBGA FineLine BGA (same) | 956-BBGA FineLine BGA (variant) |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 41,250 LE | 41,250 LE (same die) | 41,250 LE (same die) | 41,250 LE (same die) | 41,250 LE (same die) | 41,250 LE (same die) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (same) | Commercial (same) | Commercial (same) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | C5 (slowest) | C5 (same) | C5 (same) | C5 (same) | C5 (same) | C6 (one grade faster) |
| Total RAM Bits | 3,423,744 bits | 3,423,744 bits (same) | 3,423,744 bits (same) | 3,423,744 bits (same) | 3,423,744 bits (same) | 3,423,744 bits (same die) |
| RoHS Compliance | Lead-free (GA suffix) | Unknown (pre-AA) | Lead-free (AA suffix) | Lead-free (DM engineering sample) | Industrial-N suffix, lead-free per Altera policy | Lead-free per Altera policy |
| Lifecycle Status | Obsolete (2026-09-07) | Obsolete | Obsolete | Obsolete (engineering sample) | Obsolete | Obsolete |
主な差別化要因
- Lead-free RoHS-marked packaging code (GA suffix) （vs EP1S40F1020C5 (pre-AA baseline))
- Same-die drop-in compatibility preserves Quartus II 13.1 bitstream （vs Stratix II EP2S60 or Cyclone III EP3C120)
- Lower-cost engineering sample (DM) for prototype builds （vs EP1S40F1020C5AA (production-qualified))
設計ノート
Estimated: based on Stratix family power calculators, the EP1S40F1020C5GA at typical 70% utilization and 100 MHz toggling rate dissipates approximately 4.5-6.5 W. The 1020-BGA package requires a 10x10 via array under the package center connected to internal copper planes for heat extraction. Without thermal management, junction temperature can exceed 100°C at commercial ambient, derating timing performance. Place multiple thermal vias in the central 6x6 ball grid directly under the die, fanning out to inner copper layers with high thermal conductivity.
The 1020-ball FineLine BGA requires a 1.0 mm or 1.27 mm ball pitch PCB design with microvia (laser-drilled or plasma-etched) technology. Per Altera's Stratix hardware design guide, the PCB should use a 4-2-4 or 6-layer stack-up with stacked or staggered microvias, impedance-controlled traces (50 ohm single-ended, 100 ohm differential) for LVDS, and matched-length routing for DDR memory interfaces. The pinout is documented in the Altera Pin Information File (PIF) which Quartus II 13.1 can export.
Do not confuse the EP1S40F1020C5GA with the EP1S30F1020C5 or EP1S25F1020C5 - these are lower-density members (33,720 and 25,660 LEs respectively) of the same family. The 'S40' designator specifically denotes the 41,250 LE device. Also note that the 'GA' suffix is a packaging variant code, NOT an AEC-Q100 automotive qualification - this part is commercial-grade only. For automotive applications, no Stratix variant is qualified; consider Altera's automotive-grade Cyclone family instead.
Per Altera's Stratix device handbook, high-speed LVDS and LVPECL interfaces require controlled-impedance routing with 100-ohm differential pairs and matched P/N length within 20 ps. Use IBIS models from Altera to perform pre-layout signal integrity simulation, and verify post-layout with HyperLynx or Ansys SIwave. The 1020-BGA's ball grid enables straight-through routing for parallel data buses (e.g. DDR) but breakout requires careful via pattern design.
コンプライアンス情報
GA suffix indicates lead-free packaging per Altera naming convention. RoHS compliance confirmed for the GA suffix per Altera/Intel policy at the time of release. REACH, halogen-free, and conflict-minerals status not publicly published for this obsolete part - consult Intel PSG legacy documentation or the Altera/Intel product change notification archive.