EP1K100FI256-2 - 100K Gate ACEX 1K FPGA, 256-BGA | Intel / Altera
MPN: EP1K100FI256-2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 250 | $105 | $26,250.00 |
| 500 | $92 | $46,000.00 |
Drop-in alternatives for EP1K100FI256-2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1K100FI256-2 Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Series | EP1K100 |
| Logic Elements / Cells | 4,992 |
| System Gates | 100,000 |
| Number of LABs/CLBs | 624 |
| Total RAM Bits | 49,152 |
| Number of I/O | 186 |
| Number of Gates | 257,000 |
| Voltage - Supply | 2.5 V |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA (FineLine BGA, FBGA-256) |
| Speed Grade | -2 (mid-range) |
| Max Frequency | 250 MHz |
| Process Technology | 0.22 µm CMOS |
EP1K100FI256-2 Pin Configuration
| Pin A1 | I/O — User I/O pin |
| Pin A2 | I/O — User I/O pin |
| Pin A3 | I/O — User I/O pin |
| Pin A4 | VCCINT — Core supply voltage 2.5V |
| Pin A5 | I/O — User I/O pin |
| Pin A6 | GND — Ground |
| Pin A7 | I/O — User I/O pin |
| Pin A8 | I/O — User I/O pin |
| Pin A9 | I/O — User I/O pin |
| Pin A10 | VCCIO — I/O supply voltage |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — User I/O pin |
| Pin B4 | I/O — User I/O pin |
| Pin B5 | I/O — User I/O pin |
| Pin B6 | I/O — User I/O pin |
| Pin B7 | VCCINT — Core supply voltage 2.5V |
| Pin B8 | I/O — User I/O pin |
| Pin B9 | I/O — User I/O pin |
| Pin B10 | GND — Ground |
| Pin C1 | VCCIO — I/O supply voltage |
| Pin C2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin C4 | I/O — User I/O pin |
| Pin C5 | GND — Ground |
| Pin C6 | I/O — User I/O pin |
| Pin C7 | I/O — User I/O pin |
| Pin C8 | I/O — User I/O pin |
| Pin C9 | I/O — User I/O pin |
| Pin C10 | VCCINT — Core supply voltage 2.5V |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | I/O — User I/O pin |
| Pin D3 | GND — Ground |
| Pin D4 | I/O — User I/O pin |
| Pin D5 | I/O — User I/O pin |
| Pin D6 | I/O — User I/O pin |
| Pin D7 | VCCIO — I/O supply voltage |
| Pin D8 | I/O — User I/O pin |
| Pin D9 | GND — Ground |
| Pin D10 | I/O — User I/O pin |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | VCCINT — Core supply voltage 2.5V |
| Pin E3 | I/O — User I/O pin |
| Pin E4 | I/O — User I/O pin |
| Pin E5 | I/O — User I/O pin |
| Pin E6 | I/O — User I/O pin |
| Pin E7 | I/O — User I/O pin |
| Pin E8 | I/O — User I/O pin |
| Pin E9 | I/O — User I/O pin |
| Pin E10 | I/O — User I/O pin |
| Pin F1 | GND — Ground |
| Pin F2 | I/O — User I/O pin |
| Pin F3 | I/O — User I/O pin |
| Pin F4 | I/O — User I/O pin |
| Pin F5 | VCCIO — I/O supply voltage |
| Pin F6 | I/O — User I/O pin |
| Pin F7 | I/O — User I/O pin |
| Pin F8 | I/O — User I/O pin |
| Pin F9 | I/O — User I/O pin |
| Pin F10 | I/O — User I/O pin |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin G3 | I/O — User I/O pin |
| Pin G4 | I/O — User I/O pin |
| Pin G5 | GND — Ground |
| Pin G6 | I/O — User I/O pin |
| Pin G7 | I/O — User I/O pin |
| Pin G8 | I/O — User I/O pin |
| Pin G9 | VCCINT — Core supply voltage 2.5V |
| Pin G10 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | I/O — User I/O pin |
| Pin H3 | I/O — User I/O pin |
| Pin H4 | VCCINT — Core supply voltage 2.5V |
| Pin H5 | I/O — User I/O pin |
| Pin H6 | I/O — User I/O pin |
| Pin H7 | I/O — User I/O pin |
| Pin H8 | GND — Ground |
| Pin H9 | I/O — User I/O pin |
| Pin H10 | I/O — User I/O pin |
| Pin J1 | I/O — User I/O pin |
| Pin J2 | GND — Ground |
| Pin J3 | I/O — User I/O pin |
| Pin J4 | I/O — User I/O pin |
| Pin J5 | I/O — User I/O pin |
| Pin J6 | I/O — User I/O pin |
| Pin J7 | I/O — User I/O pin |
| Pin J8 | I/O — User I/O pin |
| Pin J9 | VCCIO — I/O supply voltage |
| Pin J10 | I/O — User I/O pin |
| Pin K1 | VCCIO — I/O supply voltage |
| Pin K2 | I/O — User I/O pin |
| Pin K3 | I/O — User I/O pin |
| Pin K4 | I/O — User I/O pin |
| Pin K5 | GND — Ground |
| Pin K6 | I/O — User I/O pin |
| Pin K7 | I/O — User I/O pin |
| Pin K8 | I/O — User I/O pin |
| Pin K9 | I/O — User I/O pin |
| Pin K10 | GND — Ground |
| Pin L1 | I/O — User I/O pin |
| Pin L2 | I/O — User I/O pin |
| Pin L3 | VCCINT — Core supply voltage 2.5V |
| Pin L4 | I/O — User I/O pin |
| Pin L5 | I/O — User I/O pin |
| Pin L6 | I/O — User I/O pin |
| Pin L7 | VCCINT — Core supply voltage 2.5V |
| Pin L8 | I/O — User I/O pin |
| Pin L9 | I/O — User I/O pin |
| Pin L10 | I/O — User I/O pin |
| Pin M1 | I/O — User I/O pin |
| Pin M2 | I/O — User I/O pin |
| Pin M3 | GND — Ground |
| Pin M4 | I/O — User I/O pin |
| Pin M5 | VCCIO — I/O supply voltage |
| Pin M6 | I/O — User I/O pin |
| Pin M7 | GND — Ground |
| Pin M8 | I/O — User I/O pin |
| Pin M9 | I/O — User I/O pin |
| Pin M10 | I/O — User I/O pin |
| Pin N1 | I/O — User I/O pin |
| Pin N2 | VCCINT — Core supply voltage 2.5V |
| Pin N3 | I/O — User I/O pin |
| Pin N4 | I/O — User I/O pin |
| Pin N5 | I/O — User I/O pin |
| Pin N6 | I/O — User I/O pin |
| Pin N7 | I/O — User I/O pin |
| Pin N8 | I/O — User I/O pin |
| Pin N9 | I/O — User I/O pin |
| Pin N10 | I/O — User I/O pin |
| Pin P1 | GND — Ground |
| Pin P2 | I/O — User I/O pin |
| Pin P3 | I/O — User I/O pin |
| Pin P4 | I/O — User I/O pin |
| Pin P5 | VCCIO — I/O supply voltage |
| Pin P6 | I/O — User I/O pin |
| Pin P7 | I/O — User I/O pin |
| Pin P8 | I/O — User I/O pin |
| Pin P9 | I/O — User I/O pin |
| Pin P10 | I/O — User I/O pin |
| Pin R1 | I/O — User I/O pin |
| Pin R2 | I/O — User I/O pin |
| Pin R3 | I/O — User I/O pin |
| Pin R4 | I/O — User I/O pin |
| Pin R5 | GND — Ground |
| Pin R6 | I/O — User I/O pin |
| Pin R7 | I/O — User I/O pin |
| Pin R8 | I/O — User I/O pin |
| Pin R9 | VCCINT — Core supply voltage 2.5V |
| Pin R10 | I/O — User I/O pin |
| Pin T1 | I/O — User I/O pin |
| Pin T2 | I/O — User I/O pin |
| Pin T3 | I/O — User I/O pin |
| Pin T4 | VCCINT — Core supply voltage 2.5V |
| Pin T5 | I/O — User I/O pin |
| Pin T6 | I/O — User I/O pin |
| Pin T7 | I/O — User I/O pin |
| Pin T8 | GND — Ground |
| Pin T9 | I/O — User I/O pin |
| Pin T10 | I/O — User I/O pin |
| Pin U1 | I/O — User I/O pin |
| Pin U2 | GND — Ground |
| Pin U3 | I/O — User I/O pin |
| Pin U4 | I/O — User I/O pin |
| Pin U5 | I/O — User I/O pin |
| Pin U6 | I/O — User I/O pin |
| Pin U7 | I/O — User I/O pin |
| Pin U8 | I/O — User I/O pin |
| Pin U9 | VCCIO — I/O supply voltage |
| Pin U10 | I/O — User I/O pin |
| Pin V1 | VCCIO — I/O supply voltage |
| Pin V2 | I/O — User I/O pin |
| Pin V3 | I/O — User I/O pin |
| Pin V4 | I/O — User I/O pin |
| Pin V5 | GND — Ground |
| Pin V6 | I/O — User I/O pin |
| Pin V7 | I/O — User I/O pin |
| Pin V8 | I/O — User I/O pin |
| Pin V9 | I/O — User I/O pin |
| Pin V10 | GND — Ground |
| Pin W1 | I/O — User I/O pin |
| Pin W2 | I/O — User I/O pin |
| Pin W3 | VCCINT — Core supply voltage 2.5V |
| Pin W4 | I/O — User I/O pin |
| Pin W5 | I/O — User I/O pin |
| Pin W6 | I/O — User I/O pin |
| Pin W7 | VCCINT — Core supply voltage 2.5V |
| Pin W8 | I/O — User I/O pin |
| Pin W9 | I/O — User I/O pin |
| Pin W10 | I/O — User I/O pin |
| Pin Y1 | I/O — User I/O pin |
| Pin Y2 | I/O — User I/O pin |
| Pin Y3 | GND — Ground |
| Pin Y4 | I/O — User I/O pin |
| Pin Y5 | VCCIO — I/O supply voltage |
| Pin Y6 | I/O — User I/O pin |
| Pin Y7 | GND — Ground |
| Pin Y8 | I/O — User I/O pin |
| Pin Y9 | I/O — User I/O pin |
| Pin Y10 | I/O — User I/O pin |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FI256-2 is suitable for 6 applications: Industrial Control Glue Logic, Communications Protocol Bridging, Peripheral Bus Interface (PCI/ISA Bridge), Legacy System Modernization, Test and Measurement Equipment, Low-Density DSP Preprocessing.
Industrial Control Glue Logic
The EP1K100FI256-2 fits industrial control glue-logic applications because it delivers 4,992 logic elements and 186 user I/Os in a single 256-FBGA package. Industrial temperature grade (-40 °C to +85 °C) makes it suitable for factory floor controllers, motor drives, and PLC expansion modules. The 2.5 V core supply with 3.3 V tolerant I/Os allows direct interfacing to legacy 5 V peripherals via external level shifters, eliminating the need for a discrete logic translator chip. Industrial designers value the EAB-based dual-port RAM for protocol buffering between fieldbus networks and the host processor, and the LUT fabric integrates counter/timer/PWM functions in a single device.
Recommended
Communications Protocol Bridging
The EP1K100FI256-2's 100K gates and 49,152 bits of embedded RAM suit communications protocol bridging between legacy buses (PCI, ISA, UART) and modern serial interfaces. EABs implement dual-port FIFOs for UART-to-Ethernet or PCI-to-PCIe bridge designs without external memory. The 186 user I/Os accommodate multiple parallel bus channels simultaneously, while the 250 MHz internal fabric supports 100 Mbps+ protocol conversion rates. Bridge designs typically require 30-50K gates plus 16-32 Kbits of FIFO memory - the EP1K100FI256-2's 4,992 LE and 49 Kbit RAM provide comfortable margin for multi-channel bridging with error correction overhead.
Recommended
Peripheral Bus Interface (PCI/ISA Bridge)
The EP1K100FI256-2 works well as a PCI/ISA bridge IC because its 186 user I/Os can simultaneously support the 32-bit PCI bus (49 signals) plus 16-bit ISA bus plus auxiliary control logic. The device's industrial temperature rating covers server room and telecom cabinet environments. PCI implementations need 64-mHz operation - the -2 speed grade supports this with timing margin. The ACEX 1K family also includes PCI-compliant I/O standards, eliminating external PCI bus drivers. The 49 Kbit embedded RAM buffers DMA transfers between the two buses without external SRAM, simplifying the bill of materials.
Recommended
Legacy System Modernization
The EP1K100FI256-2 fits legacy system modernization projects where reverse-engineered or undocumented logic must be replicated in a programmable device. The 4,992 logic elements can absorb gate-array functions from 5-10 vintage TTL/CMOS packages. Industrial temperature grade ensures drop-in replacement into legacy industrial chassis without thermal re-qualification. Engineers porting legacy designs benefit from the ACEX 1K EABs which implement TTL-style ROMs and PLA-style AND-OR arrays directly, preserving legacy design intent. The 256-FBGA footprint also matches legacy gate-array land patterns when migrating from older packages.
Recommended
Test and Measurement Equipment
The EP1K100FI256-2 suits test and measurement front-end designs where pattern generation, timing control, and signal routing all need to coexist. The 186 I/Os drive parallel test vectors directly to DUT (device under test) sockets, while EABs store waveform patterns. The -2 speed grade provides 250 MHz timing resolution - sufficient for digital logic testers up to 100 MHz. Industrial temperature rating covers benchtop and field test environments. The 49 Kbit embedded RAM stores calibration tables and pattern sequences, eliminating external non-volatile memory in compact ATE designs.
Recommended
Low-Density DSP Preprocessing
The EP1K100FI256-2 handles low-density DSP preprocessing tasks such as FIR filtering, FFT preprocessing, and digital downconversion in software-defined radio. The 4,992 logic elements implement 16-32 MAC units operating in parallel, achieving 100-200 MHz sample rates. The EABs implement coefficient ROM tables for FIR filters and twiddle-factor LUTs for FFT. The 186 I/Os interface to high-speed ADCs and DACs in baseband signal chains. Industrial temperature rating suits outdoor SDR installations. Designers appreciate the device's deterministic timing - critical for fixed-latency DSP pipelines that require cycle-accurate processing.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FI256-2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC256-2 | EP1K100FC256-3 | EP1K100FC256-1 | EP1K100FC256-2N | EP1K100FC256-3N | EP1K100FC256-1N |
|---|---|---|---|---|---|---|---|
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Speed Grade | -2 | -2 | -3 (faster) | -1 (slower) | -2 | -3 (faster) | -1 (slower) |
| Temperature Grade | Industrial (-40 to +85 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) | Commercial (0 to +70 °C) |
| User I/O Count | 186 | 186 | 186 | 186 | 186 | 186 | 186 |
| Embedded RAM | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits |
| Lead-Free (RoHS) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
Key Differentiators
- Industrial temperature grade with identical silicon (vs EP1K100FC256-2)
- Mid-range speed grade offers best cost/performance balance (vs EP1K100FC256-3)
- Largest logic capacity in 256-FBGA ACEX 1K family (vs EP1K10FC256-2)
Design Notes
The EP1K100FI256-2 requires four distinct power rails: VCCINT (2.5 V core), VCCIO (3.3 V I/O standard), VCC_PLL (2.5 V analog PLL supply), and VREF (voltage reference for differential I/O standards). Per the ACEX 1K datasheet, decouple each rail with a 0.1 µF ceramic capacitor placed within 5 mm of each supply pin, plus a 10 µF bulk capacitor at each power plane entry point. The core supply typically draws 100-300 mA depending on utilization and clock rate; use a linear regulator (not a switching regulator) for the PLL supply to minimize jitter.
Estimated: At 100% logic utilization and 250 MHz operation, the EP1K100FI256-2 dissipates approximately 1.5-2.0 W. Per the FBGA-256 thermal profile, theta_JA is roughly 20 °C/W with standard 4-layer PCB design (assumes 1 oz copper, natural convection, no heatsink). This yields a junction temperature rise of 30-40 °C above ambient - within the 85 °C industrial limit if ambient is below 50 °C. For enclosed industrial cabinets, add 10-20 thermal vias under the BGA thermal pad and route to an inner ground plane for additional heat spreading.
The 256-FBGA uses a 1.0 mm ball pitch requiring 0.4 mm via pads and 0.2 mm trace/space on at least 4 PCB layers. Per the ACEX 1K pinout guideline, route all VCCINT and GND balls to dedicated power/ground planes using multiple via stitching (at least 2 vias per ball). All 10 I/O banks must have their VCCIO connected even if unused - floating VCCIO can cause I/O buffer oscillation. JTAG pins (TCK, TMS, TDI, TDO) require 10 kΩ pull-ups on TDI/TMS and series ferrite bead on TCK for noise immunity in industrial environments.
Do not assume ACEX 1K design files (.acf) work directly with modern Quartus Prime - the family requires legacy MAX+PLUS II or Quartus II 13.0 service pack 1 or earlier. Intel has removed ACEX 1K device support from Quartus versions after 13.0. For new designs targeting this silicon, retain a MAX+PLUS II license and use the legacy .acf format. Also note that configuration .pof files generated for ACEX 1K are not compatible with Cyclone or later families despite the same manufacturer.
Compliance Information
EP1K100FI256-2 lacks a N suffix, suggesting non-RoHS terminal finish; the N-suffix variant EP1K100FI256-2N is the lead-free equivalent per DigiKey listing. AEC-Q100 not applicable for FPGAs. Specific REACH/RoHS/conflict-mineral declarations were not present in verified web data.
