EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel
部品番号: EP1SGX10CF672C7GA ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 250 | $213.75 | $53,437.50 |
| 500 | $199.5 | $99,750.00 |
EP1SGX10CF672C7GA 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream. Within the semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, FPGAs achieve true hardware parallelism and deterministic timing, and unlike ASICs, they require no fabrication step. The Stratix GX family in particular adds high-speed transceivers, positioning it in the signal-integrity tier of programmable logic used for bridging, protocol conversion, and DSP pipelines.
Key features include 14 embedded DSP blocks, 8 phase-locked loops for clock management, 362 maximum user I/O, and 12 high-speed GX transceivers supporting multi-gigabit serial protocols. The 672-pin FBGA package provides a high-density interconnect solution, enabling dense PCB designs while supporting both single-ended and differential signaling standards including LVDS, LVTTL, and SSTL.
The device is fabricated on a 130nm process node and integrates dedicated multiplier blocks, on-chip RAM organized as M4K/M-RAM memory, and supports in-system programmability through JTAG or Active Serial configuration interfaces. The 'C7' speed grade balances timing margin against power consumption, while the 'GA' suffix denotes lead-free / RoHS-compliant packaging with NiPdAu ball finish.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), communications infrastructure line cards, industrial imaging and video processing, custom DSP coprocessors, and military/aerospace signal processing. The combination of logic density, memory bandwidth, and GX transceivers makes it well suited for protocols requiring both parallel data paths and serialized physical-layer links.
When designing with this device, pay close attention to power sequencing—the core and I/O rails have specific ramp-rate requirements detailed in the datasheet. Use the Quartus II design toolchain (legacy versions 6.0 through 9.1 support this device family) for synthesis, place-and-route, and timing closure; SignalTap II logic analyzer integration allows real-time verification on the bench.
This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers source and integrate legacy Stratix GX FPGAs.
ドロップイン代替品: EP1SGX10CF672C7GA — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX10CF672C7GA （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, RoHS Status, Package Dimensions.
クイック比較ツール — 並列比較する代替部品を選択:
EP1SGX10CF672C7
✅ ドロップイン✓ 在庫あり
$185 / 個
データシートを見る →EP1SGX10CF672C6N
✅ ドロップイン✓ 在庫あり
$152 / 個
データシートを見る →EP1SGX10CF672C6
✅ ドロップイン✓ 在庫あり
$158 / 個
データシートを見る →EP1SGX10CF672C6NGA
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP1SGX10CF672I7N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP1SGX10CF672C7GA 最大定格＆電気的特性
| Family | Stratix GX |
| Logic Elements | 10,570 |
| Total Memory Bits | 920,448 bits |
| User I/O Count (max) | 362 |
| パッケージ | 672-FBGA |
| Number of LABs/CLBs | 1057 |
| Total RAM Bits | 920,448 |
| 動作温度 | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.5 V |
| Speed Grade | C7 |
| RoHS ステータス | Compliant (GA suffix) |
| 実装タイプ | Surface Mount (BGA) |
| Process Node | 130 nm |
| Configuration Method | JTAG, Active Serial, Passive Serial |
| MSLレベル | 3 (per JEDEC J-STD-020, reflow at 245C) |
EP1SGX10CF672C7GA 672-fbga ピン配置ガイド
EP1SGX10CF672C7GA (672-fbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX10CF672C7GA.
詳細は データシート をご参照ください。
主な用途
EP1SGX10CF672C7GA の用途: 6 件s: Serial Interface Bridging (PCI Express, Serial RapidIO), Communications Infrastructure Line Cards, Custom DSP Coprocessor (Filter, FFT, Modulation), Industrial Imaging and Video Processing, Legacy System Maintenance and Industrial Controls, Aerospace and Defense Signal Processing.
Serial Interface Bridging (PCI Express, Serial RapidIO)
The EP1SGX10CF672C7GA's integrated GX transceivers and 10,570 logic elements make it well suited for bridging between serial protocols such as PCI Express x1/x4 and Serial RapidIO in telecom and embedded systems. The transceiver blocks handle multi-gigabit serialization-deserialization (SERDES) at line rates up to 3.125 Gbps, while the 1057 LABs implement the protocol stack (transaction layer, data link layer) and endpoint logic. With 920 Kbit of embedded memory for packet buffering, the device can sustain line-rate throughput without external SRAM. Source: Stratix GX family datasheet.
おすすめ
Communications Infrastructure Line Cards
In telecom line cards, the EP1SGX10CF672C7GA implements custom packet processing, traffic shaping, and framer functions alongside standard PHY interfaces. Its 362 user I/Os provide ample parallel connectivity to backplane buses, while the 1.5V core and dedicated PLL clock tree support deterministic latency for synchronous Ethernet and OTN framing. The 672-FBGA package's high pin density suits ATCA/AdvancedMC form factors. Design tip: use Quartus II TimeQuest timing analyzer to close timing on multi-clock domain designs typical in line cards. Source: Stratix GX handbook.
おすすめ
Custom DSP Coprocessor (Filter, FFT, Modulation)
The 14 embedded DSP blocks in the EP1SGX10CF672C7GA deliver up to 14 GigaMACs/s of 18x18 multiply-accumulate throughput, sufficient for mid-rate FFTs (up to 1024 points), FIR filter banks, and digital up/down-conversion (DUC/DDC) for software-defined radio. The 920 Kbit on-chip RAM acts as a coefficient store, eliminating external memory accesses. The 1057 LABs implement the control state machine and address generation logic. For higher DSP throughput, consider EP1S60 or EP1S80 family parts. Source: Stratix GX DSP block architecture.
おすすめ
Industrial Imaging and Video Processing
The EP1SGX10CF672C7GA's 362 user I/Os and abundant logic suit real-time image processing pipelines for machine vision and video surveillance. Implement Bayer demosaic, color space conversion, and edge detection directly in LABs while using on-chip memory as line buffers. The C7 speed grade supports pixel clock rates up to 133 MHz, sufficient for 1080p60 input. The commercial 0C to +85C operating range is adequate for indoor industrial enclosures. Source: Altera video reference designs.
おすすめ
Legacy System Maintenance and Industrial Controls
Many deployed industrial systems (CNC controllers, test equipment, medical imaging) are built around Stratix GX FPGAs. The EP1SGX10CF672C7GA serves as a maintenance replacement for field repairs, where requalifying with a new FPGA family would require costly revalidation. The 672-FBGA package matches the original PCB footprint, and the C7 speed grade preserves timing margins. Source: distributor listings and end-equipment manufacturer bills-of-materials. Industrial users should stock last-time-buy inventory.
おすすめ
Aerospace and Defense Signal Processing
In defense electronics, the EP1SGX10CF672C7GA performs signal intelligence (SIGINT) preprocessing, radar pulse compression, and electronic warfare (EW) jamming waveform generation. Its deterministic latency and on-chip DSP enable real-time processing of high-bandwidth RF data. The 130nm process provides proven reliability for long-lifecycle programs. Note: the commercial temperature grade (0C to +85C) is suitable for ground-based and shipboard systems; airborne applications require EP1SGX10 industrial or military temperature grades. Source: defense industry FPGA application notes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX10CF672C7GA — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1SGX10CF672C7 | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX10CF672C6NGA | EP1SGX10CF672I7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | C7 | C7 (same) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | I7 (industrial temp, same speed bin as C7) |
| Logic Elements | 10,570 | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) |
| Memory Bits | 920,448 | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Ball Finish / RoHS | NiPdAu (GA suffix) - RoHS | SnPb (leaded) - not RoHS | NiPdAu (N suffix) - RoHS | SnPb (leaded) - not RoHS | NiPdAu (N+GA suffix) - RoHS | NiPdAu (N suffix) - RoHS |
| User I/O Count (max) | 362 | 362 | 362 | 362 | 362 | 362 |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) |
主な差別化要因
- Lead-free RoHS-compliant ball finish （vs EP1SGX10CF672C7 (leaded))
- C7 speed grade for highest performance （vs EP1SGX10CF672C6NGA (C6 speed))
- Commercial temperature range lowest cost （vs EP1SGX10CF672I7N (industrial -40C to +100C))
- 10,570 LEs in 672-FBGA: balanced density and I/O （vs EP1S25F672C7 (Stratix non-GX, 25,560 LEs))
設計ノート
The 672-FBGA package requires thermal management at high toggle rates. Estimated: at 10,570 LEs switching at 200 MHz with 50% utilization, junction-to-ambient thermal resistance (theta_JA) of approximately 11 C/W on a 4-layer JEDEC test board yields 1.1 C/W per Watt; expect junction temperature rise of 22-33 C above ambient for typical 2-3W dissipation. For dense designs exceeding 4W, attach a heatsink with thermal interface material (TIM) and ensure at least 4 thermal vias under the BGA. Source: Stratix GX thermal management application note.
The EP1SGX10CF672C7GA requires multiple supply rails: 1.5V VCCINT (core), 3.3V VCCIO (I/O), 1.2V VCCPD (pre-driver), 1.5V/1.8V/2.5V/3.3V VCCPD references, and transceiver-specific VCCA (analog). Power-on sequencing requires VCCINT to ramp before VCCIO; refer to the Stratix GX handbook chapter on power management. Estimated: total quiescent power for a typical 50% utilization design is approximately 4-6W; fully loaded designs may exceed 8W. Use the Early Power Estimator (EPE) spreadsheet in Quartus II for accurate pre-layout power budgets. Source: Stratix GX power management chapter.
The 672-FBGA has a 1.0mm ball pitch, requiring 4-layer minimum PCB with 0.5oz copper and 0.20mm via pad design. Use microvia (laser-drilled) stack-up to fan out inner-row balls. Keep differential pair traces for GX transceivers at 100 ohm differential impedance with matched length to within 150 mil. Source: Altera 672-FBGA layout reference design.
Common pitfalls with EP1SGX10CF672C7GA: (1) Using Quartus Prime instead of legacy Quartus II - the Stratix GX device support was dropped after v9.1, and modern Quartus will not recognize this device; (2) Connecting JTAG TCK at <10 MHz on long traces - may cause configuration failures; (3) Missing MSL3 bake before assembly - FBGA packages absorb moisture and can fail at reflow; (4) Forgetting to set CONFIG_VCCIO voltage to 3.3V - prevents Active Serial configuration. Source: Stratix GX configuration handbook.
Decoupling: place 0.1uF X7R ceramic bypass capacitors at every VCCINT, VCCIO, and VCCA pin with trace length under 100 mil. Add 10uF bulk tantalum or ceramic caps adjacent to each supply island. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and 10uF + 0.1uF capacitor network; shared routing with switching supplies causes PLL jitter. Source: Stratix GX decoupling recommendations application note.
コンプライアンス情報
RoHS compliance per Altera/Intel product documentation (GA suffix). REACH compliance not explicitly stated in distributor data - inferred from RoHS compliance. AEC-Q100 not applicable (FPGA, not automotive-qualified). Halogen-free status unknown - not in provided data. Conflict minerals compliance per Intel corporate policy.
