EP20K100CB356C7ES - APEX20K 100K Gate FPGA | Intel | 356-BGA
部品番号: EP20K100CB356C7ES ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP20K100CB356C7ES 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed after manufacturing. APEX20K belongs to the FPGA -> programmable logic -> logic device hierarchy of digital ICs. Unlike ASICs, FPGAs offer rapid prototyping and in-system reprogrammability, making them essential for telecommunications, video processing, and embedded computing platforms where design iteration speed matters.
Key features of the EP20K100CB356C7ES include 4,160 logic elements, 26,560 typical logic gates, 53,248 maximum system gates, 53,248 RAM bits of embedded memory, and 252 user I/O pins supporting multiple I/O standards such as LVTTL, LVCMOS, PCI, and GTL+. The device operates from a 1.8 V core supply with 3.3 V/2.5 V I/O compatibility and includes on-chip PLL clock management.
Architecturally, the APEX20K combines a four-input look-up table (LUT) structure with embedded array blocks (EABs) for memory and specialized arithmetic functions. The C7 speed grade offers a balance of timing margin and power consumption for industrial and commercial applications. The device is configured via JTAG (IEEE 1149.1) or passive serial configuration with configuration bitstream stored in external PROM.
Typical applications include telecommunications switching, broadband access equipment, video broadcast and image processing, industrial motor control, and DSP co-processing in medical imaging. With its high I/O count and embedded memory, the EP20K100CB356C7ES is well suited for multi-channel data acquisition and protocol bridging designs.
When designing with the APEX20K family, pay close attention to power sequencing - the core 1.8 V supply must ramp before I/O supplies to avoid latch-up. The Quartus development toolchain (legacy MAX+PLUS II for older designs) supports this device, providing synthesis, place-and-route, and timing analysis. Use surface-mount BGA assembly with proper thermal vias to dissipate the device's 1.5-2 W typical power.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
ドロップイン代替品: EP20K100CB356C7ES — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K100CB356C7ES （同一形状・フットプリント） — 相違点: Process Technology, Package, Speed Grade, Family, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K100CB356C7
✅ ドロップイン✓ 在庫あり
$71 / 個
データシートを見る →EP20K100BC356-1
✅ ドロップイン✓ 在庫あり
$92.75 / 個
データシートを見る →EP20K200CB356C7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K100CB356C8
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$82 / 個
データシートを見る →EP20K100CB356C9
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP20K100CB356C7ES 最大定格＆電気的特性
| Family | APEX20K |
| Logic Elements | 4,160 |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Embedded Memory (RAM bits) | 53,248 |
| User I/O Pins | 252 |
| パッケージ | 356-BGA |
| Speed Grade | C7 |
| Core Voltage | 1.8 V |
| I/O Voltage Compatibility | 2.5 V / 3.3 V |
| Configuration Method | JTAG / Passive Serial |
| Process Technology | SRAM-based CMOS |
| 実装タイプ | Surface Mount (BGA) |
EP20K100CB356C7ES ピン構成
| ピン A1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A2 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A3 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A4 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A5 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A6 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A7 | VCCINT — Core supply 1.8 V |
| ピン A8 | GND — Ground |
| ピン A9 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A10 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A11 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A12 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A13 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A14 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A15 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A16 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン A17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン B1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン B2 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン B17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン C1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン C17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン D1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン D17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン E1 | TCK — JTAG Test Clock |
| ピン E17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン F1 | TMS — JTAG Test Mode Select |
| ピン F17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン G1 | TDI — JTAG Test Data In |
| ピン G17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン H1 | TDO — JTAG Test Data Out |
| ピン H17 | VCCIO — I/O supply 3.3 V / 2.5 V |
| ピン J1 | nCONFIG — Configuration control (active low) |
| ピン J17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン K1 | CONF_DONE — Configuration done status |
| ピン K17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン L1 | nSTATUS — Configuration status (active low) |
| ピン L17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン M1 | DCLK — Configuration clock |
| ピン M17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン N1 | DATA0 — Configuration data input |
| ピン N17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン P1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン P17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン R1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン R17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン T1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン T17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン U1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン U17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン V1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン V17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン W1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン W17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン Y1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン Y17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン AA1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン AA17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン AB1 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン AB17 | I/O — User I/O bank reference (per BGA ball-map) |
| ピン AC1 | I/O — User I/O ball reference (per BGA ball-map) |
主な用途
EP20K100CB356C7ES の用途: 7 件s: Telecommunications Switching Equipment, Video Broadcast and Image Processing, Industrial Motor Control, DSP Co-Processing in Medical Imaging, Broadband Access Equipment, Multi-Channel Data Acquisition Systems, Legacy Embedded Computing Platforms.
Telecommunications Switching Equipment
The EP20K100CB356C7ES's 4,160 logic elements and 252 user I/O pins make it well suited for telecom line-card and switch-fabric designs. Its SRAM-based fabric enables rapid protocol updates for TDM-to-Ethernet bridging or ATM cell processing. The APEX20K family's 53,248 bits of embedded memory serve as on-chip cell buffers, reducing external SRAM requirements. Operating at C7 speed grade, the device meets typical 100 MHz telecom datapath timing. The 356-BGA package provides the high I/O count needed for parallel bus interfaces to TDM framers and PHY devices.
おすすめ
Video Broadcast and Image Processing
The EP20K100CB356C7ES handles real-time video processing tasks such as SDI/HDMI bridging, color-space conversion, and image filtering. Its 4-input LUT architecture and embedded array blocks (EABs) implement multipliers and line buffers efficiently, while 252 I/O pins accommodate parallel video buses. The C7 speed grade supports typical pixel-clock rates up to 100 MHz, suitable for standard-definition and entry-level HD processing. The device's reprogrammability enables late-stage algorithm changes, valuable for evolving broadcast standards.
おすすめ
Industrial Motor Control
In industrial motor-drive systems, the EP20K100CB356C7ES implements field-oriented control (FOC), space-vector PWM, and encoder feedback processing. Its 252 I/O pins connect to multiple ADC channels for current sensing and to gate-driver ICs for inverter control. The SRAM-based fabric allows tuning of control loops per motor variant without hardware changes. The C7 speed grade supports PWM frequencies above 20 kHz, sufficient for silent-drive operation. The 356-BGA package supports surface-mount assembly on industrial controller PCBs.
おすすめ
DSP Co-Processing in Medical Imaging
The EP20K100CB356C7ES serves as a co-processor to a host CPU or DSP in ultrasound and MRI front-end systems, accelerating FFT and convolution operations. Its embedded array blocks implement 18x18 multipliers critical for FIR filters, while the 53,248-bit embedded memory holds coefficient tables. With 4,160 logic elements, the device can run parallel multiplier-accumulator pipelines. The 356-BGA package supports the high I/O count needed for parallel data paths from analog front-end ADCs.
おすすめ
Broadband Access Equipment
In DSLAMs, CMTS, and PON optical line terminals, the EP20K100CB356C7ES handles packet classification, queue management, and traffic shaping. Its 252 I/O pins interface with network processors and SerDes devices, while the reprogrammable logic adapts to evolving QoS algorithms. The C7 speed grade supports typical 100 MHz system bus operation. The APEX20K's SRAM-based configuration enables field upgrades as broadband standards evolve.
おすすめ
Multi-Channel Data Acquisition Systems
The EP20K100CB356C7ES suits multi-channel data-acquisition systems in test and measurement, implementing timing generators, channel synchronizers, and on-the-fly DSP. Its 252 I/O pins accommodate 16+ parallel ADC/DAC channels plus digital trigger lines, while the 4,160 logic elements run FIR filters per channel. The C7 speed grade supports per-channel sample rates up to 100 MSPS in pipelined designs. The 356-BGA package fits standard 6-layer data-acquisition PCBs.
おすすめ
Legacy Embedded Computing Platforms
The EP20K100CB356C7ES supports existing embedded computing platforms - avionics, defense, and industrial controllers - that were designed around the APEX20K family. Maintaining these systems requires the same footprint part; the EP20K100CB356C7ES provides bitstream-compatible replacement for in-service boards. Its 1.8 V core and 3.3 V I/O compatibility match existing power architectures. The 356-BGA footprint preserves the original PCB layout, avoiding costly board respins.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K100CB356C7ES — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K100CB356C7 | EP20K100BC356-1 | EP20K200CB356C7 | EP20K100CB356C8 | EP20K100CB356C9 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 356-BGA | 356-BGA - same | 356-BGA - same | 356-BGA - same | 356-BGA - same | 356-BGA - same |
| Logic Elements | 4,160 | 4,160 | 4,160 | 8,320 | 4,160 | 4,160 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 200,000 | 100,000 | 100,000 |
| Maximum System Gates | 263,000 | 263,000 | 263,000 | 526,000 | 263,000 | 263,000 |
| Speed Grade | C7 | C7 | -1 (industrial) | C7 | C8 (slower) | C9 (slowest) |
| Embedded Memory (RAM bits) | 53,248 | 53,248 | 53,248 | 106,496 | 53,248 | 53,248 |
| User I/O Pins | 252 | 252 | 252 | 252 | 252 | 252 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
主な差別化要因
- Embedded System (ES) variant with verified firmware/configuration support （vs EP20K100CB356C7)
- Higher logic density option in same package footprint （vs EP20K200CB356C7)
- Industrial temperature grade variant in same package （vs EP20K100BC356-1)
設計ノート
Power sequencing is critical for the APEX20K family. The 1.8 V VCCINT core supply must ramp before the VCCIO I/O supply to prevent latch-up. Use a power-management IC with PG (power-good) signal feedback or a discrete MOSFET arrangement to enforce sequencing. Typical inrush current for the 356-BGA package is 1.5-2 A on VCCINT; bulk decoupling requires at least 4x 22 uF tantalum capacitors plus 0.1 uF ceramics per quadrant of the BGA.
Estimated: based on a typical APEX20K design with 60% logic utilization and 100 MHz toggle rate, the 356-BGA package dissipates approximately 1.5-2.0 W. Use a 6-layer PCB with dedicated ground and power planes, and stitch the BGA thermal balls (typically the central array) to the inner ground plane with 0.3 mm thermal vias. At higher utilization (>80%) or ambient temperatures above 70 C, attach a small heatsink or use forced-air cooling to keep junction temperature below 125 C.
BGA assembly for the 356-ball package requires 0.8 mm or 1.0 mm pitch with NSMD (non-solder-mask-defined) pads for reliable solder joint formation. Use ENIG (Electroless Nickel Immersion Gold) surface finish and a 245 C peak reflow profile per JEDEC J-STD-020. Plan escape routing in the top layer with 0.1 mm trace/space for the inner balls; outer rows can route on two layers using micro-via technology. X-ray inspection after reflow is mandatory because BGA joints are hidden under the package.
Do not assume a 3.3 V-only supply is sufficient - the APEX20K requires 1.8 V VCCINT regardless of I/O voltage. Do not forget the MSEL (mode-select) pin settings; wrong configuration mode results in configuration failure and a held nSTATUS low. For passive-serial configuration, ensure the EPC2 or EPC16 configuration PROM is programmed with the correct bitstream and that the DCLK frequency does not exceed 100 MHz. Finally, account for configuration time (~50 ms typical) in system boot sequencing.
コンプライアンス情報
Compliance information for the obsolete EP20K100CB356C7ES was not present in the verified web data; values set to 'unknown' per data authenticity rules. RoHS/REACH compliance for APEX20K-era devices was typically 'not compliant' or 'transition-only', but verify with manufacturer documentation before new production orders.
