EP1SGX10CF672C7GA - Stratix GX FPGA, 10,570 LEs, 672-FBGA | Intel
N.º da peça: EP1SGX10CF672C7GA ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 250 | $213.75 | $53.437,50 |
| 500 | $199.5 | $99.750,00 |
EP1SGX10CF672C7GA Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream. Within the semiconductor taxonomy, FPGAs sit between fixed-function ASICs and microcontrollers: unlike microcontrollers, FPGAs achieve true hardware parallelism and deterministic timing, and unlike ASICs, they require no fabrication step. The Stratix GX family in particular adds high-speed transceivers, positioning it in the signal-integrity tier of programmable logic used for bridging, protocol conversion, and DSP pipelines.
Key features include 14 embedded DSP blocks, 8 phase-locked loops for clock management, 362 maximum user I/O, and 12 high-speed GX transceivers supporting multi-gigabit serial protocols. The 672-pin FBGA package provides a high-density interconnect solution, enabling dense PCB designs while supporting both single-ended and differential signaling standards including LVDS, LVTTL, and SSTL.
The device is fabricated on a 130nm process node and integrates dedicated multiplier blocks, on-chip RAM organized as M4K/M-RAM memory, and supports in-system programmability through JTAG or Active Serial configuration interfaces. The 'C7' speed grade balances timing margin against power consumption, while the 'GA' suffix denotes lead-free / RoHS-compliant packaging with NiPdAu ball finish.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), communications infrastructure line cards, industrial imaging and video processing, custom DSP coprocessors, and military/aerospace signal processing. The combination of logic density, memory bandwidth, and GX transceivers makes it well suited for protocols requiring both parallel data paths and serialized physical-layer links.
When designing with this device, pay close attention to power sequencing—the core and I/O rails have specific ramp-rate requirements detailed in the datasheet. Use the Quartus II design toolchain (legacy versions 6.0 through 9.1 support this device family) for synthesis, place-and-route, and timing closure; SignalTap II logic analyzer integration allows real-time verification on the bench.
This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes that go beyond the manufacturer datasheet, helping engineers source and integrate legacy Stratix GX FPGAs.
Alternativas drop-in para EP1SGX10CF672C7GA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX10CF672C7GA (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, RoHS Status, Package Dimensions.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX10CF672C7
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →EP1SGX10CF672C6N
✅ Drop-In✓ Em estoque
$152 / unidade
Ver ficha técnica →EP1SGX10CF672C6
✅ Drop-In✓ Em estoque
$158 / unidade
Ver ficha técnica →EP1SGX10CF672C6NGA
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP1SGX10CF672I7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1SGX10CF672C7GA Classificações máximas e características elétricas
| Family | Stratix GX |
| Logic Elements | 10,570 |
| Total Memory Bits | 920,448 bits |
| User I/O Count (max) | 362 |
| Encapsulamento | 672-FBGA |
| Number of LABs/CLBs | 1057 |
| Total RAM Bits | 920,448 |
| Temperatura de operação | 0C to +85C (commercial) |
| Supply Voltage (Core) | 1.5 V |
| Speed Grade | C7 |
| Status RoHS | Compliant (GA suffix) |
| Tipo de montagem | Surface Mount (BGA) |
| Process Node | 130 nm |
| Configuration Method | JTAG, Active Serial, Passive Serial |
| Nível MSL | 3 (per JEDEC J-STD-020, reflow at 245C) |
Guia de Configuração de Pinos do EP1SGX10CF672C7GA 672-fbga
Configuração de pinos para EP1SGX10CF672C7GA (pacote 672-fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1SGX10CF672C7GA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1SGX10CF672C7GA é adequado para 6 aplicaçãos: Serial Interface Bridging (PCI Express, Serial RapidIO), Communications Infrastructure Line Cards, Custom DSP Coprocessor (Filter, FFT, Modulation), Industrial Imaging and Video Processing, Legacy System Maintenance and Industrial Controls, Aerospace and Defense Signal Processing.
Serial Interface Bridging (PCI Express, Serial RapidIO)
The EP1SGX10CF672C7GA's integrated GX transceivers and 10,570 logic elements make it well suited for bridging between serial protocols such as PCI Express x1/x4 and Serial RapidIO in telecom and embedded systems. The transceiver blocks handle multi-gigabit serialization-deserialization (SERDES) at line rates up to 3.125 Gbps, while the 1057 LABs implement the protocol stack (transaction layer, data link layer) and endpoint logic. With 920 Kbit of embedded memory for packet buffering, the device can sustain line-rate throughput without external SRAM. Source: Stratix GX family datasheet.
Recomendado
Communications Infrastructure Line Cards
In telecom line cards, the EP1SGX10CF672C7GA implements custom packet processing, traffic shaping, and framer functions alongside standard PHY interfaces. Its 362 user I/Os provide ample parallel connectivity to backplane buses, while the 1.5V core and dedicated PLL clock tree support deterministic latency for synchronous Ethernet and OTN framing. The 672-FBGA package's high pin density suits ATCA/AdvancedMC form factors. Design tip: use Quartus II TimeQuest timing analyzer to close timing on multi-clock domain designs typical in line cards. Source: Stratix GX handbook.
Recomendado
Custom DSP Coprocessor (Filter, FFT, Modulation)
The 14 embedded DSP blocks in the EP1SGX10CF672C7GA deliver up to 14 GigaMACs/s of 18x18 multiply-accumulate throughput, sufficient for mid-rate FFTs (up to 1024 points), FIR filter banks, and digital up/down-conversion (DUC/DDC) for software-defined radio. The 920 Kbit on-chip RAM acts as a coefficient store, eliminating external memory accesses. The 1057 LABs implement the control state machine and address generation logic. For higher DSP throughput, consider EP1S60 or EP1S80 family parts. Source: Stratix GX DSP block architecture.
Recomendado
Industrial Imaging and Video Processing
The EP1SGX10CF672C7GA's 362 user I/Os and abundant logic suit real-time image processing pipelines for machine vision and video surveillance. Implement Bayer demosaic, color space conversion, and edge detection directly in LABs while using on-chip memory as line buffers. The C7 speed grade supports pixel clock rates up to 133 MHz, sufficient for 1080p60 input. The commercial 0C to +85C operating range is adequate for indoor industrial enclosures. Source: Altera video reference designs.
Recomendado
Legacy System Maintenance and Industrial Controls
Many deployed industrial systems (CNC controllers, test equipment, medical imaging) are built around Stratix GX FPGAs. The EP1SGX10CF672C7GA serves as a maintenance replacement for field repairs, where requalifying with a new FPGA family would require costly revalidation. The 672-FBGA package matches the original PCB footprint, and the C7 speed grade preserves timing margins. Source: distributor listings and end-equipment manufacturer bills-of-materials. Industrial users should stock last-time-buy inventory.
Recomendado
Aerospace and Defense Signal Processing
In defense electronics, the EP1SGX10CF672C7GA performs signal intelligence (SIGINT) preprocessing, radar pulse compression, and electronic warfare (EW) jamming waveform generation. Its deterministic latency and on-chip DSP enable real-time processing of high-bandwidth RF data. The 130nm process provides proven reliability for long-lifecycle programs. Note: the commercial temperature grade (0C to +85C) is suitable for ground-based and shipboard systems; airborne applications require EP1SGX10 industrial or military temperature grades. Source: defense industry FPGA application notes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX10CF672C7GA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX10CF672C7 | EP1SGX10CF672C6N | EP1SGX10CF672C6 | EP1SGX10CF672C6NGA | EP1SGX10CF672I7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Speed Grade | C7 | C7 (same) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | C6 (slower, -1 grade) | I7 (industrial temp, same speed bin as C7) |
| Logic Elements | 10,570 | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) | 10,570 (same die) |
| Memory Bits | 920,448 | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) | 920,448 (same die) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Ball Finish / RoHS | NiPdAu (GA suffix) - RoHS | SnPb (leaded) - not RoHS | NiPdAu (N suffix) - RoHS | SnPb (leaded) - not RoHS | NiPdAu (N+GA suffix) - RoHS | NiPdAu (N suffix) - RoHS |
| User I/O Count (max) | 362 | 362 | 362 | 362 | 362 | 362 |
| Lifecycle Status | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) | Obsolete (last-time-buy) |
Principais diferenciais
- Lead-free RoHS-compliant ball finish (vs EP1SGX10CF672C7 (leaded))
- C7 speed grade for highest performance (vs EP1SGX10CF672C6NGA (C6 speed))
- Commercial temperature range lowest cost (vs EP1SGX10CF672I7N (industrial -40C to +100C))
- 10,570 LEs in 672-FBGA: balanced density and I/O (vs EP1S25F672C7 (Stratix non-GX, 25,560 LEs))
Notas de projeto
The 672-FBGA package requires thermal management at high toggle rates. Estimated: at 10,570 LEs switching at 200 MHz with 50% utilization, junction-to-ambient thermal resistance (theta_JA) of approximately 11 C/W on a 4-layer JEDEC test board yields 1.1 C/W per Watt; expect junction temperature rise of 22-33 C above ambient for typical 2-3W dissipation. For dense designs exceeding 4W, attach a heatsink with thermal interface material (TIM) and ensure at least 4 thermal vias under the BGA. Source: Stratix GX thermal management application note.
The EP1SGX10CF672C7GA requires multiple supply rails: 1.5V VCCINT (core), 3.3V VCCIO (I/O), 1.2V VCCPD (pre-driver), 1.5V/1.8V/2.5V/3.3V VCCPD references, and transceiver-specific VCCA (analog). Power-on sequencing requires VCCINT to ramp before VCCIO; refer to the Stratix GX handbook chapter on power management. Estimated: total quiescent power for a typical 50% utilization design is approximately 4-6W; fully loaded designs may exceed 8W. Use the Early Power Estimator (EPE) spreadsheet in Quartus II for accurate pre-layout power budgets. Source: Stratix GX power management chapter.
The 672-FBGA has a 1.0mm ball pitch, requiring 4-layer minimum PCB with 0.5oz copper and 0.20mm via pad design. Use microvia (laser-drilled) stack-up to fan out inner-row balls. Keep differential pair traces for GX transceivers at 100 ohm differential impedance with matched length to within 150 mil. Source: Altera 672-FBGA layout reference design.
Common pitfalls with EP1SGX10CF672C7GA: (1) Using Quartus Prime instead of legacy Quartus II - the Stratix GX device support was dropped after v9.1, and modern Quartus will not recognize this device; (2) Connecting JTAG TCK at <10 MHz on long traces - may cause configuration failures; (3) Missing MSL3 bake before assembly - FBGA packages absorb moisture and can fail at reflow; (4) Forgetting to set CONFIG_VCCIO voltage to 3.3V - prevents Active Serial configuration. Source: Stratix GX configuration handbook.
Decoupling: place 0.1uF X7R ceramic bypass capacitors at every VCCINT, VCCIO, and VCCA pin with trace length under 100 mil. Add 10uF bulk tantalum or ceramic caps adjacent to each supply island. The PLL analog supply (VCCA_PLL) must be filtered with a ferrite bead and 10uF + 0.1uF capacitor network; shared routing with switching supplies causes PLL jitter. Source: Stratix GX decoupling recommendations application note.
Informações de conformidade
RoHS compliance per Altera/Intel product documentation (GA suffix). REACH compliance not explicitly stated in distributor data - inferred from RoHS compliance. AEC-Q100 not applicable (FPGA, not automotive-qualified). Halogen-free status unknown - not in provided data. Conflict minerals compliance per Intel corporate policy.
