EP1SGX40FF1020C7 - Stratix GX FPGA 41,250 LE | Intel | 1020-BGA
MPN: EP1SGX40FF1020C7 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $980 | $980.00 |
| 10 | $925 | $9,250.00 |
| 100 | $860 | $86,000.00 |
| 500 | $805 | $402,500.00 |
| 1,000 | $750 | $750,000.00 |
Drop-in alternatives for EP1SGX40FF1020C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40FF1020C7 Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX40) |
| Logic Elements (LE) | 41,250 |
| Configurable Logic Blocks (CLB) | 4,125 |
| Embedded Memory (bits) | 3,423,744 |
| User I/O Pins | 624 |
| Number of Logic Array Blocks (LAB) | 4,125 |
| Number of I/O Banks | 12 |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) |
| Speed Grade | 7 (-7, mid-speed) |
| Process Technology | CMOS |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Package | 1020-ball FC-FBGA (S-PBGA-B1020) |
| Package Dimensions | 33 mm × 33 mm |
| Ball Pitch | 1.00 mm |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Configuration Modes | PS, PPS, PPA, JTAG, AS |
| DSP Blocks (9-bit) | 176 |
| Transceiver Channels | 20 full-duplex 3.1875 Gbps + 14 dedicated full-duplex 1.25 Gbps |
| PLLs | 8 enhanced + per-transceiver PLLs |
EP1SGX40FF1020C7 33 mm × 33 mm Pin Configuration Guide
Complete pinout information for EP1SGX40FF1020C7 (33 mm × 33 mm package) with 624 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40FF1020C7.
Refer to the datasheet for full pin configuration.
Estimated pin count: 624 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40FF1020C7 is suitable for 7 applications: Wireless Base Station Protocol Bridging, Broadcast Video Routers and Cross-Point Switches, High-Speed Test and Measurement Equipment, Defence and Radar Signal Preprocessing, Storage Controllers and SAS/SATA Aggregation, Industrial Imaging and Machine Vision, Medical Imaging and Diagnostic Equipment.
Wireless Base Station Protocol Bridging
The EP1SGX40FF1020C7's 20 × 3.1875 Gbps transceivers and 14 dedicated 1.25 Gbps full-duplex channels make it ideal for base-station protocol bridging between CPRI/OBSAI fronthaul links and Ethernet backhaul. Its hardened PCI Express PIPE endpoint allows direct aggregation into a baseband ASIC over PIPE without soft IP overhead. The 41,250 logic elements provide ample headroom for CPRI re-mapping, OBSAI RP3-01 framing, and Ethernet MAC/PCS processing on a single chip. Stratix GX error-correcting transceivers meet the 1e-12 BER requirements for cellular fronthaul, and the 1020-ball BGA supports thermal dissipation for hot outdoor enclosures when paired with adequate heatsinking. Compared with two-chip solutions using separate PHY and ASSP, this single-chip approach reduces BOM, board area, and inter-chip latency.
Recommended
Broadcast Video Routers and Cross-Point Switches
The EP1SGX40FF1020C7 supports multiple broadcast video interfaces via Serial RapidIO, XAUI, and SerialLite II protocols running on its 20 transceivers. With 624 user I/Os it can interface to parallel SDI crosspoints, HDMI receivers, and control-plane Ethernet simultaneously, replacing multiple ASSPs in a video-routing frame. Its 3,423,744 bits of embedded RAM (distributed across MLAB, M512, M4K, and M-RAM blocks) hold video frame buffers for de-embedding, frame-store conversion, and audio de-embedding without external memory. The 1020-ball FC-FBGA supports the high pin density required for broadcast chassis designs, and the commercial 0 °C to 85 °C junction range suits air-conditioned studio racks. Quartus II IP cores (Triple-Speed Ethernet, XAUI PHY, SDI encoder/decoder) accelerate integration for broadcast OEMs.
Recommended
High-Speed Test and Measurement Equipment
Test and measurement platforms such as logic analysers, protocol analysers, and BERT testers leverage the EP1SGX40FF1020C7's 20 transceivers to capture and generate multi-channel serial traffic at 3.1875 Gbps, supporting standards like XAUI, SATA, Serial RapidIO, and PCI Express Gen1. The 176 dedicated 9-bit DSP blocks enable real-time CRC/checksum computation and pattern matching at line rate, while the 41,250 logic elements host a soft multi-lane trigger engine. Its 624 I/O pins drive LVDS parallel probes and synchronisation interfaces, and the 1020-ball FC-FBGA fits within the standard instrumentation chassis footprint. Embedded memory (3,423,744 bits) supports deep state-counters and pattern-history buffers, while the FPGA's JTAG interface simplifies in-system debug for the test set's own firmware. The mid-speed -7 grade is typical for these instrumentation workloads where deterministic latency outweighs absolute throughput.
Recommended
Defence and Radar Signal Preprocessing
Radar and electronic-warfare subsystems use the EP1SGX40FF1020C7 for front-end DSP preprocessing: the 176 9-bit DSP blocks execute FIR/FFT kernels on wide-bandwidth digital downconversion data streams, while the 20 transceivers ingest multi-element antenna array samples at 3.1875 Gbps per channel. The 3,423,744 bits of distributed RAM act as a circular sample buffer, enabling coherent integration without external memory in some configurations. Its hardened PCI Express PIPE block transmits pre-processed data to a downstream processor (DSP or GPP) over Gen1 PCIe. The 1020-ball FC-FBGA with 1.00 mm pitch supports ruggedised military board assemblies and is qualified for the commercial 0-85 °C temperature range typical of air-cooled defence subsystems. Quartus II DSP Builder and Megacore IP accelerate FFT and FIR development for radar OEMs.
Recommended
Storage Controllers and SAS/SATA Aggregation
Storage-area network (SAN) controllers and RAID-on-chip designs use the EP1SGX40FF1020C7 to aggregate multiple 3 Gbps SATA or SAS links: each of the 20 transceivers drives a SATA II/SAS port, and the embedded PCI Express PIPE block uplinks to a host CPU at Gen1 rates. The 41,250 logic elements host RAID-6 XOR engines, NCQ schedulers, and disk-state caches, while the 3,423,744 bits of RAM provide write-coalescing buffers and metadata caches. Hot-plug hot-swap and surprise-removal logic is hardened in the FPGA's hot-socketing controller, simplifying board design. The 1020-ball FC-FBGA fits within standard ATCA/AMC storage module footprints. Compared with discrete PHY + ASSP solutions, the integrated transceivers reduce board layers and BOM cost while delivering better signal integrity.
Recommended
Industrial Imaging and Machine Vision
High-speed industrial camera systems use the EP1SGX40FF1020C7 to aggregate multiple CoaXPress, Camera Link, or GigE Vision channels at 3.1875 Gbps per transceiver. Its 624 user I/Os interface to parallel CCD/CMOS sensor arrays and trigger synchronisation buses, while the 176 DSP blocks handle real-time Bayer demosaicing, white-balance, and gamma correction at line rate. The 3,423,744 bits of embedded RAM hold multi-frame buffers for line-scan camera reconstruction. Hardened PCI Express PIPE blocks enable direct image transfer to a host PC at Gen1 rates with minimal latency. The commercial 0-85 °C junction range suits factory-floor enclosures with appropriate airflow. Quartus II IP cores for Camera Link, CoaXPress, and GigE Vision accelerate integration for vision-system OEMs.
Recommended
Medical Imaging and Diagnostic Equipment
Medical imaging modalities (ultrasound, CT, MRI, X-ray digitiser) leverage the EP1SGX40FF1020C7's 20 transceivers to ingest high-frequency data from multi-channel probe arrays and digitiser boards. The 176 9-bit DSP blocks execute beamforming, FFT, and back-projection algorithms in real time, while the 3,423,744 bits of embedded RAM hold image reconstruction tiles without external memory in some configurations. Its 624 I/O pins interface to legacy parallel imaging buses and LVDS channels from front-end ADCs, and the PCI Express PIPE endpoint transfers reconstructed images to the host workstation. The commercial 0-85 °C range suits the controlled environments of hospital equipment rooms. Quartus II supports IEC 62304 / IEC 61508 design flows and DO-254 documentation packages required for medical / safety-critical certification.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40FF1020C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40FF1020C6 | EP1SGX40FF1020C5 | EP1SGX40F1020C6 | EP1SGX40F1020C5N | EP1SGX40F1020 | EP1S60F1020C7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Speed Grade | -7 (mid) | -6 (slower) | -5 (slowest) | -6 (slower) | -5 (slowest) | no suffix (default) | -7 (mid) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 57,120 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 5,138,016 |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 | 624 |
| Transceiver Channels (3.1875 Gbps) | 20 | 20 | 20 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 0 (no GX transceivers) |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- 20 × 3.1875 Gbps transceiver channels in a single device (vs EP1SGX25FF1020C7)
- Mid-speed -7 grade balances cost and timing margin (vs EP1SGX40FF1020C6)
- Hardened PCI Express PIPE endpoint (vs EP1S60F1020C7)
- 3,423,744 bits of embedded RAM via TriMatrix architecture (vs EP1SGX40DF1020C7)
Design Notes
Estimated: The Stratix GX PowerPlay early-power estimator is required before PCB layout because the EP1SGX40FF1020C7 can dissipate 10-25 W depending on transceiver utilisation, logic activity, and clock tree. A typical base-station design with 16 active 3.1875 Gbps channels at 80% utilisation draws approximately 18 W from VCCINT (1.5 V) plus 4-6 W from VCCIO banks and 3-5 W from VCCA/VCCP/VCCR transceiver rails. Design a 6-layer board with dedicated VCCINT, VCCIO, VCCA/VCCP/VCCR and GND planes to minimise return-path impedance, and place 0402/0201 ceramic decoupling within 1-2 mm of every supply ball per Stratix GX layout guidelines.
Each 3.1875 Gbps transceiver channel needs 100 Ω differential routing with controlled 100 Ω ± 10% impedance, intra-pair length matching of ± 0.13 mm (5 mil), and inter-pair matching of ± 0.64 mm (25 mil). Use a 4-PCB layer stack-up for the transceiver region with a stripline geometry; the Stratix GX device-handbook layout chapter (Chapter 7) provides stack-up recommendations for the 1020-ball FC-FBGA package. Maintain 100 Ω reference ground impedance with continuous ground underneath each differential pair, and stitch vias every λ/20 of the operating frequency (about every 50 mm at 3.125 GHz). Transmitter pre-emphasis and receiver equalisation settings are configured via the ALTGX megafunction in Quartus II.
Do not assume 5 V tolerance on user I/O pins - the Stratix GX supports VCCIO levels of 1.5 V, 1.8 V, 2.5 V, and 3.3 V, and exceeding the per-bank VCCIO range will damage the device. The configuration controller must observe VCCINT/VCCA power-sequencing rules; configure the MSEL pins correctly for your boot mode (AS, PS, JTAG) before applying power. Hot-socketing is supported but you must tri-state outputs during insertion - the Stratix GX hot-socketing feature requires dedicated board-level sequencing. Lastly, do not forget the JTAG TCK pull-down and TMS pull-up resistors specified in the device handbook - missing these will cause configuration failures.
Estimated: At full 20-transceiver utilisation the EP1SGX40FF1020C7 may dissipate 20-25 W. With the 1020-ball FC-FBGA's θJA of approximately 8 °C/W on a standard JEDEC test board, the junction-to-ambient rise would be 160-200 °C, which exceeds the 85 °C commercial junction limit at 25 °C ambient. Use a thermal enhanced test board with thermal vias and a heatsink, or design a cold-plate assembly for chassis with forced airflow ≥ 200 LFM. The Stratix GX AN-463 application note provides detailed thermal modelling examples for the 1020-ball BGA package.
At 3.1875 Gbps transceiver rates, signal-integrity simulation (pre-layout and post-layout) is mandatory. Use HyperLynx, SiSoft QCD, or Ansys SIwave with the Stratix GX IBIS-AMI models available from Intel's website. Pre-emphasis, de-emphasis, and receiver CTLE settings must be tuned per channel based on the simulated channel loss at the Nyquist frequency. The ALTGX megafunction in Quartus II also exports per-lane eye-diagram measurements via SignalTap II for in-system validation.
Compliance Information
Stratix GX devices comply with RoHS 6/6 and are lead-free. No AEC-Q100 qualification (commercial temperature range only).
