EP1SGX40GF1020I6 - Stratix GX FPGA, 41,250 LEs, 624 I/O | Intel
MPN: EP1SGX40GF1020I6 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $175 | $175,000.00 |
Drop-in alternatives for EP1SGX40GF1020I6 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1SGX40GF1020C6
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View Datasheet →EP1SGX40GF1020I6 Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Number of Logic Elements (LEs) | 41,250 |
| Number of Logic Array Blocks (LABs) | 4,125 |
| Total Embedded Memory | 3,423,744 bits (3.4 Mbit) |
| Number of User I/O Pins | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 5000 MHz |
| Transceiver Data Rate | Up to 3.125 Gbps |
| Package Type | FC-FBGA-1020 |
| Package Dimensions | 33 mm x 33 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature | 0C to +85C (Industrial I6 grade) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP1SGX40GF1020I6 33 mm x 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020I6 (33 mm x 33 mm package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020I6.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I6 is suitable for 6 applications: PCI Express Gen1 Endpoint, Serial RapidIO Backplane Aggregation, XAUI 10 Gbps Network Interface, ASIC Prototyping and Emulation, High-Speed Data Acquisition, Broadcast Video Processing.
PCI Express Gen1 Endpoint
The EP1SGX40GF1020I6 is well-suited for PCI Express Gen1 endpoint designs because its integrated multi-gigabit transceivers operate at 2.5 Gbps, matching the PCIe Gen1 line rate exactly. With 41,250 logic elements, the device can host the PCIe IP core plus a complete application layer (for example, a DMA engine or protocol bridge) on a single chip. Place the EP1SGX40 in the PCIe x1/x4/x8 slot footprint; the 1020-ball FC-FBGA exposes all required transceiver and reference-clock balls. The device's 3.4 Mbit of embedded memory buffers transaction-layer packets efficiently, reducing the need for external SRAM. Quartus II includes the PCIe Compiler IP, which provides TLP handling, configuration space, and interrupt logic ready for this die. Total board-level integration is significantly higher than a discrete PHY plus an FPGA approach.
Recommended
Serial RapidIO Backplane Aggregation
The EP1SGX40GF1020I6's 3.125 Gbps transceivers and 41,250-LE fabric make it an ideal aggregator for Serial RapidIO (SRIO) backplanes. Each transceiver lane can carry SRIO at 1.25, 2.5, or 3.125 Gbps with full 8b/10b encoding, and the high LE count is sufficient to terminate multiple SRIO ports, run a switching fabric, and perform DMA into local memory. The 1020-ball FC-FBGA exposes 16+ transceiver channels, allowing 4x or 8x SRIO port configurations with redundancy. Industrial temperature grade (I6, -40C to +85C) is critical for outdoor and ruggedized backplane applications. Altera's Serial RapidIO MegaCore function is supported in Quartus II and provides full Logical/Transport/Physical layer stacks for this die.
Recommended
XAUI 10 Gbps Network Interface
The EP1SGX40GF1020I6 supports XAUI (10 Gigabit Attachment Unit Interface) at 4x 3.125 Gbps lanes, exactly matching the XAUI line rate. With its 41,250 logic elements, the device can implement the XGXS (XGMII Extender Sublayer) PCS, 8b/10b encoding, lane alignment, and clock compensation, plus a 10G MAC above the PHY. The 624 user I/Os are sufficient for XGMII plus management interface (MDIO/MDC) and external memory. Industrial temperature grade (I6) is suitable for switch line-card deployments. Pairing the EP1SGX40 with an external 10GBASE-T or 10GBASE-R PHY (such as an XFP/SFP+ module) yields a complete XAUI-to-optical interface. Quartus II includes the XAUI MegaCore IP for this die.
Recommended
ASIC Prototyping and Emulation
The EP1SGX40GF1020I6's combination of 41,250 logic elements, 3.4 Mbit of embedded memory, and 624 user I/Os makes it a strong ASIC prototyping vehicle for mid-complexity ASICs. Designers can partition a multi-million-gate ASIC into multiple Stratix GX devices using the 3.125 Gbps transceivers as high-speed chip-to-chip links, eliminating the need for expensive multi-FPGA debug boards. The 1020-ball FC-FBGA exposes enough I/O to map peripheral buses (DDR, Ethernet MAC, etc.) directly. Industrial temperature grade (I6) is appropriate for in-vehicle and industrial ASIC emulation. Quartus II design partitioning tools support multi-device compilation flows targeting this die.
Recommended
High-Speed Data Acquisition
The EP1SGX40GF1020I6 serves high-speed data acquisition systems where multi-gigabit serial links (3.125 Gbps transceivers) feed parallel DSP pipelines implemented in FPGA fabric. The 41,250 logic elements host FIR filters, FFT engines, and channelizers; the 3.4 Mbit embedded memory serves as sample buffer; and the 624 user I/Os connect to parallel ADC/DAC devices. Industrial temperature grade (I6) is suitable for test and measurement, radar, and electronic-warfare front-ends. Quartus II DSP Builder integrates with MATLAB/Simulink, enabling floating-point-to-fixed-point conversion directly into the FPGA fabric. The 1020-ball FC-FBGA exposes sufficient high-speed LVDS pairs for ADC/DAC interfaces.
Recommended
Broadcast Video Processing
The EP1SGX40GF1020I6's high logic density, embedded memory, and 624 I/Os suit professional broadcast video processing where SDI (Serial Digital Interface) at 270 Mbps, 1.485 Gbps, or 3 Gbps must be aggregated, de-embedded, and re-formatted. The 3.125 Gbps transceivers support 3G-SDI directly, while the 41,250 LEs can implement audio de-embedding, frame synchronizers, and up/down/cross converters. Industrial temperature grade (I6) is required for studio and outside-broadcast equipment. The 1020-ball FC-FBGA accommodates multiple SDI channels plus parallel video and audio buses. Quartus II includes video and image processing IP suites (VIP) compatible with this die.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020C6 | EP1SGX40DF1020C6 | EP1SGX40DF1020I6 | EP1SGX40FF1020I6 | EP1SGX40GF1020C5 | EP1SGX40GF1020C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FC-FBGA-1020 (33x33 mm) | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same | FC-FBGA-1020 (33x33 mm) - same |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits |
| User I/Os | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | I6 (industrial) | C6 (commercial) | C6 (commercial) | I6 (industrial) | I6 (industrial) | C5 (slower, commercial) | C7N (faster, commercial) |
| Transceiver Type | GF (Gigabit) | GF (Gigabit) | DF (Standard) | DF (Standard) | FF (Enhanced Feature) | GF (Gigabit) | GF (Gigabit) |
Key Differentiators
- Highest-density Stratix GX in 1020-ball FC-FBGA with integrated multi-gigabit transceivers (vs EP1S40B956I6 (Stratix, BGA-956, no transceivers))
- Industrial temperature grade (I6) for -40C to +85C operation (vs EP1SGX40GF1020C6 (commercial C6, 0C to 85C))
- Pin-compatible drop-in across the EP1SGX40 speed grade and transceiver family (vs EP1SGX25FF1020C7 (Stratix GX 25,660 LEs, 1020-ball FC-FBGA))
Design Notes
The 1020-ball FC-FBGA at 1.0 mm pitch requires a high-density PCB stack-up. Use at least 6 layers with microvia (laser-drilled) technology or HDI (Any-Layer via) for fan-out escape routing. Allocate dedicated power and ground planes under the BGA; the 1.5 V core rail can draw significant transient current, so place 0402-size 0.1 uF decoupling capacitors on every 4 to 6 power balls, plus bulk 10 uF ceramics around the package perimeter. Matched-length differential routing is mandatory for the 3.125 Gbps transceiver lanes - target 100 ohm differential impedance with 5 mil trace width and 7 mil gap on a standard 4-mil dielectric. Reference Intel/Altera application note AN224 for detailed routing guidelines.
Estimated: At 100% logic utilization, the EP1SGX40GF1020I6 can dissipate 5-8 W, and the 33x33 mm FC-FBGA has a typical theta_JA of approximately 8-12 C/W with adequate PCB copper. Calculate junction temperature as TJ = TA + (PD * theta_JA); for industrial applications at 85C ambient, the device budget is roughly 8 W before derating is required. Use thermal vias under the exposed die pad and provide forced-air cooling if the design runs at high toggle rates or in a sealed enclosure. Thermal simulation is recommended during PCB layout, not after.
Critical pitfalls to avoid when designing with the EP1SGX40GF1020I6: (1) Do not use Quartus Prime newer than 18.1 without legacy device support - the Stratix GX family is only fully supported in Quartus II (not Quartus Prime). (2) The configuration scheme (Passive Serial, Fast Passive Parallel, or JTAG) must match the board's EPCS or EPC configuration PROM; mismatch is a common source of bring-up failures. (3) Leave at least 2 transceiver channel banks unused if you do not need all 16+ channels - this simplifies PCB routing and reduces crosstalk. (4) Verify the I/O standard (LVTTL, LVCMOS, LVDS, SSTL) per bank; banks cannot mix standards arbitrarily. (5) Industrial I6 grade parts must be used for -40C to +85C environments; commercial C-grade parts will fail outside 0C to 85C.
The 3.125 Gbps transceiver channels require careful signal-integrity management. Use a continuous reference plane beneath the transceiver traces; avoid crossing plane splits. DC-blocking capacitors (typically 100 nF 0402 X7R) must be placed close to the TX outputs per the Intel Stratix GX handbook. Reference clock inputs (typically 156.25 MHz for 3.125 Gbps operation) must be routed with controlled impedance and isolated from switching noise; use a dedicated clock generator such as an Si5317 or CDCE62005 for low-jitter operation. Pre-emphasis and equalization settings should be tuned per channel using the Quartus II Transceiver Toolkit.
Compliance Information
RoHS compliance per Altera/Intel product page. The Stratix GX family is not AEC-Q100 qualified (FPGA, not automotive-grade). Lead-free per JEDEC J-STD-020 reflow compatibility. Halogen-free status unknown - consult Intel directly. Lifecycle status obsolete as of 2026-09-07; last-time-buy windows closed years ago.
