EP1S40F1020C5 - 41,250 Cells Stratix FPGA 1020-BGA | Altera
MPN: EP1S40F1020C5 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 50 | $210 | $10,500.00 |
| 100 | $185 | $18,500.00 |
| 500 | $165 | $82,500.00 |
Drop-in alternatives for EP1S40F1020C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S60F1020C5
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP1S40F1020C6
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP1S40F1020C7
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP1S40F1020I6
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →EP1S30F1020C5
✅ Drop-In✓ In Stock
$99 / Unit
View Datasheet →EP1S25F1020C5
✅ Drop-In✓ In Stock
$650 / Unit
View Datasheet →EP1S40F1020C5 Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | Stratix I |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Maximum User I/Os | 773 |
| Embedded Memory | 3.4 Mbits (TriMatrix) |
| DSP Blocks | Yes (dedicated hardware multipliers) |
| Process Technology | 130 nm |
| Core Voltage | 1.425 V to 1.575 V |
| Speed Grade | C5 |
| Package | 1020-ball FC-FBGA (33 mm x 33 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (Commercial) |
| Maximum Internal Clock | up to 500 MHz |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI |
EP1S40F1020C5 Pin Configuration
| Pin A1 | I/O Bank 1 — User I/O - bank assignment per Stratix Device Handbook Volume 1 |
| Pin B1 | I/O Bank 1 — User I/O - bank assignment per Stratix Device Handbook Volume 1 |
| Pin C1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin D1 | GND — Ground reference |
| Pin E1 | nCONFIG — Configuration control (active-low) |
| Pin F1 | MSEL0 — Configuration mode select |
| Pin G1 | MSEL1 — Configuration mode select |
| Pin H1 | MSEL2 — Configuration mode select |
| Pin J1 | nCE — Chip enable (active-low) |
| Pin K1 | DCLK — Configuration clock input |
| Pin L1 | DATA0 — Configuration data input |
| Pin M1 | nSTATUS — Configuration status (active-low) |
| Pin N1 | CONF_DONE — Configuration done (open-drain) |
| Pin P1 | VCCINT — Core voltage 1.5 V |
| Pin R1 | VCCINT — Core voltage 1.5 V |
| Pin T1 | GND — Ground reference |
| Pin U1 | PLL1_VCCA — PLL1 analog supply |
| Pin V1 | PLL1_VCCD — PLL1 digital supply |
| Pin W1 | CLK1 — Clock input pin 1 |
| Pin Y1 | CLK2 — Clock input pin 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020C5 is suitable for 6 applications: Telecom Baseband Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Bridging and Protocol Conversion, Industrial Control and Automation Logic, Military and Aerospace Digital Signal Chains, Medical Imaging and Diagnostic Equipment.
Telecom Baseband Signal Processing
The EP1S40F1020C5 fits telecom baseband signal processing because it delivers 41,250 logic elements, dedicated DSP blocks for fixed-point arithmetic, and 3.4 Mbits of embedded TriMatrix memory on a 130 nm process that supports up to 500 MHz internal clock. Its 773 user I/Os and 1020-ball FC-FBGA package enable wide external memory buses and parallel backplane attachment, while deterministic parallel processing outperforms microcontrollers in latency-sensitive channel decoding, modulation, and forward-error-correction paths. Placed on a baseband card alongside external DDR/QDR memory and high-speed ADC/DAC pairs, the EP1S40F1020C5 handles multi-carrier waveforms at full line rate. Designers benefit from Altera's Quartus II design flow with IP cores for FFT, Viterbi, and Turbo decoders.
Recommended
ASIC Prototyping and Emulation
The EP1S40F1020C5 is well suited as an ASIC prototyping vehicle because its 41,250 logic elements, 4,125 LABs, and embedded memory closely approximate the gate count and timing characteristics of mid-complexity ASIC designs. Designers partition the ASIC RTL across one or more Stratix devices using Altera's MultiPoint or HSDC prototyping flow, with the 773 I/Os enabling pin-multiplexing across multiple FPGAs. The 1020-ball FC-FBGA package supports high-fanout signal integrity for multi-board stacks, and the 130 nm process delivers timing predictability that correlates well with the target ASIC technology node. Compared to a custom ASIC, the EP1S40F1020C5 shortens bring-up from months to weeks.
Recommended
High-Speed Serial Bridging and Protocol Conversion
The EP1S40F1020C5 is appropriate for high-speed serial bridging because it supports LVDS, LVTTL, LVCMOS, SSTL, HSTL, and PCI I/O standards across 773 user I/Os, plus dedicated PLL-based clock management for jitter-sensitive serial links. The 130 nm Stratix architecture integrates logic, memory, and I/O SERDES capability suitable for protocol conversion between SPI, I2C, RapidIO, parallel LVDS buses, and custom backplane formats. Placed between an ASIC/ASSP source and a downstream processor, the EP1S40F1020C5 functions as a transparent bridge while the 1020-ball FC-FBGA package preserves signal integrity on dense multi-lane layouts. Designers value the deterministic parallel latency for real-time protocol translation.
Recommended
Industrial Control and Automation Logic
The EP1S40F1020C5 fits industrial control applications because its 41,250 logic elements provide ample headroom for motion-control state machines, encoder decoding, and deterministic I/O handling in PLC and CNC environments. The commercial temperature grade 0C to +85C is appropriate for factory-floor enclosures, and the 1020-ball FC-FBGA package supports the high pin count needed to drive parallel motor-driver and resolver interfaces. Compared to a microcontroller, the EP1S40F1020C5 executes control loops in parallel hardware with deterministic latency, eliminating software jitter. The industrial EP1S40F1020I6 variant extends operating temperature to -40C to +100C for harsher environments.
Recommended
Military and Aerospace Digital Signal Chains
The EP1S40F1020C5 is suitable for military and aerospace digital signal chains because its 41,250 logic elements, embedded DSP blocks, and TriMatrix memory deliver the throughput required for radar, electronic-warfare, and secure-communication preprocessing. While the commercial temperature grade is the most common stocking option, the industrial EP1S40F1020I6 variant meets -40C to +100C operating ranges, and franchised-stock distributors such as Rochester Electronics supply traceability paperwork for defense programs. The 1020-ball FC-FBGA package supports the high pin density needed for parallel ADC/DAC fan-out, and Stratix I timing predictability helps meet DO-254 and MIL-STD-461 design assurance objectives.
Recommended
Medical Imaging and Diagnostic Equipment
The EP1S40F1020C5 fits medical imaging pipelines because its 41,250 logic elements and dedicated DSP blocks deliver the parallel throughput required for ultrasound beamforming, MRI reconstruction, and CT image preprocessing. The 3.4 Mbits of TriMatrix memory acts as line buffers and coefficient storage for FIR/IIR filter chains, while the 773 I/Os interface to multi-channel ADC front-ends and high-resolution display outputs. Designers leverage Altera's reference designs for medical imaging DSP to accelerate development, and the 1020-ball FC-FBGA package preserves signal integrity for low-noise analog integration. Compared to a DSP processor, the EP1S40F1020C5 achieves higher frame rates at lower latency.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S60F1020C5 | EP1S40F1020C6 | EP1S40F1020C7 | EP1S40F1020I6 | EP1S30F1020C5 | EP1S25F1020C5 |
|---|---|---|---|---|---|---|---|
| Package | 1020-BGA (FC-FBGA, 33x33 mm) | 1020-BGA (FC-FBGA, 33x33 mm) - same | 1020-BGA (FC-FBGA, 33x33 mm) - same | 1020-BGA (FC-FBGA, 33x33 mm) - same | 1020-BGA (FC-FBGA, 33x33 mm) - same | 1020-BGA (FC-FBGA, 33x33 mm) - same | 1020-BGA (FC-FBGA, 33x33 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 41,250 | 57,120 (+38%) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 33,250 (-19%) | 25,660 (-38%) |
| Speed Grade | C5 | C5 | C6 (faster) | C7 (fastest) | I6 (industrial temp) | C5 | C5 |
| User I/Os (max) | 773 | 773 (same) | 773 (same die) | 773 (same die) | 773 (same die) | 726 (slightly fewer) | [DATA_NEEDED] |
| Core Voltage | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V | 1.425 V - 1.575 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Family | Stratix I | Stratix I | Stratix I | Stratix I | Stratix I | Stratix I | Stratix I |
Key Differentiators
- Highest-density Stratix I variant in the 1020-ball FC-FBGA package (vs EP1S30F1020C5)
- Same footprint across the entire Stratix I 1020-ball family (vs EP1S40F1020C6 / C7 / I6)
- Stratix I architecture with TriMatrix memory and DSP blocks (vs Cyclone IV EP4CE115F29 (not pin-compatible))
Design Notes
Estimated: the EP1S40F1020C5 at 500 MHz internal clock and typical toggle activity of 20% draws roughly 4 W to 6 W of core power (VCCINT at 1.5 V), plus I/O bank power from VCCIO supplies. Designers should budget at least three independent rails (VCCINT, VCCIO, VCCPD) with bulk decoupling of 100 uF per rail and high-frequency 0.1 uF / 1 nF ceramics at every supply pin per Altera's Stratix Device Handbook decoupling guidelines.
Estimated: at 6 W dissipation in the 1020-ball FC-FBGA package (typical theta_JA around 12 C/W with 4-layer JEDEC test board), the junction rises 72 C above ambient. A heatsink is not normally required at commercial ambient (0C to +85C), but the board layout must include a solid ground/power plane under the BGA to spread heat. For industrial-grade deployments using EP1S40F1020I6, verify that junction temperature remains below 100 C at maximum ambient.
Use a minimum 4-layer PCB with continuous VCCINT and GND planes beneath the 1020-ball FC-FBGA, and breakout vias on a 1 mm pitch to maintain manufacturability. All VCCIO bank supplies must be decoupled at the package edge with 0.1 uF + 10 uF ceramic pairs. Configuration pin pull-up/pull-down resistors (nCE, MSEL, nCONFIG) must follow the Altera reference schematic exactly to avoid configuration failures at power-up.
Do not substitute a Stratix I EP1S40F1020C5 with a Cyclone IV or Stratix IV device - the package pinouts are completely different. Confirm the configuration mode (AS, PS, JTAG) by tying MSEL[2:0] to the correct levels per the Stratix Device Handbook, and verify that all PLL analog supplies (VCCA, VCCD) are filtered with a ferrite bead and decoupled to a quiet analog ground. Hot-socketing the EP1S40F1020C5 is NOT supported - sequence all rails in the proper order (VCCINT first, VCCIO second, VCCPD last).
Compliance Information
RoHS / REACH / lead-free status not explicitly stated in the verified web data. As a 130 nm Stratix I device originally released before the RoHS transition, full compliance documentation should be requested from Intel / Altera franchised distributors such as Rochester Electronics.
