EP20K200EFC672-2X - 200K Gates APEX 20KE FPGA, 672-FBGA | Intel
部品番号: EP20K200EFC672-2X ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $139.75 | $69,875.00 |
| 1,000 | $128.4 | $128,400.00 |
EP20K200EFC672-2X 概要
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that the designer configures after manufacture. The APEX 20KE family sits within Intel's programmable-logic portfolio as a high-density, embedded-memory-rich family, hierarchically classified as FPGA -> programmable logic -> logic IC -> integrated circuit. The 'KE' suffix denotes enhanced on-chip memory and improved I/O support versus the original APEX 20K, while the embedded ESB (Embedded System Block) array allows each block to be configured as RAM, ROM, CAM, or multiplier.
Key features of the EP20K200EFC672-2X include 8,320 logic cells, 832 macrocells, 376 maximum user I/Os, and 106,496 typical gates (200,000 maximum system gates). The device operates at a maximum internal frequency of 205 MHz and supports LVTTL, LVCMOS, PCI, SSTL, and GTL+ I/O standards. The 672-pin FineLine BGA package enables high signal-count designs in a compact footprint, suitable for backplane interfaces and high-speed parallel buses.
The architecture combines four-input LUTs for combinational logic, dedicated carry chains for arithmetic, and a row/column interconnect optimized for data-path and memory-intensive designs. Four phase-locked loops (PLLs) provide clock multiplication and deskew, while the 1.8 V core reduces dynamic power relative to the 2.5 V APEX 20K predecessors. The device supports in-system programmability via JTAG and passive serial configuration, simplifying board-level bring-up.
Typical applications include custom telecommunications backplane glue logic, PCI/PCI-X bus bridges, RAID controller datapaths, and legacy ASIC prototyping. The device also fits industrial control and imaging pipelines where parallel processing and embedded memory are required. Engineering teams evaluating long-life-cycle designs should note that the APEX 20KE family is no longer in active production and is supported primarily through authorized-stock distributors.
When designing with the EP20K200EFC672-2X, ensure the Quartus design software version supports the APEX 20KE device family, as newer Quartus releases dropped legacy device support. Validate signal-integrity margins on the 672-ball FBGA fanout with BGA breakout routing rules, and confirm decoupling follows the manufacturer's reference-board power-distribution network guidelines.
This page synthesizes distributor availability, parametric alternatives, and practical design notes not consolidated in the manufacturer datasheet, with values current as of 2026-09-07.
ドロップイン代替品: EP20K200EFC672-2X — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K200EFC672-2X （同一形状・フットプリント） — 相違点: Family, Operating Temperature, Process Technology, Propagation Delay.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K200EFC672-3
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200EFC672-2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200EFC672-1N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200EFC672-1
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K200EFC672-2X 最大定格＆電気的特性
| Family | APEX 20KE |
| Maximum System Gates | 200,000 |
| Typical Gates | 106,496 |
| Logic Elements | 8,320 |
| Macrocells | 832 |
| Maximum User I/Os | 376 |
| パッケージ | 672-ball FineLine BGA (FBGA) |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Maximum Internal Frequency | 205 MHz |
| Propagation Delay | 2.5 ns |
| 動作温度 | 0 °C to 85 °C (commercial) |
| 実装タイプ | Surface Mount |
| PLLs | 4 |
| Embedded Memory Blocks | ESB (RAM/ROM/CAM/multiplier) |
| Configuration Interface | JTAG, Passive Serial |
EP20K200EFC672-2X 672-ball fineline bga (fbga) ピン配置ガイド
EP20K200EFC672-2X (672-ball fineline bga (fbga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP20K200EFC672-2X.
詳細は データシート をご参照ください。
主な用途
EP20K200EFC672-2X の用途: 6 件s: Telecommunications Backplane Glue Logic, PCI / PCI-X Bus Bridge, RAID Storage Controller Datapath, Industrial Control and Imaging Pipeline, Legacy ASIC Prototyping, Custom Datapath Acceleration.
Telecommunications Backplane Glue Logic
The EP20K200EFC672-2X's 376 user I/Os and 8,320 logic elements make it well-suited for backplane glue-logic bridging in telecom equipment. Its 672-FBGA package provides ample signal pins to bridge multiple bus standards including LVTTL, LVCMOS, and GTL+. The four PLLs handle clock domain translation between backplane segments, while 832 macrocells implement custom protocol converters. Designers benefit from the 1.8 V core's reduced power dissipation across hundreds of active I/Os, and the 205 MHz internal frequency covers most telecom line-card control planes. Quartus II design entry allows VHDL/Verilog integration with simulation libraries for SONET/SDH framing and ATM cell processing.
おすすめ
PCI / PCI-X Bus Bridge
The 672-FBGA package exposes enough I/Os to implement a 64-bit PCI-X bridge at 133 MHz, while the embedded system blocks (ESBs) provide FIFO buffers for transaction queuing. The 8,320 logic elements are sufficient to implement bus arbitration, address decoding, and interrupt steering. The 1.8 V core reduces switching noise critical to PCI-X signal integrity, and the device's PCI-compliant I/O standard supports 3.3 V signaling without external level shifters. Engineering teams should verify PCI timing constraints in Quartus II TimeQuest and use the dedicated PCI IP cores available for the APEX 20KE family.
おすすめ
RAID Storage Controller Datapath
RAID controllers benefit from the EP20K200EFC672-2X's 832 macrocells to implement XOR datapaths, parity generators, and disk-state machines across multiple drive channels. The ESBs configured as dual-port RAM store stripe cache and command queues, while the 376 I/Os parallel-drive four or more Ultra320 SCSI / SATA channels. The 205 MHz fmax supports sustained 320 MB/s per channel when pipelined correctly. JTAG-based in-system programmability simplifies firmware updates in deployed arrays, and the device's commercial temperature range (0-85 °C) matches typical RAID enclosure ambient conditions.
おすすめ
Industrial Control and Imaging Pipeline
Machine-vision and industrial-imaging systems leverage the EP20K200EFC672-2X for real-time pixel processing, line-scan buffering, and trigger synchronization. The ESB blocks configured as CAM (Content-Addressable Memory) accelerate pattern matching in defect-detection pipelines, while the 8,320 logic elements implement Bayer demosaicing and color-space conversion in parallel. The 376 I/Os accept multiple Camera Link channels and drive frame grabbers, and the four PLLs derive pixel clocks from encoder inputs. The 0-85 °C commercial temperature range covers factory-floor enclosures; for harsher environments consider APEX 20KE industrial-grade variants.
おすすめ
Legacy ASIC Prototyping
Designers prototyping legacy ASICs use the EP20K200EFC672-2X as a hardware-emulation vehicle before committing to mask sets. The 200K-gate capacity and 8,320 logic elements map large RTL blocks with reasonable utilization, while the 832 macrocells handle state-heavy control logic. Quartus II synthesis preserves RTL hierarchy for ASIC handoff, and the 672-FBGA package exposes I/Os suitable for daughter-card test fixtures. Engineering teams should budget two-to-three silicon iterations when mapping gate-for-gate due to FPGA LUT overhead; use the APEX 20KE for proof-of-concept only, not for production silicon replacement.
おすすめ
Custom Datapath Acceleration
High-performance datapath designs use the EP20K200EFC672-2X to offload CPU-intensive operations such as CRC calculation, encryption, or DSP filtering. The embedded multiplier blocks in the ESB array implement 9-bit signed multiplications at full 205 MHz, while the carry chains accelerate adders and accumulators. The 832 macrocells and 376 I/Os handle wide datapath fan-in/fan-out, and the four PLLs synchronize external memory interfaces (DDR, QDR). Typical applications include network packet inspection engines, medical-imaging pre-processors, and radar baseband pre-processors where fixed-function ASICs are not yet justified.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K200EFC672-2X — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K200EFC672-3 | EP20K200EFC672-2 | EP20K200EFC672-1N | EP20K200EFC672-1 | EP20K200EFC484-2X |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-672 (FineLine BGA) | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-672 - same | FBGA-484 - smaller, NOT same footprint |
| Maximum System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Macrocells | 832 | 832 | 832 | 832 | 832 | 832 |
| Maximum User I/Os | 376 | 376 | 376 | 376 | 376 | ~300 (fewer due to smaller package) |
| Speed Grade | -2 (with X = lead-free RoHS) | -3 (faster) | -2 (non-RoHS) | -1N (slower) | -1 (slower) | -2X |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Higher logic density than smaller APEX 20KE parts （vs EP20K100EFC324-2X)
- More user I/Os than equivalent-density BGA-484 variant （vs EP20K200EFC484-2X)
- Lead-free RoHS-compliant variant （vs EP20K200EFC672-2)
設計ノート
The EP20K200EFC672-2X in the 672-FBGA package dissipates approximately 1.5 to 3 W typical at full utilization with 205 MHz switching on 50% of logic elements. The 672-FBGA package has a theta_JA of approximately 12 °C/W with adequate PCB thermal vias under the BGA pad array. Estimated: assuming 2 W dissipation and theta_JA = 12 °C/W with 4-layer FR4 board, junction temperature rises 24 °C above ambient - well within the 85 °C commercial limit. Add thermal vias on all internal BGA power/ground pads to reduce theta_JA and improve long-term reliability.
The 672-ball FineLine BGA requires BGA fanout routing with 0.8 mm pitch and microvia or via-in-pad technology for escape. Per the Altera APEX 20KE hardware reference, place at least 8 decoupling capacitors (0.1 µF + 10 µF) within 5 mm of the package perimeter, plus bulk capacitance on each VCCIO bank. Use 4-layer stackup with continuous ground plane beneath the BGA to control return-path inductance. Series resistors on clock I/Os dampen reflections at high edge rates.
Three common pitfalls with APEX 20KE designs: (1) Using Quartus versions newer than 13.0sp1 will silently fail to compile - check tool version before starting. (2) The 'X' suffix in the part number denotes lead-free (RoHS) packaging - omitting it gets a non-RoHS part. (3) The I/O banks are NOT independent voltage domains across all banks; consult the pin-out file before mixing SSTL and LVTTL in adjacent banks. Always validate the JTAG chain with the Altera ByteBlaster or USB-Blaster before committing to board spin.
Assign PLL clock outputs to dedicated PLL clock pin pairs (CLK0p/n through CLK3p/n) and route differential pairs with 100 Ω differential impedance and length-matched within 150 mils. Per the APEX 20KE datasheet, global clock networks feed 4 dedicated clock trees - use them for high-fanout nets and avoid placing registers on local routing for clock signals exceeding 100 MHz. Configuration pins (nCONFIG, nSTATUS, CONF_DONE) require external 10 kΩ pull-ups to VCCIO of the configuration bank.
コンプライアンス情報
RoHS compliance inferred from the 'X' suffix in the part number, which per Altera/Intel naming convention denotes lead-free packaging. REACH, halogen-free, and conflict-mineral status not explicitly stated in available data - set to unknown. AEC-Q100 is not applicable for FPGAs of this class; industrial/automotive grades use different part numbers.