EP1SGX10CF672C6N - Stratix GX FPGA, 10,570 Cells, 672-FBGA | Intel
MPN: EP1SGX10CF672C6N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 25 | $215 | $5,375.00 |
| 100 | $178 | $17,800.00 |
| 250 | $152 | $38,000.00 |
Drop-in alternatives for EP1SGX10CF672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX10CF672C7N
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$182.1 / Unit
View Datasheet →EP1SGX10CF672C5N
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EP1SGX10DF672C7N
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View Datasheet →EP1SGX25CF672C6N
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$210 / Unit
View Datasheet →EP1SGX25CF672C7N
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$338.5 / Unit
View Datasheet →EP1S25F672C6N
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$192.75 / Unit
View Datasheet →EP1SGX10CF672C6N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Family | CMOS, SRAM-based FPGA |
| Process Technology | 130 nm |
| Number of Logic Cells | 10,570 |
| Number of LABs/CLBs | 1,057 |
| Total RAM Bits | 920,448 |
| Number of I/O | 362 |
| Supply Voltage (Core) | 1.5 V |
| Operating Temperature | 0 °C to 85 °C |
| Package Type | 672-BBGA / FineLine FBGA |
| Package Dimensions | 33 × 33 mm, 1.0 mm pitch |
| Pin/Ball Count | 672 |
| Mounting Type | Surface Mount |
| Maximum Frequency | 500 MHz |
| Speed Grade | C6 (mid-tier) |
| RoHS Status | Lead-free (N suffix) |
EP1SGX10CF672C6N 33 × 33 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX10CF672C6N (33 × 33 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX10CF672C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX10CF672C6N is suitable for 6 applications: 1G/2G/4G Backplane Interface, SONET/SDH Framer Implementation, PCIe Gen1 Endpoint, High-Speed Test & Measurement, Serial RapidIO Switch Fabric, Fibre Channel Host Bus Adapter.
1G/2G/4G Backplane Interface
The EP1SGX10CF672C6N's embedded 3.125 Gbps-class multi-gigabit transceivers make it a natural fit for 1G/2G/4G serial backplane interfaces in 2004-2008 era telecom switching and routing equipment. The device supports multiple transceiver channels per row with integrated 8B/10B encoding, word alignment, and clock data recovery, eliminating external SERDES PHY chips. With 10,570 logic cells and 920 Kbit of TriMatrix RAM, it can implement MAC-layer processing, channel bonding, and link-layer state machines on a single device. For backplane designs the FPGA typically interfaces to line-card ASICs via XAUI (4 × 3.125 Gbps) or to SFP modules directly via SFI. Designers should allocate at least 4 transceiver channels plus reference clocking and pay close attention to PCB channel loss budgets at 3.125 Gbps.
Recommended
SONET/SDH Framer Implementation
The EP1SGX10CF672C6N was widely deployed in SONET OC-48 / SDH STM-16 framer designs operating at 2.488 Gbps, where its transceiver channels and DSP blocks provided the necessary overhead processing, scrambling/descrambling, and pointer-adjustment state machines. The 10,570 logic cells are sufficient to implement a single OC-48 framer with full TOH (Transport Overhead) and POH (Path Overhead) processing, while 920 Kbit of embedded RAM accommodates multiple frame buffers. The 362 user I/Os connect to backplane framers, clock recovery units, and telecom backplane serializers. Compared to ASIC implementations, the FPGA offered faster time-to-market for emerging GFP (Generic Framing Procedure) and LCAS (Link Capacity Adjustment Scheme) standards.
Recommended
PCIe Gen1 Endpoint
The EP1SGX10CF672C6N can implement a PCIe Gen1 (2.5 Gbps) endpoint with x1 or x4 lane configurations using its embedded transceivers plus the PCIe hard IP block available in the Stratix GX family. The device's 362 user I/Os provide ample connectivity for application-layer interfaces to memory (DDR/DDR2), host processors, or custom peripherals. Typical applications include instrumentation cards, video capture boards, and storage controllers. Designers must use the Stratix GX PCIe Hard IP Compiler and pay careful attention to transmit pre-emphasis and receive equalization settings to meet PCIe channel compliance. The 672-BGA package's 1.0 mm pitch supports the BGA escape required for x4 PCIe lane routing.
Recommended
High-Speed Test & Measurement
The EP1SGX10CF672C6N is well-suited for high-speed test and measurement instruments including logic analyzers, protocol analyzers, and BERT (Bit Error Rate Tester) equipment. Its multi-gigabit transceivers handle 3.125 Gbps data capture, while the 10,570 logic cells and DSP blocks implement pattern generation, error counting, and protocol-aware decoding. The 920 Kbit of embedded RAM provides deep capture buffers for protocol analysis, and the 362 user I/Os interface to high-speed ADCs, DACs, and display controllers. The commercial 0°C to 85°C operating range is adequate for laboratory environments, and the 672-BGA package supports thermal management via BGA-bottom thermal pad attachment for sustained measurement workloads.
Recommended
Serial RapidIO Switch Fabric
Serial RapidIO (sRIO) switch fabrics and endpoint devices were a common deployment of the EP1SGX10CF672C6N in wireless base station and DSP-cluster applications circa 2005-2010. The FPGA's transceivers support sRIO 1x/4x lane configurations at 1.25 / 2.5 / 3.125 Gbps, while the logic fabric implements the logical, transport, and physical layer functions plus DMA engines and message-passing state machines. With 10,570 logic cells, the device serves as either a 4-port sRIO switch or a single-port endpoint with substantial DSP co-processing. The 672-BGA package's signal integrity characteristics are well-matched to sRIO channel requirements, though designers must still apply Tx pre-emphasis and Rx equalization per the sRIO spec.
Recommended
Fibre Channel Host Bus Adapter
The EP1SGX10CF672C6N enables 1 Gbps / 2 Gbps / 4 Gbps Fibre Channel Host Bus Adapter (HBA) designs by combining its multi-gigabit transceivers with custom FC protocol logic implemented in the FPGA fabric. The device supports FC-AL and FC-SW topologies, including primitives, classes of service, and credit-based flow control. With 920 Kbit of embedded RAM, the device can buffer FC frames and implement scatter-gather DMA engines. Typical deployments include RAID controllers, storage area network appliances, and enterprise tape backup systems. The 672-BGA package's high pin count accommodates the parallel PCI/PCI-X bus interface to the host CPU alongside the high-speed serial FC link.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX10CF672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX10CF672C7N | EP1SGX10CF672C5N | EP1SGX10DF672C7N | EP1SGX25CF672C6N | EP1S25F672C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-BBGA (CF672) 33×33 mm | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BBGA (CF672) 33×33 mm — same | 672-BGA (FineLine BGA) — same |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix (non-GX) |
| Logic Cells | 10,570 | 10,570 | 10,570 | 10,570 | ~25,000 | ~25,000 |
| Speed Grade | C6 (mid-tier) | C7 (faster) | C5 (slower) | C7 (faster) | C6 (mid-tier) | C6 (mid-tier) |
| Embedded Transceivers | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | Yes (3.125 Gbps-class) | No (Stratix non-GX) |
| User I/Os | 362 | 362 | 362 | 362 | 362 | [DATA_NEEDED] |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
Key Differentiators
- Mid-tier performance with good power-performance balance (vs EP1SGX10CF672C7N)
- Density upgrade path within same PCB footprint (vs EP1SGX25CF672C6N)
- Embedded multi-gigabit transceivers in 130 nm process (vs EP1S25F672C6N (non-GX))
Design Notes
The 672-BGA FineLine package at 1.0 mm pitch requires careful PCB stackup design. Use at least a 4-layer board with a dedicated ground plane immediately below the BGA, and 6+ layers for high-speed transceiver routing. Microvia or laser-drilled via-in-pad technology is recommended for inner-row BGA breakout. Maintain 50 Ω single-ended and 100 Ω differential impedance for transceiver lanes and reference clocks. Route transceiver differential pairs with matched length (within 5 mil) and minimize the number of vias — each via discontinuity contributes ~1 dB loss at 3.125 Gbps.
Estimated: The 672-BGA package dissipates 5-8 W typical, 12-15 W worst-case with all transceivers active at full utilization. With the standard BGA thermal pad (EP) soldered to a 4-layer PCB with 1 oz copper inner planes, theta_JA is approximately 15-18 °C/W, yielding a junction temperature rise of 75-135 °C above ambient. For continuous full-power operation, attach a heatsink via thermal interface material to the package top, or use forced-air cooling. Compute junction temperature as TJ = TA + (PD × θJA) and verify it remains below 125 °C (commercial limit).
The 1.5 V VCCINT supply must deliver 3-5 A typical, peaking higher during configuration flash erase. Use a low-impedance regulator (e.g., LDO with <50 mV dropout) and place decoupling capacitors as close as possible to the BGA balls — typically 100 nF X7R per VCCINT/GND pair, plus bulk 10-47 µF tantalum or polymer capacitors. VCCIO supplies (typically 3.3 V, 2.5 V, 1.8 V for mixed I/O standards) require similar decoupling. Power sequencing: VCCINT should reach 1.5 V before VCCIO ramps, per the Stratix GX handbook, to avoid I/O latch-up during power-up.
For multi-gigabit transceiver channels at 3.125 Gbps, apply Tx pre-emphasis and Rx equalization settings per the Stratix GX Handbook Chapter 7. Typical settings: Tx pre-emphasis = 25-40% for short-reach backplane channels, Rx equalization = medium-high for FR4 traces > 10 inches. Use IBIS-AMI models (available from Intel) for channel simulation in tools like HyperLynx or ADS. Add AC-coupling capacitors (0.01 µF) in series on each transceiver RX/TX lane — never DC-couple the high-speed serial links. Reference clock jitter must be < 1 ps RMS for reliable 3.125 Gbps link acquisition.
Compliance Information
RoHS compliant per 'N' suffix designation. Commercial temperature grade 0°C to 85°C — not AEC-Q100 qualified for automotive. Halogen-free status not explicitly stated in datasheet — marked 'unknown' per data authenticity rules. Last-time-buy lifecycle status as of 2026-09-07.
