EP1SGX40DF1020C5ES - 41,250-Cell Stratix GX FPGA | Intel
部品番号: EP1SGX40DF1020C5ES ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP1SGX40DF1020C5ES 概要
A field-programmable gate array is a semiconductor device whose logic functions are defined through programmable configuration rather than fixed interconnect. Within the programmable-logic hierarchy, an FPGA sits between conventional logic ICs and more specialized processors or application-specific integrated circuits. Designers implement parallel datapaths, control logic, interfaces, and complete systems-on-chip by configuring logic elements, routing resources, and dedicated functional blocks. This flexibility shortens development cycles and enables field updates without changing the physical PCB.
The EP1SGX40DF1020C5ES is distinguished by 41,250 logic cells, 4,125 LABs, 1.5 V operation, and 1,020 package terminals. Its 624-I/O capability can support high-pin-count buses and multiple peripheral interfaces, although the exact usable I/O count depends on the device configuration, reference design, package assignment, and signal-integrity constraints. The reported 5,000 MHz figure should be treated as a catalog characteristic rather than a guaranteed system clock, because actual performance depends on implemented logic, routing depth, I/O standards, power settings, and timing closure.
The Stratix GX architecture combines programmable logic fabric with resources intended for demanding digital systems. A third-party listing reports a maximum CLB combinatorial delay of 7.49 ns, while another listing describes a maximum clock frequency of 6 MHz; these conflicting values were not used as definitive performance specifications. The 130 nm CMOS process generation places the part in the historical Stratix GX family, and engineering teams should rely on the complete manufacturer datasheet for architecture, configuration, electrical, and timing details.
Typical uses include communications infrastructure, high-speed industrial controllers, test and measurement equipment, and parallel digital signal-processing platforms. The large logic capacity can consolidate functions that might otherwise require several conventional ICs. When planning a new design, treat the 33 mm by 33 mm BGA footprint as a board-layout commitment and verify all balls, power planes, decoupling, configuration circuitry, and high-speed routing against the official family documentation. This page combines exact supplied specifications, practical engineering guidance, availability context, and verified cross-reference results while clearly flagging values that remain unverified.
ドロップイン代替品: EP1SGX40DF1020C5ES — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX40DF1020C5ES （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, Logic Family, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
この製品に利用可能なドロップイン代替品はありません。
代替品をリクエストEP1SGX40DF1020C5ES 最大定格＆電気的特性
| Product Type | Field-Programmable Gate Array (FPGA) |
| Logic Family | Stratix GX |
| Logic Technology | CMOS |
| Process Technology | 130 nm |
| Logic Cells | 41,250 cells |
| Logic Array Blocks | 4,125 LABs |
| Configurable I/O Connections | 624 input and 624 output connections |
| 電源電圧 | 1.5 V |
| Reported Maximum Frequency | 5,000 MHz |
| Reported Maximum CLB Combinatorial Delay | 7.49 ns |
| Alternative Listed Maximum Clock Frequency | 6 MHz |
| Terminal Count | 1,020 pins |
| Package Type | FC-FBGA-1020 |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1 mm |
| 動作温度 | 0 C to 85 C |
| Mounting Configuration | Surface-mount ball grid array |
| Terminal Form | Ball |
| Package Code | BGA |
| RoHS ステータス | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | unknown |
EP1SGX40DF1020C5ES bga ピン配置ガイド
EP1SGX40DF1020C5ES (bga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX40DF1020C5ES.
詳細は データシート をご参照ください。
主な用途
EP1SGX40DF1020C5ES の用途: 6 件s: Communications Infrastructure, High-Speed Industrial Control, Test and Measurement Equipment, Parallel Digital Signal Processing, Video and Imaging Data Handling, Reconfigurable Computing Prototypes.
Communications Infrastructure
The EP1SGX40DF1020C5ES fits communications-infrastructure prototyping where substantial programmable logic and high package connectivity are required. Its 41,250 logic cells and 4,125 logic array blocks can support protocol adaptation, packet processing, framing logic, timing functions, and multiple parallel control paths. The 1,020-pin FC-FBGA package exposes a large connection interface for memory, control, backplane, or serializer-deserializer signals, while the listed 1.5 V supply provides a defined core-power starting point. Actual suitability for a named protocol depends on dedicated interface resources, supported I/O standards, transceiver capability, and timing closure. The 33 mm by 33 mm footprint also makes signal-integrity planning and power delivery central to implementation.
おすすめ
High-Speed Industrial Control
The EP1SGX40DF1020C5ES is appropriate for industrial controllers that combine deterministic logic, numerous I/O channels, and multiple processing paths in one programmable platform. Its 41,250 logic cells can accommodate motor-control sequencing, timing, safety-state logic, communications bridges, and data aggregation, while the 624 input and 624 output connection capability supports expansive interfaces. The device's 1.5 V listed supply simplifies initial voltage-rail planning, although a production design must verify every required rail and tolerance. The reported 5,000 MHz figure does not guarantee every internal path; timing should be established after synthesis, placement, routing, and operating-condition analysis. The large 1,020-ball package also rewards early collaboration with PCB and assembly specialists.
おすすめ
Test and Measurement Equipment
The EP1SGX40DF1020C5ES can serve in test and measurement equipment where acquisition, triggering, signal conditioning control, formatting, and record management must operate concurrently. With 41,250 logic cells and 4,125 LABs, the FPGA can consolidate large deterministic datapaths and control sequences while its 1,020-pin package can connect to converters, memory, clocks, and host interfaces. The supplied data identifies a 7.49 ns maximum CLB combinatorial delay, but system timing must include routing, fan-out, clock uncertainty, and interface performance. The listed 0 C to 85 C operating range is suitable for many controlled environments, not automatically for unconditioned industrial sites. A robust design should therefore combine timing analysis with thermal, power-integrity, and calibration validation.
おすすめ
Parallel Digital Signal Processing
The EP1SGX40DF1020C5ES is a strong fit for parallel digital signal-processing prototypes that need many replicated arithmetic or control paths. Its 41,250 logic cells and 4,125 logic array blocks provide capacity for filters, encoders, correlators, buffering, scheduling, and interface adaptation. The reported 5,000 MHz characteristic can support preliminary bandwidth planning, but implemented clock frequency must be verified through a design-specific timing report. The 1,020-pin FC-FBGA package offers extensive connectivity for high-throughput data movement, although it also demands controlled-impedance routing and careful power distribution. Designers should quantify pipeline depth and resource utilization early to determine whether the selected FPGA capacity is justified.
おすすめ
Video and Imaging Data Handling
The EP1SGX40DF1020C5ES can support video or imaging systems that require frame buffering, timing generation, data-width conversion, filtering, and host-side control. Its 41,250 logic cells allow multiple functions to be integrated into a single Stratix GX platform, while the 1,020-pin package can connect image sensors, memory, displays, and control processors. The listed 624 input and 624 output connections indicate substantial package-level I/O capacity, but the exact number available in a user design depends on the assigned I/O standards and bank restrictions. The 33 mm by 33 mm BGA package supports dense integration, yet high-speed image interfaces require strict impedance, skew, jitter, and crosstalk control. The 1.5 V supply value should be supplemented with complete power information from the manufacturer data sheet.
おすすめ
Reconfigurable Computing Prototypes
The EP1SGX40DF1020C5ES is suitable for reconfigurable-computing prototypes in which algorithms, interfaces, and control logic must change during development. Its 41,250 logic cells provide room for parallel accelerators, data movers, controllers, and debugging logic, while the Stratix GX architecture allows system behavior to be represented in programmable hardware. The 1,020-terminal package supports many external connections, but it makes pin assignment and board-level simulation important. The 130 nm CMOS implementation is a verified family characteristic, while the reported 5,000 MHz frequency is a catalog value that should not be substituted for measured design performance. Prototype success should be based on utilization, power, thermal margin, configuration flow, and timing closure rather than headline capacity alone.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX40DF1020C5ES — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | |||
|---|---|---|---|---|
| Brand | Intel / Altera | |||
| Package | 1,020-pin FC-FBGA, 33 mm x 33 mm, 1 mm pitch | |||
| Product Type | FPGA | FPGA | FPGA | FPGA |
| Logic Family | Stratix GX | Spartan-6 LX | Virtex-5 FXT | ACEX 1K |
| Package Terminals | 1,020 | 225 | 1,738 | 256 |
| Footprint Compatibility | 1,020-pin FC-FBGA | No; 225-ball package | No; 1,738-ball package | No; 256-ball package |
| Verified Drop-In Status | Target device | No; PCB redesign required | No; PCB redesign required | No; PCB redesign required |
主な差別化要因
- Higher listed logic density than the ACEX 1K comparator （vs EP1K100FI256-2)
- More package terminals than the Spartan-6 comparator （vs XC6SLX9-2CSG225I)
- More compact terminal count than the Virtex-5 FXT comparator （vs XC5VFX130T-2FFG1738I)
- Verified 130 nm Stratix GX implementation （vs XC5VFX130T-2FFG1738I)
設計ノート
The verified supply-voltage specification for EP1SGX40DF1020C5ES is 1.5 V, but do not design a regulator network from that value alone. Obtain the family data sheet and identify every required rail, current limit, sequencing condition, tolerance, and power-up behavior. Estimate regulator and decoupling requirements only after selecting logic utilization, clock rates, I/O activity, and termination. Keep high-current planes continuous, connect decoupling close to the relevant BGA balls, and verify the completed design with power-integrity measurements rather than relying on a single nominal voltage label.
The 33 mm by 33 mm FC-FBGA package has 1,020 terminals on a 1 mm pitch, so PCB implementation requires a verified ball map and escape strategy. Confirm the exact land pattern from the manufacturer, whether the selected assembly process uses filled or unfilled microvias, and whether via-in-pad is permitted. Escape inner rows on appropriate layers, provide solid low-impedance reference planes, and avoid routing high-speed signals through unfavorable via fields. A full signal-integrity simulation should precede release because comparator FPGAs with 225, 256, or 1,738 balls are not footprint-compatible.
Use the reported 5,000 MHz maximum-frequency value as preliminary catalog context, not as an implemented clock guarantee. Establish clock constraints, account for clock uncertainty, and run post-route timing analysis for the synthesized configuration. The 7.49 ns maximum CLB combinatorial delay is likewise only one component of system path delay; add routing, fan-out, I/O, and setup or hold effects. For high-speed interfaces, control impedance, reference-plane continuity, return paths, crosstalk, and skew from schematic stage through measurement.
The supplied operating range is 0 C to 85 C, but it does not provide a complete thermal design envelope. Junction temperature depends on dynamic power, static power, I/O loading, configuration density, clock activity, board copper, airflow, and the package environment. Model the BGA and board stack-up, provide thermal vias or spreading copper where the footprint allows, and validate the hottest expected configuration in the final enclosure. Do not infer thermal resistance or maximum junction temperature from the catalog operating range.
Do not confuse the target EP1SGX40DF1020C5ES with the related EP1SGX40DF1020C5 listing. Availability, stock, price, lifecycle, and package details must match the complete ordering code. Do not use 624 input and 624 output connections as an unconditional usable-I/O promise because bank restrictions and assigned standards affect results. The supplied data also contains conflicting frequency claims of 5,000 MHz and 6 MHz; treat 7.49 ns as the only specifically reported CLB-delay value, and obtain the official timing tables before specification compliance decisions.
コンプライアンス情報
The supplied web data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals compliance for EP1SGX40DF1020C5ES. These attributes require manufacturer or authorized-distributor documentation.