EP20K200CB356C7N - APEX 20KC FPGA 200K Gates 356-BGA | Intel / Altera
부품 번호: EP20K200CB356C7N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EP20K200CB356C7N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic, memory blocks, and I/O protocols after manufacturing. The APEX 20KC family extends the original APEX 20K series with MultiCore architecture integrating lookup tables, product-term logic, and embedded system blocks (ESBs) for memory. In the broader taxonomy, FPGAs sit within programmable logic devices -> PLDs -> digital logic ICs -> semiconductors, and are widely used for glue logic, bus bridging, and DSP pre/post-processing where ASIC NRE cost is prohibitive.
Key features include 263 user I/O lines supporting multiple I/O standards, on-chip ESBs configurable as dual-port RAM, ROM, or first-in first-out (FIFO) buffers, 4-phase PLL-based clock management with up to four outputs, JTAG (IEEE 1149.1) boundary-scan test support, and in-system programmability through the Altera Quartus / MAX+PLUS II tool chain. The device supports hot-socketing and PCI compliance, making it suitable for mixed-voltage legacy and modern interface designs.
Typical applications include telecommunications line-card interfaces, industrial control and factory automation, ASIC prototyping, glue logic and bus bridging in embedded computing, and high-speed custom DSP datapaths. The wide I/O count (263 user I/Os) makes it a strong fit for designs requiring extensive parallel connectivity such as video processing front-ends and protocol-conversion bridges.
When designing with this device, ensure I/O bank supply voltages match the connected peripherals and use the Altera Quartus II tool chain (or MAX+PLUS II legacy) for place-and-route. Note that the APEX 20KC family has been NRND/obsolete since approximately 2006-2008; verify long-term availability with the franchised distributor before committing the design to production.
드롭인 대체품: EP20K200CB356C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K200CB356C7N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Package, Family, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K200CB356C7ES
✅ 드롭인✓ 재고 있음
$108.5 / 개
데이터시트 보기 →EP20K200CB356C8
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K200CB356C9
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$69.95 / 개
데이터시트 보기 →EP20K200BC356-1
✅ 드롭인✓ 재고 있음
$335 / 개
데이터시트 보기 →EP20K200BC356-2
✅ 드롭인✓ 재고 있음
$88.25 / 개
데이터시트 보기 →EP20K200BC356-3
✅ 드롭인✓ 재고 있음
$162 / 개
데이터시트 보기 →EP20K100CB356C7
✅ 드롭인✓ 재고 있음
$71 / 개
데이터시트 보기 →EP20K200CB356C7N 최대 정격 & 전기적 특성
| Family | APEX 20KC |
| Series | EP20K200 |
| System Gates | 200,000 |
| Logic Elements / Cells | 8,320 |
| Maximum Operating Frequency | 3571.6 MHz (internal equivalent) |
| Propagation Delay | 1.48 ns |
| User I/Os | 263 |
| Input Terminals | 267 |
| Supply Voltage (Nominal) | 1.8 V |
| Process Technology | 0.15 um CMOS |
| 동작 온도 | 0C to +85C (Commercial) |
| 패키지 | 356-ball PBGA (S-PBGA) |
| 실장 유형 | Surface Mount |
| Embedded Memory | ESBs (dual-port RAM/ROM/FIFO) |
| Clock Management | PLL with up to 4 outputs |
| JTAG Support | Yes (IEEE 1149.1) |
| In-System Programmable | Yes |
| RoHS 상태 | unknown |
EP20K200CB356C7N 356-ball pbga (s-pbga) 핀 구성 가이드
EP20K200CB356C7N(356-ball pbga (s-pbga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K200CB356C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K200CB356C7N 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Interface, ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Glue Logic / Bus Bridging in Embedded Computing, High-Speed Custom DSP Datapath Pre/Post-Processing, Video Processing Front-End Interface.
Telecommunications Line-Card Interface
The EP20K200CB356C7N's 263 user I/Os, 8,320 logic cells, and embedded dual-port RAM blocks (ESBs) make it well-suited for telecom line-card glue logic. The device can implement TDM bus aggregation, framing/deframing, and protocol-conversion state machines between backplane SERDES and framer ICs. With 200K system gates it absorbs multi-channel HDLC controllers and ATM cell-processing datapaths in a single chip. Its PCI-compliant I/O banks support direct connection to PowerPC / MIPS host processors without external transceivers. The 1.8V core plus multi-standard I/O (1.5V/2.5V/3.3V) eases integration with legacy 3.3V line-interface ASICs alongside modern 1.5V switch fabrics.
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ASIC Prototyping and Emulation
With 200K system gates and 8,320 logic cells, the EP20K200CB356C7N serves as a high-capacity ASIC prototype platform. Designers map RTL into the device using Quartus II synthesis, allowing functional verification of complex ASIC designs before mask commitment. The 356-ball PBGA package exposes enough pins for full ASIC boundary emulation including JTAG, scan, and parallel test access. MultiCore architecture (LUT + product-term + ESB memory) accommodates ASIC designs mixing random logic with embedded SRAM/ROM. Engineers use this device to validate ASIC RTL months before silicon availability, reducing respin risk on multi-million-gate ASIC projects.
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Industrial Control and Factory Automation
The EP20K200CB356C7N's wide I/O count (263 user I/Os) interfaces directly to multiple encoder, sensor, and actuator buses in factory automation systems. Its 0C to 85C commercial temperature range suits climate-controlled cabinet installations, while the robust CMOS 0.15um process delivers proven long-term reliability in 24/7 industrial environments. The MultiCore architecture implements deterministic state machines for motion control, while ESB blocks buffer burst sensor streams. JTAG boundary-scan simplifies board-level test on densely-populated PLC backplanes. The PBGA package's thermal performance supports sustained operation in fan-less control cabinets.
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Glue Logic / Bus Bridging in Embedded Computing
The EP20K200CB356C7N excels at bus-bridging glue logic between mismatched processor peripherals (e.g. PCI to local bus, VME to PMC, or custom backplane protocols). Its 200K gates absorb protocol-conversion state machines, FIFOs, and address-decoding logic that would otherwise require multiple discrete CPLDs. The ESB blocks implement deep FIFOs for crossing clock domains between asynchronous buses. Hot-socketing support allows insertion into live backplanes without disturbing existing traffic. Quartus II MegaWizard IP cores accelerate PCI, I2C, and memory-controller instantiation, dramatically shortening development time versus discrete logic.
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High-Speed Custom DSP Datapath Pre/Post-Processing
The EP20K200CB356C7N's 8,320 logic cells, 4-PLL clock management, and 3571.6 MHz internal equivalent frequency support custom DSP datapaths for radar, sonar, and software-defined radio pre/post-processing. Distributed arithmetic FIR filters, FFT butterflies, and CORDIC engines map efficiently into the LUT-rich fabric. Multi-rate sample conversion and decimation/interpolation filters fit within ESB memory blocks. Engineers pair the EP20K200 with dedicated DSP or ADC/DAC chips to offload pre-processing, freeing the host CPU for higher-level tasks. The 263 user I/Os handle wide parallel data buses from external ADC/DAC converters without multiplexing.
추천
Video Processing Front-End Interface
The EP20K200CB356C7N's 263 user I/Os handle wide parallel video buses (e.g. 24-bit RGB, ITU-R BT.656, or Camera Link) directly from image sensors and video decoder ICs. The device implements color-space conversion, frame buffering, de-interlacing, and overlay composition in a single chip, eliminating external ASICs. ESB blocks function as line buffers and double-buffered frame stores, while the high gate density accommodates format-conversion pipelines. The 1.8V core with multi-standard I/O banks interfaces directly to both 3.3V legacy video ADCs and 1.5V modern CMOS sensors. Quartus II Video IP cores accelerate development of common broadcast formats.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K200CB356C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K200CB356C7ES | EP20K200CB356C8 | EP20K200CB356C9 | EP20K200BC356-1 | EP20K100CB356C7 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same | Intel / Altera - same |
| Package | 356-ball PBGA | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same | 356-ball PBGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20K (non-KC) | APEX 20KC |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 100,000 |
| Logic Cells | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 4,640 |
| User I/Os | 263 | 263 | 263 | 263 | 263 | 263 |
| Speed Grade | -7 | -7 | -8 (slower) | -9 (slowest) | -1 (non-KC process) | -7 |
| Process Technology | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.15 um CMOS | 0.18 um CMOS | 0.15 um CMOS |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) | 0C to 85C (Commercial) |
주요 차별점
- Highest speed grade in APEX 20KC 200K family (vs EP20K200CB356C9)
- APEX 20KC silicon (0.15um) is faster than APEX 20K (0.18um) (vs EP20K200BC356-1)
- Highest gate count in the 356-ball BGA pin-compatible family (vs EP20K100CB356C7)
설계 노트
Estimated migration risk: The APEX 20KC family is obsolete (EOL approximately 2006-2008). New designs should NOT select this part - migrate to Cyclone III EP3C40/EP3C80 (different BGA package, requires PCB redesign) or Cyclone IV. For existing designs, plan for last-time-buy and inventory buffer. Verify RoHS status with the manufacturer before placing Pb-free assembly orders because legacy APEX 20KC parts may have non-RoHS finishes.
Estimated: At maximum toggle activity on 263 I/Os with 1.8V core, total power can reach 1.5-2.5W. The 356-ball PBGA has theta_JA of approximately 15-20 C/W with proper PCB thermal vias, so junction temperature rise is roughly 25-50C above ambient. Decouple VCCINT (1.8V core) with 0.1uF + 10uF ceramic caps per Altera AN 114 (APEX 20K design guidelines). VCCIO banks (1.5V/2.5V/3.3V) require separate decoupling; mixing standards on a single bank is not allowed.
Use a minimum 4-layer PCB with continuous power planes under the BGA. Place 0.1uF decoupling caps on the bottom side directly beneath each VCC/VCCIO ball pair. The 356-ball PBGA uses 1.27 mm ball pitch - escape routing requires either microvia (laser-drilled) or dogbone fanout on 8 mil traces. Match clock trace lengths within 50 mil for differential clocks. Keep JTAG pins (TCK/TMS/TDO/TDI) away from switching signals to avoid programming failures.
APEX 20KC I/O banks support LVTTL, LVCMOS, PCI, SSTL, and GTL+ at speeds up to 250 MHz. For DDR memory interfaces, use SSTL_2 Class-II I/O with external VTT termination. Place series damping resistors (22-33 ohm) on high-edge-rate outputs driving backplane traces >2 inches. For 100 MHz+ clocks, use the PLL output pins directly rather than routing through general-purpose I/O. Reference Altera AN 224 (High-Speed Board Design) for controlled-impedance stackup guidance.
규정 준수 정보
Family is obsolete (EOL circa 2006-2008). RoHS / REACH status not confirmed in provided data; legacy parts may have SnPb finish. Use EP20K200CB356C7ES suffix variant for lead-free if compliance is required, but verify with distributor datasheet.
