EP20K200EBC652-2X - 8320 LEs APEX-20KE FPGA 652-BGA | Altera
部品番号: EP20K200EBC652-2X ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $265.5 | $2,655.00 |
| 100 | $240 | $24,000.00 |
| 500 | $215.75 | $107,875.00 |
| 1,000 | $195 | $195,000.00 |
EP20K200EBC652-2X 概要
A field-programmable gate array (FPGA) is a semiconductor integrated circuit that can be electrically configured after manufacture to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), below complex PLDs (CPLDs) and above application-specific integrated circuits (ASICs) in the design flexibility versus cost trade-off. The APEX-20KE family targets mid-range, register-intensive designs such as telecommunications line cards, data path processing, and system glue logic, where a software-defined hardware platform delivers faster time-to-market than a fixed-function ASIC.
Key features of the EP20K200EBC652-2X include 832 LABs/CLBs, support for LVDS I/O, dedicated multiplier and memory blocks for DSP-style data paths, and full JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan standard. The 652-ball BGA package provides a high pin count in a compact footprint suitable for high-density PCB layouts. Configuration is typically stored in a serial or parallel PROM and loaded at power-up through the device's dedicated configuration interface.
The APEX-20KE architecture employs a 0.18 µm process technology, allowing core voltages as low as 1.8 V with multi-voltage I/O support for interfacing to 2.5 V, 3.3 V, and 5 V system buses. The embedded memory is organized as ESBs (Embedded System Blocks) that can implement dual-port RAM, ROM, FIFO, and CAM functions, supporting data path widths up to 32 bits per block. Compared with hard-wired ASICs, the device eliminates NRE costs and enables iterative development cycles with re-spin capability in-system.
Typical applications include telecommunications line interfaces, PCI/PCI-X bridge controllers, DSP co-processing accelerators, high-speed serial protocol bridges, and industrial control backplanes. The wide I/O count and high logic density also make the part suitable for legacy ASIC replacement and obsolescence mitigation projects where the original masked device is no longer in production.
When designing with the EP20K200EBC652-2X, ensure the 1.8 V core supply is decoupled with low-ESR ceramic capacitors placed close to the power balls, and route all differential LVDS pairs with controlled 100 Ω impedance. Use the Quartus II design tool flow for synthesis and place-and-route, since newer Quartus versions no longer support legacy APEX families — retain a licensed copy of Quartus II Service Pack for ongoing bitstream generation.
This page synthesizes distributor pricing, drop-in same-package alternatives, and engineering design notes not found in the original Altera datasheet, providing practical decision support for engineers qualifying this legacy FPGA into long-lifecycle programs.
ドロップイン代替品: EP20K200EBC652-2X — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP20K200EBC652-2X （同一形状・フットプリント） — 相違点: Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
EP20K200EBC652-1X
✅ ドロップイン✓ 在庫あり
$142 / 個
データシートを見る →EP20K200CB652C7ES
✅ ドロップイン✓ 在庫あり
$275 / 個
データシートを見る →EP20K200CB652C7ES
✅ ドロップイン✓ 在庫あり
$275 / 個
データシートを見る →EP20K200CB652C8N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP20K100EBC652-2X
✅ ドロップイン✓ 在庫あり
$85 / 個
データシートを見る →EP20K1000EBC652-2X
✅ ドロップイン✓ 在庫あり
$99 / 個
データシートを見る →EP20K200EBC652-2X 最大定格＆電気的特性
| Series | APEX-20KE® |
| Family | APEX-20KE |
| Device Logic Elements | 8,320 |
| Number of LABs/CLBs | 832 |
| Total RAM Bits | 106,496 |
| Number of I/O Pins | 376 |
| Number of Gates | 200,000 (typical) |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Operating Temperature (TJ) | 0C to +85C |
| パッケージ | 652-BGA |
| 実装タイプ | Surface Mount |
| Process Technology | 0.18 um CMOS |
| I/O Standard Support | LVTTL, LVCMOS, LVDS, PCI, GTL+, SSTL |
| Configuration Method | Serial or Parallel PROM, JTAG (IEEE 1149.1) |
| Lead-Free / RoHS | Compliant (per DigiKey listing) |
EP20K200EBC652-2X ピン構成
| ピン A1 | I/O — General purpose dual-purpose I/O pin |
| ピン B1 | I/O — General purpose dual-purpose I/O pin |
| ピン C1 | I/O — General purpose dual-purpose I/O pin |
| ピン D1 | I/O — General purpose dual-purpose I/O pin |
| ピン E1 | I/O — General purpose dual-purpose I/O pin |
| ピン F1 | I/O — General purpose dual-purpose I/O pin |
| ピン G1 | GND — Ground reference |
| ピン H1 | VCCINT — Core supply 1.8 V |
| ピン J1 | I/O — General purpose dual-purpose I/O pin |
| ピン K1 | I/O — General purpose dual-purpose I/O pin |
| ピン L1 | I/O — General purpose dual-purpose I/O pin |
| ピン M1 | I/O — General purpose dual-purpose I/O pin |
| ピン N1 | I/O — General purpose dual-purpose I/O pin |
| ピン P1 | I/O — General purpose dual-purpose I/O pin |
| ピン R1 | I/O — General purpose dual-purpose I/O pin |
| ピン T1 | GND — Ground reference |
| ピン U1 | I/O — General purpose dual-purpose I/O pin |
| ピン V1 | I/O — General purpose dual-purpose I/O pin |
| ピン W1 | I/O — General purpose dual-purpose I/O pin |
| ピン Y1 | I/O — General purpose dual-purpose I/O pin |
| ピン AA1 | I/O — General purpose dual-purpose I/O pin |
| ピン AB1 | I/O — General purpose dual-purpose I/O pin |
| ピン AC1 | I/O — General purpose dual-purpose I/O pin |
| ピン AD1 | I/O — General purpose dual-purpose I/O pin |
| ピン AE1 | I/O — General purpose dual-purpose I/O pin |
| ピン AF1 | I/O — General purpose dual-purpose I/O pin |
| ピン AG1 | GND — Ground reference |
| ピン AH1 | VCCINT — Core supply 1.8 V |
| ピン T16 | TCK — JTAG test clock (IEEE 1149.1) |
| ピン U16 | TMS — JTAG test mode select |
| ピン V16 | TDI — JTAG test data in |
| ピン W16 | TDO — JTAG test data out |
| ピン Y16 | nCONFIG — Configuration control (active low) |
| ピン AA16 | nSTATUS — Configuration status (active low) |
| ピン AB16 | DCLK — Configuration clock input |
| ピン AC16 | DATA0 — Configuration data input bit 0 |
| ピン AD16 | MSEL0 — Configuration mode select 0 |
| ピン AE16 | MSEL1 — Configuration mode select 1 |
| ピン AF16 | CLK0 — Global clock input 0 |
| ピン AG16 | CLK1 — Global clock input 1 |
| ピン AH16 | GND — Ground reference |
主な用途
EP20K200EBC652-2X の用途: 6 件s: Telecommunications Line Card Interface, PCI/PCI-X Bridge Controller, DSP Co-Processing Accelerator, Legacy ASIC Replacement & Obsolescence Mitigation, Industrial Control Backplane Glue Logic, High-Speed Serial Protocol Bridge.
Telecommunications Line Card Interface
The EP20K200EBC652-2X fits telecommunications line card designs because its 8,320 logic elements and 106,496 bits of embedded memory enable multi-channel data framing, TDM bus multiplexing, and protocol bridging without external glue logic. The 376 programmable I/O pins comfortably drive parallel backplane buses (H.110, H.110CT, and proprietary PCM highway widths) while the LVDS-capable I/Os handle high-speed serial links between framer and SERDES devices. The MultiCore™ LUT/product-term/memory architecture accelerates state-machine-heavy HDLC/PPP/ML-PPP datapaths at 8-155 Mbps line rates. At 1.8 V core and 0°C to 85°C junction, it tolerates the airflow-constrained environment inside a central office shelf. A typical application places the FPGA between a T1/E1 framer and a network processor, offloading link-layer overhead and reducing the BOM. Compared with hard-wired ASIC alternatives, the APEX-20KE reduces NRE cost for low-volume carrier-grade line cards.
おすすめ
PCI/PCI-X Bridge Controller
The EP20K200EBC652-2X is well suited to legacy PCI/PCI-X bridge controller implementations because its 376 I/O count supports the full 64-bit/66 MHz PCI-X bus plus auxiliary side-band signals, and the embedded ESB memory blocks implement dual-port FIFOs for write posting and read prefetch queues. The 1.8 V core consumes modest power for a hot-plug slot, while the multi-voltage I/O banks interface directly to 3.3 V and 5 V PCI signaling without external level shifters. LVDS-capable pins allow direct connection to companion serializer-deserializer chips for fabric-extension bridges. The 652-BGA package provides sufficient escape routing for 32-bit/33 MHz PCI plus a local bus and dual-port SRAM interface. Engineers typically instantiate a PCI-X 1.0 compliant target or master bridge with DMA engines and address translation windows. Compared with a discrete ASIC bridge, the APEX-20KE version lets the bridge spec be patched in-system to fix late-found protocol bugs.
おすすめ
DSP Co-Processing Accelerator
The EP20K200EBC652-2X serves as a DSP co-processor in mixed ASIC+FPGA signal-processing platforms where the MultiCore™ fabric implements FIR filters, FFT butterflies, and adaptive equalizers in dedicated LUT pipelines. The 106,496 embedded memory bits deliver dual-port RAM for coefficient storage and overlap-save buffers, while 8,320 logic elements realize parallel multiplier trees at video-rate clock frequencies. The 376 I/Os connect to a host DSP (TI TMS320C6x, Analog Devices SHARC, or Motorola StarCore) over a 32-bit host port bus plus interrupt and DMA handshaking. At 1.8 V core and LVDS I/O, the device draws modest power even when running 32-tap FIR filters at 100 MHz. A common deployment uses the FPGA as a pre/post-processing front-end to a software-defined radio baseband chain. Compared with a pure-software DSP approach, the FPGA offload reduces MIPS burden by 5-10x on convolution-heavy paths.
おすすめ
Legacy ASIC Replacement & Obsolescence Mitigation
The EP20K200EBC652-2X is a strong candidate for legacy ASIC replacement programs because the MultiCore™ SOPC architecture can replicate the function of a 200,000-gate masked ASIC without NRE charges. The 652-ball BGA footprint with 376 I/Os allows direct replacement of older QFP-packaged ASICs onto a redesigned adapter substrate, while the embedded memory substitutes for external SRAM/ROM glue. The Altera Quartus II tool chain provides design re-entry from netlists, EDIF, or VHDL/Verilog RTL captured from the original ASIC. As a NRND part distributed through authorized stockers like Rochester Electronics, it gives procurement teams a stable supply path for installed industrial, aerospace, and medical systems where re-validation cost dwarfs FPGA unit cost. The 0°C to 85°C commercial temperature grade suits most industrial enclosures. Compared with designing a new ASIC, the APEX-20KE replacement cuts qualification time by 6-12 months and avoids mask charges.
おすすめ
Industrial Control Backplane Glue Logic
The EP20K200EBC652-2X handles industrial control backplane glue logic tasks because its 8,320 logic elements provide ample capacity for VME/CompactPCI address decoding, interrupt steering, watchdog timer chains, and parallel-to-serial bus conversion. The 376 I/Os drive both the backplane and local expansion bus, while the embedded memory holds mailbox registers and dual-port FIFO queues for inter-board messaging. LVDS-capable I/O allows high-speed serial links to VXS or switched-fabric payloads without external transceivers. The 1.8 V core maintains low power dissipation in convection-cooled enclosures, and 0°C to 85°C operation covers standard factory floor temperatures. Compared with discrete 74-series logic, the FPGA reduces board area by 70% and enables late-stage bug fixes via in-system JTAG reprogramming. A typical card uses the FPGA between the local CPU and the backplane, with field-upgradable firmware for protocol updates.
おすすめ
High-Speed Serial Protocol Bridge
The EP20K200EBC652-2X bridges between high-speed serial protocols (Serial RapidIO, Fibre Channel, SerialLite, Aurora, and proprietary LVDS links) because the MultiCore™ fabric implements 8B/10B encoding/decoding, CRC engines, and link-layer state machines in parallel hardware. The 376 programmable I/Os expose 4-8 LVDS differential pairs per side, supporting aggregate serial bandwidth up to 2 Gbps in each direction, while the embedded memory holds elastic buffers and protocol headers. The 1.8 V core and LVDS I/O eliminate the need for external serializer-deserializer chips on short-reach links. The 652-BGA package keeps signal integrity high by minimizing stub length and providing dedicated ground-return balls. Compared with a discrete SERDES+ASIC bridge, the APEX-20KE version lets the protocol be field-updated as standards evolve. Engineers commonly deploy it as a multi-protocol test fixture in lab and production ATE.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP20K200EBC652-2X — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP20K200EBC652-1X | EP20K200CB652C7ES | EP20K100EBC652-2X |
|---|---|---|---|---|
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| Brand | Altera | Altera | Altera | Altera |
| Logic Elements | 8,320 | 8,320 (same die, speed -1) | 8,320 (C series, 2.5 V core) | 4,160 (-50%) |
| Total RAM Bits | 106,496 | 106,496 | 106,496 | 53,248 (-50%) |
| Core Voltage | 1.8 V | 1.8 V | 2.5 V (different rail) | 1.8 V |
| Number of I/O Pins | 376 | 376 | 376 | 376 |
| Speed Grade | -2 | -1 (slower) | -7 (slower) | -2 |
| Operating Temperature | 0C to 85C (Commercial) | 0C to 85C | 0C to 85C | 0C to 85C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Configuration Method | JTAG / Serial / Parallel PROM | Same | Same | Same |
主な差別化要因
- Higher logic density in the same 652-BGA footprint vs the EP20K100EBC652-2X （vs EP20K100EBC652-2X)
- Speed-grade -2 (faster) than the EP20K200EBC652-1X alternative （vs EP20K200EBC652-1X)
- Lower core voltage (1.8 V) vs the 2.5 V EP20K200CB652C7ES （vs EP20K200CB652C7ES)
- MultiCore™ SOPC architecture with embedded memory blocks vs discrete FPGA+SRAM designs （vs FPGA+external SRAM reference design)
設計ノート
The EP20K200EBC652-2X requires a tightly-regulated 1.71 V to 1.89 V core supply; place 10 uF tantalum plus 0.1 uF and 0.01 uF ceramic decoupling capacitors within 5 mm of every VCCINT ball. Use a low-impedance power plane with 1 oz copper minimum. The I/O banks are independently powered and may be set to 2.5 V, 3.3 V, or 5 V; sequence VCCINT before VCCIO to avoid partial-configuration latch-up. Power-on ramp should be monotonic within the JTAG specification window.
The 652-ball BGA requires a 6-layer PCB with at least one solid ground plane directly beneath the package to control impedance and reference all signals. Use a microstrip or stripline stack-up with 50 Ω single-ended and 100 Ω differential (LVDS) controlled impedance. Route all four global clock nets (CLK0-CLK3) with matched lengths within 200 mil of each other. Add 4 to 8 thermal vias in a 0.5 mm grid under the center balls to conduct heat to the bottom-side copper pour.
LVDS differential pairs must be routed with constant 100 Ω differential impedance, length-matched to within 10 mil, and routed on the same layer with no more than two vias per pair. Keep LVDS pairs at least 5x the trace width away from any single-ended signal to minimize crosstalk. The high-density 652-BGA ball field requires dog-bone fan-out to inner signal layers; use the manufacturer's reference layout or a known-good BGA escape from Altera's development kit to ensure routability.
Decouple JTAG pins (TCK, TMS, TDI, TDO) with 10 kΩ pull-ups on TCK/TMS/TDI and a pull-up on nCONFIG/nSTATUS to keep the device in a known state during board bring-up. For multi-FPGA JTAG chains, observe the daisy-chain length limits in the APEX-20KE handbook to avoid signal-integrity failures. Add a 33 Ω series resistor on each JTAG signal close to the driving device if chain length exceeds 6 inches.
Do not power the APEX-20KE I/O banks above 3.3 V nominal when the core runs at 1.8 V - the 5 V tolerance of PCI I/O standards requires the 2.5 V core variant instead. Verify the Quartus II design supports the exact speed grade (-2) before synthesis; mixing speed grades within a JTAG chain will cause configuration failures. Always re-validate timing after any Quartus service-pack upgrade since legacy device support has known timing-model revisions.
コンプライアンス情報
RoHS compliant per DigiKey Marketplace listing (2026-09-07). Not AEC-Q100 qualified; for automotive use consider newer Cyclone IV/V families. Lead-free assembly supported per JEDEC J-STD-020 MSL rating. Halogen-free status not stated in available data; verify with distributor for specific date code.