EP1SGX25FF1020I5N - Stratix GX FPGA, 25,660 LEs, FBGA-1020 | Altera
部品番号: EP1SGX25FF1020I5N ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 5 | $2725 | $13,625.00 |
| 10 | $2580 | $25,800.00 |
| 25 | $2410 | $60,250.00 |
| 50 | $2240 | $112,000.00 |
| 100 | $2050 | $205,000.00 |
EP1SGX25FF1020I5N 概要
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic fabric, interconnect, and I/O can be configured by the user after manufacture, sitting in the broader hierarchy of programmable logic devices -> logic ICs -> integrated circuits -> semiconductors. FPGAs combine logic blocks, memory, DSP blocks, and high-speed transceivers on a single die, enabling hardware-level parallelism for signal processing, packet processing, and protocol bridging. The Stratix GX family specifically introduced embedded multi-gigabit transceivers, targeting serial connectivity standards such as Fibre Channel, Gigabit Ethernet, Serial RapidIO, and PCI Express at the time of release.
Key features of the EP1SGX25FF1020I5N include 25,660 logic elements distributed across 2,566 CLBs, embedded transceiver channels supporting multi-gigabit serial I/O, on-chip TriMatrix memory for variable-width buffers, and support for external memory interfaces including DDR SDRAM and QDR SRAM. The device operates from a 1.5 V core supply with separate PLL-based clock management hardware, and supports a maximum clock frequency as cited by distributor Microchip USA. The FBGA-1020 package provides 1020 balls on a 1.00 mm pitch within a 33x33 mm body, suited to high-density board layouts.
Architecture-wise, the Stratix GX uses a sea-of-LABs (Logic Array Blocks) fabric combined with dedicated transceiver circuitry. The embedded transceivers support multiple protocols with serialization/deserialization, clock-data recovery, and 8B/10B encoding, reducing external PHY count and BOM. The die integrates PLLs for clock synthesis, allowing fine-grained frequency synthesis for both logic fabric and serial channels.
Typical applications include high-speed serial protocol bridging, telecommunications line cards, video broadcast equipment, military and aerospace signal processing, and prototyping interfaces such as Serial RapidIO and Fibre Channel. The industrial temperature rating also makes it relevant for controlled-environment industrial systems, though designers should verify the exact operating window in the datasheet.
Design consideration: a 1020-ball BGA requires careful PCB stack-up planning, controlled-impedance routing for transceiver channels, and multi-layer escape routing; thermal dissipation should be modelled given the 33x33 mm body.
This page consolidates distributor pricing, cross-reference notes from the Site MPN list, and practical design context that goes beyond the raw Stratix GX datasheet, helping engineers evaluate the EP1SGX25FF1020I5N against its drop-in family variants.
ドロップイン代替品: EP1SGX25FF1020I5N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX25FF1020I5N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Mounting Type, Operating Temperature, Family.
クイック比較ツール — 並列比較する代替部品を選択:
EP1SGX25FF1020I5
✅ ドロップイン✓ 在庫あり
$1490 / 個
データシートを見る →EP1SGX25FF1020I7N
✅ ドロップイン✓ 在庫あり
$98.5 / 個
データシートを見る →EP1SGX25FF1020I6N
✅ ドロップイン✓ 在庫あり
$145 / 個
データシートを見る →EP1SGX25FF1020C5N
✅ ドロップイン✓ 在庫あり
$1580 / 個
データシートを見る →EP1SGX25FF1020C7N
✅ ドロップイン✓ 在庫あり
$62.5 / 個
データシートを見る →EP1SGX25FF1020C6N
✅ ドロップイン✓ 在庫あり
$160 / 個
データシートを見る →EP1SGX25FF1020I5N 最大定格＆電気的特性
| Family | Stratix GX |
| Series | EP1SGX25 |
| Logic Elements (LEs) | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Operating Temperature Grade | Industrial (I) |
| 動作温度範囲 | 0 C to 85 C (per digchip listing) |
| パッケージ | FBGA-1020 (33 x 33 mm, 1.00 mm pitch) |
| Ball Count | 1020 |
| Terminal Pitch | 1.00 mm |
| 実装タイプ | Surface Mount (BGA) |
| Lead-Free Finish | Yes (lead-free, per digchip) |
| Logic Family | CMOS |
| RoHS ステータス | Compliant (per digchip) |
| Speed Grade | 5 |
EP1SGX25FF1020I5N fbga-1020 (33 x 33 mm, 1.00 mm pitch) ピン配置ガイド
EP1SGX25FF1020I5N (fbga-1020 (33 x 33 mm, 1.00 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX25FF1020I5N.
詳細は データシート をご参照ください。
主な用途
EP1SGX25FF1020I5N の用途: 7 件s: Fibre Channel SAN Switch Fabric, Serial RapidIO Baseband Bridge, Telecommunications Line Card Aggregation, Video Broadcast Serial Interface Aggregator, Military/Aerospace Signal Processing Card, Legacy Industrial Protocol Converter, PCI Express Endpoint / Test Equipment.
Fibre Channel SAN Switch Fabric
The EP1SGX25FF1020I5N's embedded multi-gigabit transceivers and 25,660 logic elements make it a strong fit for legacy Fibre Channel switch fabric designs. At 1 Gbps and 2 Gbps Fibre Channel rates, the Stratix GX on-chip transceivers provide clock-data recovery and 8B/10B encoding without an external PHY, reducing BOM and board complexity. The 2,566 CLBs support cut-through forwarding logic and port-state machines. Compared to a discrete transceiver + CPLD implementation, the EP1SGX25FF1020I5N integrates protocol logic and serial I/O on a single die, simplifying PCB layout. Use this part only in programs where the existing Stratix GX firmware and certification have already been qualified.
おすすめ
Serial RapidIO Baseband Bridge
The EP1SGX25FF1020I5N supports Serial RapidIO (sRIO) physical interfaces through its embedded transceivers, enabling DSP-to-DSP and DSP-to-host bridging in wireless baseband and signal-processing cards. At 1.25 Gbps to 3.125 Gbps lane rates per sRIO spec, the device's transceiver tile, combined with 25,660 logic elements for packet assembly and link-layer state machines, replaces an external PHY + bridge ASIC. Power-sequencing at 1.5 V core plus I/O supplies is straightforward. For new designs, migrate to Stratix IV GX or Cyclone V GT for lower power and faster transceivers, but reserve the EP1SGX25FF1020I5N for legacy baseband cards requiring identical firmware binaries.
おすすめ
Telecommunications Line Card Aggregation
Telecom line cards aggregating multiple TDM or packet streams benefit from the EP1SGX25FF1020I5N's combination of transceiver channels, TriMatrix memory blocks, and 25,660 logic elements for header processing and queuing. The 1020-ball FBGA exposes enough user I/O for parallel backplane connections plus multi-channel serial links. Industrial temperature rating supports central-office environments where ambient is controlled. When specifying, allocate transceiver channels for fabric uplinks and reserve enough logic for traffic-manager state machines. Verify the device's PLLs can synthesize all required clock domains before commit to pinout; failing that, use a higher speed grade such as EP1SGX25FF1020I7N.
おすすめ
Video Broadcast Serial Interface Aggregator
Broadcast video routers that aggregate SDI, HD-SDI, and 3G-SDI streams rely on the EP1SGX25FF1020I5N's multi-gigabit transceivers, which can clock-recover 270 Mbps, 1.485 Gbps, and 2.97 Gbps SDI rates directly. The 25,660 logic elements implement ancillary data insertion, switching matrices, and audio embedding. The 33 x 33 mm FBGA-1020 supports dense PCB routing for multi-card chassis. For SDI routing fabrics needing >40 ports, consider paralleling multiple EP1SGX25FF1020I5N devices or stepping up to the Stratix II GX family. Designers should pair the FPGA with a stable 148.5 MHz reference clock for proper SDI lock.
おすすめ
Military/Aerospace Signal Processing Card
The EP1SGX25FF1020I5N is qualified for military and aerospace signal-processing cards requiring ruggedized FPGA logic and serial I/O for sensor aggregation. The Vyrian listing tags the 'I' (industrial) variant as MILITARY-grading in some channels, reflecting legacy defense inventory. Its embedded transceivers handle serial sensor links, while 25,660 logic elements execute FFTs, beamforming weights, and tracking filters. Confirm actual MIL-spec temperature range (-55 C to +125 C) with Altera/Intel ordering code before committing; the 'I' suffix on this part is industrial, so for true MIL temperature look at the EP1SGX25FF1020I5ES extended-spec variant. Plan multi-layer PCB escape for the 1020-ball BGA and conformal coating for vibration/humidity.
おすすめ
Legacy Industrial Protocol Converter
Long-lifecycle industrial systems (rail signaling, SCADA, factory automation) often need to bridge legacy protocols (RS-485, Profibus, CAN) with modern Ethernet or serial fabrics, and the EP1SGX25FF1020I5N is well-suited for these protocol-converter gateways. Its industrial temperature grade (0 C to 85 C) matches factory-floor ambient. The embedded transceivers provide Ethernet connectivity while the logic elements implement protocol stacks. For new designs, target Cyclone IV/V instead, but for retrofit cards replacing obsolete processor modules, this part drops directly into existing Stratix GX footprints. Validate JTAG chain and configuration PROM compatibility with the existing factory test fixtures before board respin.
おすすめ
PCI Express Endpoint / Test Equipment
The EP1SGX25FF1020I5N implements PCI Express x1/x4 endpoints at 2.5 Gbps lane rates via its embedded transceivers, making it a candidate for legacy PCIe test cards, protocol analyzers, and endpoint ASIC prototypes. With 25,660 logic elements, designers can build TLP engines, DMA controllers, and MSI interrupt logic without external glue. The 1020-ball BGA exposes enough I/O for x4 link width plus parallel test-bus access. Verify the device's hard PCIe IP availability in your Quartus version; if missing, fall back to soft IP cores. New designs should use Stratix IV/V with hard PCIe Gen2/Gen3 IP for higher throughput and lower power.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX25FF1020I5N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1SGX25FF1020I5 | EP1SGX25FF1020I7N | EP1SGX25FF1020I6N | EP1SGX25FF1020C5N | EP1SGX25FF1020C7N |
|---|---|---|---|---|---|---|
| Package | FBGA-1020 (33 x 33 mm, 1.00 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Brand | Altera | Altera - same | Altera - same | Altera - same | Altera - same | Altera - same |
| Logic Elements | 25,660 | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) | 25,660 (same die) |
| Speed Grade | 5 | 5 (same) | 7 (faster) | 6 (mid) | 5 (same) | 7 (faster) |
| Temperature Grade | Industrial (0 C to 85 C) | Industrial | Industrial | Industrial | Commercial (0 C to 70 C) | Commercial (0 C to 70 C) |
| Embedded Transceivers | Yes (Stratix GX family) | Yes | Yes | Yes | Yes | Yes |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status (2026-09-07) | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
主な差別化要因
- On-die multi-gigabit transceivers eliminate external PHY （vs Stratix (non-GX) family EP1S60F1020C6N)
- Mid-density tier balances capacity and cost （vs Higher-density Stratix GX EP1S80F1020C7)
- Standard industrial temperature covers factory-floor deployments （vs EP1SGX25FF1020C5N (commercial grade))
設計ノート
The 1020-ball FBGA on a 1.00 mm pitch requires at least a 6-layer PCB stack-up with dedicated ground and power planes adjacent to the BGA escape layer. Use 0.2 mm laser-drilled microvias for inner-row escape, fan-out through buried vias, and keep all transceiver differential pairs at 100 ohm +/- 10% differential impedance. Decouple every VCC pin with a 0.1 uF X7R plus 10 uF bulk capacitor placed within 3 mm of the BGA ball.
Estimated: At a typical Stratix GX operating power of ~6 W under full logic utilization, with a JEDEC-standard 33 x 33 mm FBGA on a 6-layer 1 oz copper PCB (theta_JA ~6 C/W), the junction temperature rises ~36 C above ambient. For industrial-grade operation up to 85 C ambient, the junction stays below the 125 C silicon limit. Place a thermal pad or heat-spreader on the package top for additional margin in enclosed chassis. Validate with the device-specific thermal model in the Quartus power analyzer.
Configuration: this part requires an EPC-series configuration device plus proper MSEL pin strapping for AS, PS, JTAG, or Fast Passive Parallel modes. Mixing MSEL values with mismatched bitstream widths is a common source of boot failures. Verify the configuration clock (DCLK) trace is length-matched per the Stratix GX handbook, and confirm the nCONFIG, nSTATUS, and CONF_DONE pull-ups are present. Always pull CONFIG_DONE low during JTAG programming to avoid bus contention.
Transceiver channels demand AC-coupled differential routing with matched trace lengths (delta < 0.1 mm) for the P/N pair, plus reference planes uninterrupted under the entire channel. Place the AC-coupling capacitors (typically 100 nF X7R) within 6 mm of the transmitter output. For 3.125 Gbps and above, follow the Stratix GX PCB Design Guidelines section of the device handbook, including pre-emphasis and equalization settings in the ALTGX MegaWizard.
コンプライアンス情報
RoHS compliance per digchip listing confirms lead-free finish. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade analog IC. Halogen-free status and conflict-minerals declarations should be requested from Altera/Intel as part of the long-term supply agreement.
