EP2A25F672C8N - APEX II 900K Gates 333MHz FPGA | Altera/Intel
部品番号: EP2A25F672C8N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 250 | $225 | $56,250.00 |
| 500 | $205 | $102,500.00 |
EP2A25F672C8N 概要
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, I/O elements, and routing resources that the designer programs after manufacture using a hardware description language (HDL) or schematic entry. FPGAs occupy the middle ground between fixed-function ASICs and discrete glue logic, providing high integration, parallel processing, and rapid design iteration. The APEX II family in particular belongs to Altera's high-end, pre-Cyclone/Stratix era of multi-gigabit serial-interface capable PLDs, suitable for high-speed telecommunications, video, and DSP backplane designs.
Key features of the EP2A25F672C8N include 492 user I/Os for high pin-count designs, embedded system blocks (ESBs) for memory and CAM implementation, multi-gigabit transceivers (up to 1 Gbps per channel) for high-speed serial I/O, LVDS and HSTL I/O support, and a 1.5 V core supply with on-chip PLL clock management. The PLLs deliver low-jitter clock multiplication and skew control for multi-channel synchronous designs.
Architecturally, the APEX II device combines a hierarchical routing fabric with embedded array blocks (EABs) that double as RAM, ROM, or content-addressable memory (CAM). The 0.15-micrometer copper process enables higher logic density and lower power than the 0.18-micrometer process used in the original APEX family, while the dedicated high-speed serial interfaces make the part attractive for 1 Gbps backplanes, optical transport, and parallel DSP pipelines.
Typical applications include 1 Gbps networking line cards, optical transport and SONET/SDH framer ICs, multi-channel DSP coprocessors for wireless base stations, broadcast video processing engines, and high-speed test and measurement instrumentation. Designers choose the EP2A25F672C8N when they need a mature, second-sourced Altera architecture with abundant logic capacity and multi-gigabit I/O.
When designing with this part, engineers should verify Quartus II tool support for the APEX II device family and confirm long-term supply continuity, because APEX II has been classified as a mature device by Intel. For new designs, current-generation Cyclone or Stratix devices are typically recommended. Ensure PCB layout follows FineLine BGA escape rules with microvia or via-in-pad technology to fan out the 672-ball array.
ドロップイン代替品: EP2A25F672C8N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2A25F672C8N （同一形状・フットプリント） — 相違点: Operating Temperature, Package, Process Technology, Embedded Memory, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
EP2A25F672C7N
✅ ドロップイン✓ 在庫あり
$195 / 個
データシートを見る →EP2A25F672C7
✅ ドロップイン✓ 在庫あり
$118 / 個
データシートを見る →EP2A25F672C8
✅ ドロップイン✓ 在庫あり
$951.18 / 個
データシートを見る →EP2A15F672C8N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EP2A15F672C9N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$155 / 個
データシートを見る →EP2A15F672C7N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$171 / 個
データシートを見る →EP2A25F672C8N 最大定格＆電気的特性
| Family | APEX II |
| Technology Node | 0.15 um all-layer copper process |
| System Gates | 900,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Internal Frequency | 333 MHz |
| Propagation Delay | 1.69 ns |
| User I/Os | 492 |
| パッケージ | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C8 |
| 動作温度 | 0 C to 85 C (commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel |
| 実装タイプ | Surface Mount |
| RoHS ステータス | Compliant |
| Lead-Free Suffix | N (lead-free, Pb-free finish) |
EP2A25F672C8N 27 x 27 mm ピン配置ガイド
EP2A25F672C8N (27 x 27 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2A25F672C8N.
詳細は データシート をご参照ください。
主な用途
EP2A25F672C8N の用途: 7 件s: 1 Gbps Optical Transport Line Card, SONET/SDH Framer and Mapper ASIC Replacement, Multi-Channel Wireless Base Station DSP Coprocessor, Broadcast Video Processing Engine, High-Speed Test and Measurement Instrumentation, High-Speed Industrial Imaging Pipeline, Aerospace and Defense Avionics Databus Interface.
1 Gbps Optical Transport Line Card
The EP2A25F672C8N's 1 Gbps multi-gigabit transceivers and 492 user I/Os make it a strong fit for 1 Gbps optical transport line cards. Per the APEX II datasheet, the device supports LVDS and HSTL I/O standards required by SFP/SFP+ module interfaces, while its 24,320 logic elements implement framer, mapper, and forward-error-correction functions in a single chip. The 672-ball FC-FBGA package provides the routing density needed for high-speed serial and parallel interfaces on the same PCB.
おすすめ
SONET/SDH Framer and Mapper ASIC Replacement
Telecom OEMs replaced custom SONET/SDH ASICs with the EP2A25F672C8N to shorten design cycles and reduce NRE cost. The device's 900K system gates implement STS-1/STM-0 to STS-192/STM-64 framer logic, while 492 user I/Os connect to backplane SERDES chips. Per the Altera APEX II datasheet, embedded system blocks (ESBs) implement pointer-processing tables and overhead-byte insertion without external memory, and the 1.5 V core keeps power within NEBS thermal envelopes.
おすすめ
Multi-Channel Wireless Base Station DSP Coprocessor
The EP2A25F672C8N is used as a multi-channel DSP coprocessor in 2G/3G wireless base stations, where it performs channelization, pulse shaping, and crest-factor reduction alongside dedicated DSP ASICs. Its 24,320 logic elements and embedded multipliers handle 8 to 16 parallel DSP channels at baseband sample rates. Per the APEX II datasheet, the on-chip PLLs provide low-jitter clock generation for radio card synchronization, and the commercial 0 to 85 C range meets indoor base-station thermal specs.
おすすめ
Broadcast Video Processing Engine
Broadcast video routers and format converters employ the EP2A25F672C8N for real-time SDI/HD-SDI processing, color-space conversion, and frame-rate adaptation. The device's 492 user I/Os accommodate multiple SDI streams and DVI/HDMI bridges, while 24,320 logic elements implement scaling and deinterlacing filters. Per the APEX II datasheet, LVDS I/O at 622 Mbps handles SMPTE 259M and 292M serial video, and the 1 Gbps multi-gigabit transceiver supports 3G-SDI for HD broadcast studios.
おすすめ
High-Speed Test and Measurement Instrumentation
Logic analyzers, protocol testers, and bit-error-rate testers use the EP2A25F672C8N to capture and pattern-generate multi-gigabit signals. Its 1 Gbps multi-gigabit transceivers handle protocols like PCI Express Gen 1, Serial RapidIO, and 1 GbE, while the 24,320 logic elements implement protocol-aware state machines. Per the APEX II datasheet, the on-chip ESBs build deep capture buffers without external SRAM, and the 672-ball BGA exposes sufficient pins for parallel logic-analyzer probe heads.
おすすめ
High-Speed Industrial Imaging Pipeline
Machine-vision and semiconductor inspection systems use the EP2A25F672C8N for real-time image acquisition and processing. The 492 user I/Os interface to Camera Link or CoaXPress frame grabbers, while 24,320 logic elements perform Bayer demosaicing, color correction, and defect detection at line rates above 100 kHz. Per the APEX II datasheet, the embedded memory blocks (EABs) implement line buffers and lookup tables for gamma correction without external memory access, and the 333 MHz internal clock supports high-throughput pixel pipelines.
おすすめ
Aerospace and Defense Avionics Databus Interface
Avionics databus interfaces (MIL-STD-1553, ARINC 429, Fibre Channel) historically use the EP2A25F672C8N as a flexible I/O and protocol-processing hub. The 492 user I/Os support multiple redundant databus channels, and the 24,320 logic elements implement message scheduling, error handling, and BC/RT/MT modes. Per the APEX II datasheet, the commercial 0 to 85 C grade suits pressurized avionics bays, while the 1.5 V core keeps thermal dissipation within line-replaceable-unit envelopes.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2A25F672C8N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2A25F672C7N | EP2A25F672C7 | EP2A25F672C8 | EP2A15F672C8N | EP2A15F672C9N | EP2A15F672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FC-FBGA (FineLine BGA), 27x27 mm, 1.0 mm pitch | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | C8 (same) | C8 (same) | C9 (slower) | C7 (faster) |
| System Gates | 900,000 | 900,000 (same die) | 900,000 (same die) | 900,000 (same die) | 500,000 (-44%) | 500,000 (-44%) | 500,000 (-44%) |
| Logic Elements | 24,320 | 24,320 (same) | 24,320 (same) | 24,320 (same) | 15,360 (-37%) | 15,360 (-37%) | 15,360 (-37%) |
| User I/Os | 492 | 492 (same) | 492 (same) | 492 (same) | 492 (same package) | 492 (same package) | 492 (same package) |
| Maximum Internal Frequency | 333 MHz | 333 MHz (same) | 333 MHz (same) | 333 MHz (same) | 333 MHz (same family) | 333 MHz (same family) | 333 MHz (same family) |
| Lead-Free Finish | Yes (N suffix) | Yes (N) | No (SnPb) | No (SnPb) | Yes (N) | Yes (N) | Yes (N) |
主な差別化要因
- Higher logic density (900K gates, 24,320 LEs) compared to EP2A15 family （vs EP2A15F672C8N)
- C8 speed grade balances cost and performance （vs EP2A25F672C7N)
- Lead-free (N suffix) finish for RoHS compliance （vs EP2A25F672C8)
設計ノート
The 672-ball FC-FBGA package with 1.0 mm pitch requires microvia or via-in-pad PCB technology for fan-out. Per the APEX II datasheet, the 27 x 27 mm body needs at least 4 to 6 PCB layers with dedicated ground and power planes adjacent to the BGA. Designers should follow Intel/Altera's FineLine BGA escape pattern reference documents to avoid signal-integrity issues on high-speed serial pairs.
Estimated: at maximum 333 MHz internal clock and 90% utilization across 24,320 logic elements, the EP2A25F672C8N consumes approximately 3 to 4 W typical from the 1.5 V core rail. With theta_JA in the range of 15 to 20 C/W for the FC-FBGA package on a JEDEC 4-layer test board, the junction temperature rise is 45 to 80 C above ambient. Ensure adequate airflow or thermal vias under the package thermal pad for sustained operation in the 0 to 85 C commercial range.
Do not migrate the EP2A25F672C8N bitstream to a different speed-grade device (C7 or C9) without re-running Quartus II timing analysis. The same bitstream will load but internal delays differ, potentially causing hold-time violations at 333 MHz operation. Per the Altera APEX II datasheet, bitstreams are speed-grade specific and must be regenerated when the speed grade changes. Also verify configuration mode (Passive Serial, Passive Parallel, JTAG) and PROHIBIT pin settings match the target board.
コンプライアンス情報
RoHS compliant per N suffix in part number indicating lead-free terminal finish. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified part; commercial 0-85 C grade only). Halogen-free and conflict-minerals compliance not explicitly stated in available distributor data.