EP1S40F1020C5AA - Stratix 41K LE FPGA, 1020-FBGA, 130nm | Intel
MPN: EP1S40F1020C5AA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $218.75 | $109,375.00 |
| 1,000 | $195.4 | $195,400.00 |
Drop-in alternatives for EP1S40F1020C5AA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1S40F1020C5AA Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423 Kbit |
| Maximum User I/O | 773 |
| DSP Blocks | 14 |
| PLLs | 4 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Package | 1020-ball FC-FBGA |
| Operating Temperature | 0 °C to +85 °C (Commercial) |
| Speed Grade | C5 |
| Mounting Type | Surface Mount (BGA) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) |
EP1S40F1020C5AA 1020-ball fc-fbga Pin Configuration Guide
Complete pinout information for EP1S40F1020C5AA (1020-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1020C5AA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1020C5AA is suitable for 6 applications: Software-Defined Radio (SDR) Baseband Processing, High-Speed Data Acquisition Front-End, Video Broadcast and Image Processing Pipelines, ASIC Prototyping and Emulation, Network Packet Inspection Engine, Industrial Motor Control and Drive Systems.
Software-Defined Radio (SDR) Baseband Processing
The EP1S40F1020C5AA fits SDR baseband designs because its 41,250 logic elements plus 14 dedicated DSP blocks deliver the parallel multiply-accumulate throughput needed for multi-channel FFT and channelization filters. With 3,423 Kbit of embedded block RAM, designers can stage large FFT windows on-chip without external memory round-trips, reducing latency in real-time demodulation chains. Its 773 user I/Os accommodate parallel ADC/DAC data buses plus QDR/DDR sample buffers. The four PLLs synthesize independent sample-rate domains for ADC, FPGA fabric, and backplane interfaces. Compared with a DSP processor, the parallel fabric executes baseband at sample rates that would otherwise demand multiple fixed-function ASICs.
Recommended
High-Speed Data Acquisition Front-End
In data acquisition systems, the EP1S40F1020C5AA's 773 user I/Os and LVDS support let it aggregate multiple parallel ADC lanes at hundreds of MSPS each, performing decimation and triggering in fabric. The 14 DSP blocks provide hardware-accelerated FIR filters that compress data rates before downstream storage. With 3,423 Kbit of block RAM, designers implement deep FIFO buffers to absorb burst captures. The 1.5 V core and 130 nm process deliver the deterministic latency required by phased-array and radar front-ends. Quartus II's TimeQuest timing analyzer closes multi-channel paths across the same die.
Recommended
Video Broadcast and Image Processing Pipelines
The EP1S40F1020C5AA handles HD-SDI and DVB-ASI video processing pipelines because its fabric sustains multi-format scaling, de-interlacing, and color-space conversion at real-time rates. The 773 I/Os interface directly to BT.656, BT.1120, and HD-SDI serializers without external bridge logic, while 3,423 Kbit of block RAM store line and frame buffers for scaling engines. The 14 DSP blocks accelerate 2D filter kernels for noise reduction and sharpening. Designers use the Quartus II SOPC Builder to integrate Nios II soft processors for system control alongside the video datapath.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping benefits from the EP1S40F1020C5AA's 41,250 logic elements and abundant block RAM, which let designers partition large SoC designs across multiple Stratix devices in a multi-FPGA emulation farm. The 773 user I/Os support high-pin-count ASIC-to-FPGA partitioning with LVDS and HSTL signaling to external connectors. SRAM-based configuration enables rapid design iteration - re-program in seconds via JTAG without pulling the board. The Quartus II LogicLock feature lets engineers create repeatable, timing-closed blocks across builds, accelerating verification of RTL and gate-level netlists.
Recommended
Network Packet Inspection Engine
Network equipment uses the EP1S40F1020C5AA to accelerate deep packet inspection at wire speed because its 41,250 LEs run hundreds of parallel pattern-match engines simultaneously. The 3,423 Kbit of block RAM stores compiled regex state machines and TCAM emulations, while the 14 DSP blocks accelerate hash computations for flow tables. The 773 I/Os interface to multiple SPI-4.2 or SGMII links without external bridge ASICs. The four PLLs generate the multiple clock domains needed for ingress, fabric, and egress paths, all within the same Stratix die.
Recommended
Industrial Motor Control and Drive Systems
The EP1S40F1020C5AA suits high-end industrial motor drives because its parallel fabric executes field-oriented control (FOC) algorithms, space-vector PWM, and encoder decoding in single-digit microsecond loop times. The 14 DSP blocks accelerate Park/Clarke transforms and PI controllers, while the 3,423 Kbit block RAM stores sine/cosine lookup tables and current-loop state. The 773 I/Os interface to resolver-to-digital converters, gate drivers, and brake chopper logic without external glue. Designers implement safety logic and fault handling alongside the control loop, all on one die.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1020C5AA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020C5 | EP1S40F1020C5N | EP1S40F1020C6 | EP1S40F1020C7 | EP1S30F1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 41,250 | 41,250 (same) | 41,250 (same) | 41,250 (same) | 41,250 (same) | 32,470 (-21%) |
| Speed Grade | C5 | C5 (same) | C5 (same) | C6 (faster) | C7 (fastest) | C5 (same) |
| Operating Temperature | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) | 0 to +85 °C (Commercial) |
| Embedded Memory (Kbit) | 3,423 | 3,423 (same) | 3,423 (same) | 3,423 (same) | 3,423 (same) | [DATA_NEEDED] |
| DSP Blocks | 14 | 14 (same) | 14 (same) | 14 (same) | 14 (same) | [DATA_NEEDED] |
| Lead-Free (N suffix) | Unknown | Unknown | Yes (N suffix) | Unknown | Unknown | Unknown |
| Lifecycle Status (2026) | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Drop-in compatibility with the entire Stratix EP1S40F1020 family (vs EP1S40F1020C5N)
- Higher Fmax available within same package for timing-critical designs (vs EP1S40F1020C7)
- Industrial temperature variant in the same footprint (vs EP1S40F1020I6)
Design Notes
The 1020-ball FC-FBGA package requires a minimum of 8 PCB layers with dedicated ground and power planes. Use 0.4 mm ball pitch escape routing with micro-via stack-ups (laser-drilled 0.1 mm vias) to fan out from the BGA. Intel's AN 471 layout guideline recommends 1-oz copper on outer layers and continuous reference planes beneath the package to control impedance for LVDS pairs at 1 Gbps and above.
The EP1S40F1020C5AA requires multiple supply rails: VCCINT (1.5 V core), VCCIO (banked 1.5/1.8/2.5/3.3 V per I/O bank), VCCPD (3.3 V pre-drive), VCCA_PLL (1.5 V analog PLL), and VCCBAT (battery backup for configuration RAM). Intel recommends a power-on sequence with VCCINT before VCCIO; violation can trigger high in-rush current and latch-up. Place 100 nF X7R decoupling within 5 mm of every supply ball, plus bulk 220 µF polymer tantalum capacitors near each rail.
At typical 130 nm Stratix utilization (~70% LEs at 250 MHz), estimate core dissipation of 5-8 W. With a FC-FBGA theta-JA of approximately 12-15 °C/W on a JEDEC 8-layer test board, junction temperature rises 60-120 °C above ambient. For enclosed industrial enclosures, design for at least 600 LFM airflow or attach a heatsink via the thermal pad exposed on the package top surface. Always validate thermal performance in the final enclosure, not on the bench.
Avoid configuring the EP1S40F1020C5AA with a bitstream designed for a different speed grade - Quartus II generates timing-closed bitstreams per speed grade, and swapping C5/C6/C7 bitstreams may cause hold-time failures. Also, the device is SRAM-volatile: a power glitch without proper power-sequencing corrupts the configuration, requiring re-load from an external EPC or EPCQ configuration PROM via the JTAG or FPP (Fast Passive Parallel) port. Always include a watchdog supervisor on VCCINT to force reconfiguration on brown-out.
For LVDS pairs at 840 Mbps or above, maintain 100 Ω differential impedance with matched-length traces (within 20 mil). Use IBIS-AMI simulation in Quartus II's SignalTap or external tools like Mentor HyperLynx to validate eye-diagram margins before sign-off. SSTL-2/SSTL-18 class II outputs driving DDR memories require external 25-50 Ω series damping resistors placed within 6 mm of the FPGA pin to suppress ringing on long stub traces.
Compliance Information
RoHS, REACH, and lead-free status not explicitly stated in the verified distributor listings for EP1S40F1020C5AA; the N-suffix variants (e.g. EP1S40F1020C5N) are explicitly lead-free. AEC-Q100 is not applicable - this is a high-density FPGA, not an automotive-grade qualified IC. Conflict minerals compliance not verified from distributor data; consult Intel's product content disclosure for authoritative answers.
