EP20K200CB356C7N - APEX 20KC FPGA 200K Gates 356-BGA | Intel / Altera
部品番号: EP20K200CB356C7N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP20K200CB356C7N 概要
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, memory blocks, and I/O protocols after manufacturing. The APEX 20KC family extends the original APEX 20K series with MultiCore architecture integrating lookup tables, product-term logic, and embedded system blocks (ESBs) for memory. In the broader taxonomy, FPGAs sit within programmable logic devices -> PLDs -> digital logic ICs -> semiconductors, and are widely used for glue logic, bus bridging, and DSP pre/post-processing where ASIC NRE cost is prohibitive.
Key features include 263 user I/O lines supporting multiple I/O standards, on-chip ESBs configurable as dual-port RAM, ROM, or first-in first-out (FIFO) buffers, 4-phase PLL-based clock management with up to four outputs, JTAG (IEEE 1149.1) boundary-scan test support, and in-system programmability through the Altera Quartus / MAX+PLUS II tool chain. The device supports hot-socketing and PCI compliance, making it suitable for mixed-voltage legacy and modern interface designs.
Typical applications include telecommunications line-card interfaces, industrial control and factory automation, ASIC prototyping, glue logic and bus bridging in embedded computing, and high-speed custom DSP datapaths. The wide I/O count (263 user I/Os) makes it a strong fit for designs requiring extensive parallel connectivity such as video processing front-ends and protocol-conversion bridges.
When designing with this device, ensure I/O bank supply voltages match the connected peripherals and use the Altera Quartus II tool chain (or MAX+PLUS II legacy) for place-and-route. Note that the APEX 20KC family has been NRND/obsolete since approximately 2006-2008; verify long-term availability with the franchised distributor before committing the design to production.
ドロップイン代替品: EP20K200CB356C7N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K200CB356C7N （同一形状・フットプリント） — 相違点: Process Technology, Operating Temperature, Package, Family, Series.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K200CB356C7ES
✅ ドロップイン✓ 在庫あり
$108.5 / 個
データシートを見る →EP20K200CB356C8
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP20K200CB356C9
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$69.95 / 個
データシートを見る →EP20K200BC356-1
✅ ドロップイン✓ 在庫あり
$335 / 個
データシートを見る →EP20K200BC356-2
✅ ドロップイン✓ 在庫あり
$88.25 / 個
データシートを見る →EP20K200BC356-3
✅ ドロップイン✓ 在庫あり
$162 / 個
データシートを見る →EP20K100CB356C7
✅ ドロップイン✓ 在庫あり
$71 / 個
データシートを見る →EP20K200CB356C7N 最大定格＆電気的特性
| Family | APEX 20KC |
| Series | EP20K200 |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Maximum Operating Frequency | 3571.6 MHz (internal equivalent) |
| Propagation Delay | 1.48 ns |
| User I/Os | 263 |
| Input Terminals | 267 |
| Supply Voltage (Nominal) | 1.8 V |
| Process Technology | 0.15 um CMOS |
| 動作温度 | 0C to +85C (Commercial) |
| パッケージ | 356-ball PBGA (S-PBGA) |
| 実装タイプ | Surface Mount |
| Embedded Memory | ESBs (dual-port RAM/ROM/FIFO) |
| Clock Management | PLL with up to 4 outputs |
| JTAG Support | Yes (IEEE 1149.1) |
| In-System Programmable | Yes |
| RoHS ステータス | unknown |
EP20K200CB356C7N 356-ball pbga (s-pbga) ピン配置ガイド
EP20K200CB356C7N (356-ball pbga (s-pbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K200CB356C7N.
詳細は データシート をご参照ください。
主な用途
EP20K200CB356C7N の用途: 6 件s: Telecommunications Line-Card Interface, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Glue Logic / Bus Bridging in Embedded Computing, High-Speed Custom DSP Datapath Pre/Post-Processing, Video Processing Front-End Interface.
Telecommunications Line-Card Interface
The EP20K200CB356C7N's 263 user I/Os, 8,320 logic cells, and embedded dual-port RAM blocks (ESBs) make it well-suited for telecom line-card glue logic. The device can implement TDM bus aggregation, framing/deframing, and protocol-conversion state machines between backplane SERDES and framer ICs. With 200K system gates it absorbs multi-channel HDLC controllers and ATM cell-processing datapaths in a single chip. Its PCI-compliant I/O banks support direct connection to PowerPC / MIPS host processors without external transceivers. The 1.8V core plus multi-standard I/O (1.5V/2.5V/3.3V) eases integration with legacy 3.3V line-interface ASICs alongside modern 1.5V switch fabrics.
おすすめ
ASIC Prototyping and Emulation
With 200K system gates and 8,320 logic cells, the EP20K200CB356C7N serves as a high-capacity ASIC prototype platform. Designers map RTL into the device using Quartus II synthesis, allowing functional verification of complex ASIC designs before mask commitment. The 356-ball PBGA package exposes enough pins for full ASIC boundary emulation including JTAG, scan, and parallel test access. MultiCore architecture (LUT + product-term + ESB memory) accommodates ASIC designs mixing random logic with embedded SRAM/ROM. Engineers use this device to validate ASIC RTL months before silicon availability, reducing respin risk on multi-million-gate ASIC projects.
おすすめ
Industrial Control and Factory Automation
The EP20K200CB356C7N's wide I/O count (263 user I/Os) interfaces directly to multiple encoder, sensor, and actuator buses in factory automation systems. Its 0C to 85C commercial temperature range suits climate-controlled cabinet installations, while the robust CMOS 0.15um process delivers proven long-term reliability in 24/7 industrial environments. The MultiCore architecture implements deterministic state machines for motion control, while ESB blocks buffer burst sensor streams. JTAG boundary-scan simplifies board-level test on densely-populated PLC backplanes. The PBGA package's thermal performance supports sustained operation in fan-less control cabinets.
おすすめ
Glue Logic / Bus Bridging in Embedded Computing
The EP20K200CB356C7N excels at bus-bridging glue logic between mismatched processor peripherals (e.g. PCI to local bus, VME to PMC, or custom backplane protocols). Its 200K gates absorb protocol-conversion state machines, FIFOs, and address-decoding logic that would otherwise require multiple discrete CPLDs. The ESB blocks implement deep FIFOs for crossing clock domains between asynchronous buses. Hot-socketing support allows insertion into live backplanes without disturbing existing traffic. Quartus II MegaWizard IP cores accelerate PCI, I2C, and memory-controller instantiation, dramatically shortening development time versus discrete logic.
おすすめ
High-Speed Custom DSP Datapath Pre/Post-Processing
The EP20K200CB356C7N's 8,320 logic cells, 4-PLL clock management, and 3571.6 MHz internal equivalent frequency support custom DSP datapaths for radar, sonar, and software-defined radio pre/post-processing. Distributed arithmetic FIR filters, FFT butterflies, and CORDIC engines map efficiently into the LUT-rich fabric. Multi-rate sample conversion and decimation/interpolation filters fit within ESB memory blocks. Engineers pair the EP20K200 with dedicated DSP or ADC/DAC chips to offload pre-processing, freeing the host CPU for higher-level tasks. The 263 user I/Os handle wide parallel data buses from external ADC/DAC converters without multiplexing.
おすすめ
Video Processing Front-End Interface
The EP20K200CB356C7N's 263 user I/Os handle wide parallel video buses (e.g. 24-bit RGB, ITU-R BT.656, or Camera Link) directly from image sensors and video decoder ICs. The device implements color-space conversion, frame buffering, de-interlacing, and overlay composition in a single chip, eliminating external ASICs. ESB blocks function as line buffers and double-buffered frame stores, while the high gate density accommodates format-conversion pipelines. The 1.8V core with multi-standard I/O banks interfaces directly to both 3.3V legacy video ADCs and 1.5V modern CMOS sensors. Quartus II Video IP cores accelerate development of common broadcast formats.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K200CB356C7N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K200CB356C7ES | EP20K200CB356C8 | EP20K200CB356C9 | EP20K200BC356-1 | EP20K100CB356C7 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same |
| Package | 356-ball PBGA | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20K (non-KC) | APEX 20KC |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Logic Cells | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 4,640 |
| User I/Os | 263 | 263 | 263 | 263 | 263 | 263 |
| Speed Grade | -7 | -7 | -8 (slower) | -9 (slowest) | -1 (non-KC process) | -7 |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.18 um CMOS | 0.15 um CMOS |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) |
主な差別化要因
- Highest speed grade in APEX 20KC 200K family （vs EP20K200CB356C9)
- APEX 20KC silicon (0.15um) is faster than APEX 20K (0.18um) （vs EP20K200BC356-1)
- Highest gate count in the 356-ball BGA pin-compatible family （vs EP20K100CB356C7)
設計ノート
Estimated migration risk: The APEX 20KC family is obsolete (EOL approximately 2006-2008). New designs should NOT select this part - migrate to Cyclone III EP3C40/EP3C80 (different BGA package, requires PCB redesign) or Cyclone IV. For existing designs, plan for last-time-buy and inventory buffer. Verify RoHS status with the manufacturer before placing Pb-free assembly orders because legacy APEX 20KC parts may have non-RoHS finishes.
Estimated: At maximum toggle activity on 263 I/Os with 1.8V core, total power can reach 1.5-2.5W. The 356-ball PBGA has theta_JA of approximately 15-20 C/W with proper PCB thermal vias, so junction temperature rise is roughly 25-50C above ambient. Decouple VCCINT (1.8V core) with 0.1uF + 10uF ceramic caps per Altera AN 114 (APEX 20K design guidelines). VCCIO banks (1.5V/2.5V/3.3V) require separate decoupling; mixing standards on a single bank is not allowed.
Use a minimum 4-layer PCB with continuous power planes under the BGA. Place 0.1uF decoupling caps on the bottom side directly beneath each VCC/VCCIO ball pair. The 356-ball PBGA uses 1.27 mm ball pitch - escape routing requires either microvia (laser-drilled) or dogbone fanout on 8 mil traces. Match clock trace lengths within 50 mil for differential clocks. Keep JTAG pins (TCK/TMS/TDO/TDI) away from switching signals to avoid programming failures.
APEX 20KC I/O banks support LVTTL, LVCMOS, PCI, SSTL, and GTL+ at speeds up to 250 MHz. For DDR memory interfaces, use SSTL_2 Class-II I/O with external VTT termination. Place series damping resistors (22-33 ohm) on high-edge-rate outputs driving backplane traces >2 inches. For 100 MHz+ clocks, use the PLL output pins directly rather than routing through general-purpose I/O. Reference Altera AN 224 (High-Speed Board Design) for controlled-impedance stackup guidance.
コンプライアンス情報
Family is obsolete (EOL circa 2006-2008). RoHS / REACH status not confirmed in provided data; legacy parts may have SnPb finish. Use EP20K200CB356C7ES suffix variant for lead-free if compliance is required, but verify with distributor datasheet.
