EP1SGX40FF1020I6 - Stratix GX FPGA, 41,250 LEs, 1020-BGA | Altera
部品番号: EP1SGX40FF1020I6 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1320 | $13,200.00 |
| 100 | $1180 | $118,000.00 |
| 500 | $1050 | $525,000.00 |
| 1,000 | $950 | $950,000.00 |
EP1SGX40FF1020I6 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> logic IC -> integrated circuit, and they enable hardware-level parallelism for compute-intensive tasks that CPUs and DSPs handle sequentially.
Key features include 624 user I/Os, 41250 logic elements organized into Logic Array Blocks (LABs), 3.423 Mbits of TriMatrix embedded memory, and an industrial operating temperature grade (-40 °C to +100 °C). The device supports a nominal core supply voltage of 1.5 V with ±0.15 V tolerance, and on-die termination (OCT) for source-synchronous memory and high-speed serial interfaces.
The Stratix GX architecture integrates a hardened Physical Coding Sublayer (PCS), serializer/deserializer (SERDES), and clock data recovery (CDR) blocks on-chip, dramatically simplifying high-speed serial channel design. This hard-IP approach reduces logic consumption, frees up LUTs for application code, and improves timing closure versus soft SERDES implementations. Combined with dedicated PLLs and routing resources, the device targets protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI.
Typical applications include high-speed serial backplanes, network switch line cards, base-station protocol bridging, RAID controllers, and high-end test & measurement instrumentation. The high SERDES density also makes it well-suited for video broadcast routing, defense signal processing, and DSP co-processing in wireline infrastructure. The wide I/O count supports multiple parallel memory buses and external PHY interfaces on a single device.
A key design consideration is signal integrity at the 1020-ball BGA breakout: power decoupling must be planned per Stratix GX pin connection guidelines and the device's PowerPlay early power estimator should be run during architecture exploration to balance logic utilization against thermal envelope. Pin-compatible migration within the EP1SGX40 family allows designers to move between density variants (FF/GF/DF/CF) on the same footprint for cost or feature optimization.
This page synthesizes distributor pricing, drop-in alternatives within the EP1SGX40 family, and practical design notes not found in the manufacturer datasheet.
ドロップイン代替品: EP1SGX40FF1020I6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1SGX40FF1020I6 （同一形状・フットプリント） — 相違点: Package, Operating Temperature, Speed Grade, Family, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP1SGX40FF1020I5
✅ ドロップイン✓ 在庫あり
$695 / 個
データシートを見る →EP1SGX40FF1020C7
✅ ドロップイン✓ 在庫あり
$750 / 個
データシートを見る →EP1SGX40FF1020C6
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP1SGX40FF1020C5
✅ ドロップイン✓ 在庫あり
$1245 / 個
データシートを見る →EP1SGX40DF1020I6
✅ ドロップイン✓ 在庫あり
$198 / 個
データシートを見る →EP1SGX40GF1020I6
✅ ドロップイン✓ 在庫あり
$175 / 個
データシートを見る →EP1SGX40FF1020I6 最大定格＆電気的特性
| Series | Stratix® GX |
| Family | EP1SGX40 |
| Logic Elements | 41,250 |
| Embedded Memory | 3,423,744 bits |
| User I/Os | 624 |
| Logic Array Blocks (LABs) | 41,250 |
| パッケージ | 1020-ball FineLine BGA |
| 実装タイプ | Surface Mount |
| Core Voltage (VCCINT) | 1.5 V ±0.15 V |
| 動作温度 | -40 °C to +100 °C (Industrial) |
| Temperature Grade | I (Industrial) |
| Transceiver Channels | Up to 20 channels |
| Max Transceiver Data Rate | 3.1875 Gbps |
| Transceiver Technology | CDR with embedded SERDES |
| Process Technology | CMOS |
| Configuration | SRAM-based LUT |
EP1SGX40FF1020I6 1020-ball fineline bga ピン配置ガイド
EP1SGX40FF1020I6 (1020-ball fineline bga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1SGX40FF1020I6.
詳細は データシート をご参照ください。
主な用途
EP1SGX40FF1020I6 の用途: 6 件s: High-Speed Serial Backplane Routing, Telecom Line Card Aggregation, RAID Storage Controller, Test and Measurement Instrumentation, Defense Signal Processing, Video Broadcast Routing.
High-Speed Serial Backplane Routing
The EP1SGX40FF1020I6 is well matched to high-speed serial backplane routing because its up-to-20-channel hard SERDES reaches 3.1875 Gbps per channel, supporting protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The integrated clock-data-recovery blocks remove the need for external PHY components on low-lane-count ports and free LUT resources for MAC-layer logic. With 624 user I/Os the device can also drive multiple parallel LEDs or switch-fabric interfaces. Designers should use the Stratix GX device handbook's pin connection guidelines for board layout to keep the 1020-ball BGA SERDES channels within the published return-loss budget.
おすすめ
Telecom Line Card Aggregation
In telecom line-card aggregation the EP1SGX40FF1020I6's 41,250 logic elements support traffic-manager and packet-processing dataplanes while the integrated SERDES aggregate multiple 1 Gbps links without external PHYs. Its 1020-ball FineLine BGA exposes 624 user I/Os for backplane connectors, framer/mapper devices, and timing references. Industrial-grade -40 °C to +100 °C operation suits central-office deployments where ambient temperature is uncontrolled. Power-Play early power estimation should be run during architecture to size cooling for the worst-case traffic load, since the FF transceiver grade drives the highest dynamic power.
おすすめ
RAID Storage Controller
RAID storage controllers benefit from the EP1SGX40FF1020I6 because the 20 high-speed serial channels aggregate multiple SATA/SAS 3 Gbps links while the 41,250 LEs implement parity compute, XOR acceleration, and host-FIFO management. The 3,423,744 bits of TriMatrix embedded memory provides on-chip read/write buffers that hide SAS latency. Industrial temperature tolerance allows deployment in 24/7 data-center chassis. Designers should budget SERDES pre-emphasis per the Stratix GX PCB design guidelines to meet SATA/SAS Tx/Rx compliance masks over the full industrial range.
おすすめ
Test and Measurement Instrumentation
The EP1SGX40FF1020I6 fits high-end test-and-measurement instruments because 41,250 LEs can implement deep logic-analyzer capture state machines, real-time DSP, and protocol-aware triggering while the SERDES channels acquire multi-Gbps ADC data streams. The 1020-ball BGA and 624 user I/Os permit parallel LVDS connections to multi-channel ADCs and DACs. Industrial temperature enables portable chassis used outside air-conditioned labs. Quartus II with the SignalTap embedded logic analyzer gives designers 100+ MHz sample visibility without external probes.
おすすめ
Defense Signal Processing
Defense signal-processing cards leverage the EP1SGX40FF1020I6's 20-channel SERDES for radar I/Q data ingest, GPS/GNSS disciplined timing, and high-bandwidth sensor-fusion buses, while the 41,250 LEs run FFT, FIR filtering, and beamforming algorithms in hardware. Industrial-grade -40 °C to +100 °C operation is mandatory for unpressurized enclosures and ground-vehicle platforms. The hardened SERDES PCS replaces external PHYs to reduce SWaP-C (size, weight, power, cost). PowerPlay thermal estimation is recommended during card-stack design to ensure the 1020-ball BGA heat-sink path is adequate at altitude.
おすすめ
Video Broadcast Routing
In video broadcast routers the EP1SGX40FF1020I6's 20 SERDES channels at 3.1875 Gbps each aggregate SDI, HD-SDI, and 3G-SDI signals, while the 624 user I/Os provide crosspoint switching, genlock distribution, and metadata sideband interfaces. The 3,423,744 bits of TriMatrix embedded memory buffer frame-level data and the 41,250 LEs perform ancillary-data processing and embedded-audio demux. Industrial temperature rating suits OB-truck and flyaway deployments. PCB layout must observe the Stratix GX SERDES channel-to-channel skew budget to maintain SMPTE compliance.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1SGX40FF1020I6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1SGX40FF1020I5 | EP1SGX40FF1020C7 | EP1SGX40FF1020C6 | EP1SGX40FF1020C5 | EP1SGX40DF1020I6 | EP1SGX40GF1020I6 |
|---|---|---|---|---|---|---|---|
| Package | 1020-ball FineLine BGA | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Family | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX | Stratix GX |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| User I/Os | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Transceiver Grade | FF (max 20 ch @ 3.1875 Gbps) | FF (max 20 ch @ 3.1875 Gbps) | FF (max 20 ch @ 3.1875 Gbps) | FF (max 20 ch @ 3.1875 Gbps) | FF (max 20 ch @ 3.1875 Gbps) | DF (different channel count) | GF (different channel count) |
| Temperature Grade | Industrial (-40 °C to +100 °C) | Industrial (-40 °C to +100 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Commercial (0 °C to +85 °C) | Industrial (-40 °C to +100 °C) | Industrial (-40 °C to +100 °C) |
| Speed Bin | 6 | 5 | 7 | 6 | 5 | 6 | 6 |
主な差別化要因
- Maximum transceiver channel count in the EP1SGX40 family （vs EP1SGX40DF1020I6 / EP1SGX40GF1020I6)
- Industrial temperature grade with high-speed speed bin 6 （vs EP1SGX40FF1020C7 / EP1SGX40FF1020C5)
- Pin-compatible migration within the EP1SGX40 1020-ball BGA family （vs EP1SGX25FF1020I6 (lower density))
設計ノート
The 1020-ball FineLine BGA uses a high-density ball pitch (~1.0 mm) that typically requires PCB microvia or via-in-pad construction. Stack-up must follow Stratix GX device handbook recommendations: at minimum a 6-layer board with continuous power/ground planes under the device, low-Dk/Df dielectric (FR-408HR, Megtron 6 or similar) for 3 Gbps SERDES channels, and matched 100-ohm differential impedance on all SERDES pairs. Decoupling must combine 0402/0603 ceramics on each power rail plus low-ESR bulk capacitors near the BGA corners.
Estimated: with the FF transceiver grade fully populated (20 channels at 3.1875 Gbps), worst-case power consumption is in the 15-25 W range per Altera's PowerPlay estimator inputs (100% SERDES utilization, 50% logic toggle, 50% memory toggle). For the 1020-ball BGA with no onboard heatsink, use a 25 mm × 25 mm × 10 mm aluminum heatsink plus 200 LFM airflow to keep junction temperature below 100 °C in the industrial temperature range. Run PowerPlay Early Power Estimator during architecture exploration to size the thermal solution.
Do not migrate from EP1SGX40FF1020I6 to a non-FF (GF/DF/CF) transceiver-grade variant without re-validating the Quartus II SERDES channel mapping - the FF grade has the maximum channel count and not all 'G/D/C' grades expose every channel pin. The I6 vs I5 vs C7 suffix encodes both temperature grade and speed bin; using a C7 grade in an industrial-temperature design violates the published operating range. Always check the device handbook pin connection guidelines before finalizing the PCB.
SERDES channels on Stratix GX need pre-emphasis and equalization tuned per the Stratix GX PHY User Guide to meet 3.125 Gbps compliance masks. Use HyperLynx or SiSoft QCD for channel simulation; provide a -3 dB insertion-loss budget not exceeding the Stratix GX device handbook limit at half the Nyquist frequency. Match intra-pair skew to within 5 mils and inter-pair skew to within 50 mils on the PCB. Reference clocks must be AC-coupled with 50-ohm termination to 0.9 V VTT.
コンプライアンス情報
Compliance status not stated in the verified web data. EP1SGX40 family members are widely reported as lead-free by Altera/Intel packaging documentation, but RoHS/REACH certificates must be requested from the manufacturer for this obsolete SKU.
