EP2A25F672C8N - APEX II 900K Gates 333MHz FPGA | Altera/Intel
MPN: EP2A25F672C8N ✗ اختتامِ زندگیEP2A25F672C8N جائزہ
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing configurable logic blocks (CLBs), embedded memory, I/O elements, and routing resources that the designer programs after manufacture using a hardware description language (HDL) or schematic entry. FPGAs occupy the middle ground between fixed-function ASICs and discrete glue logic, providing high integration, parallel processing, and rapid design iteration. The APEX II family in particular belongs to Altera's high-end, pre-Cyclone/Stratix era of multi-gigabit serial-interface capable PLDs, suitable for high-speed telecommunications, video, and DSP backplane designs.
Key features of the EP2A25F672C8N include 492 user I/Os for high pin-count designs, embedded system blocks (ESBs) for memory and CAM implementation, multi-gigabit transceivers (up to 1 Gbps per channel) for high-speed serial I/O, LVDS and HSTL I/O support, and a 1.5 V core supply with on-chip PLL clock management. The PLLs deliver low-jitter clock multiplication and skew control for multi-channel synchronous designs.
Architecturally, the APEX II device combines a hierarchical routing fabric with embedded array blocks (EABs) that double as RAM, ROM, or content-addressable memory (CAM). The 0.15-micrometer copper process enables higher logic density and lower power than the 0.18-micrometer process used in the original APEX family, while the dedicated high-speed serial interfaces make the part attractive for 1 Gbps backplanes, optical transport, and parallel DSP pipelines.
Typical applications include 1 Gbps networking line cards, optical transport and SONET/SDH framer ICs, multi-channel DSP coprocessors for wireless base stations, broadcast video processing engines, and high-speed test and measurement instrumentation. Designers choose the EP2A25F672C8N when they need a mature, second-sourced Altera architecture with abundant logic capacity and multi-gigabit I/O.
When designing with this part, engineers should verify Quartus II tool support for the APEX II device family and confirm long-term supply continuity, because APEX II has been classified as a mature device by Intel. For new designs, current-generation Cyclone or Stratix devices are typically recommended. Ensure PCB layout follows FineLine BGA escape rules with microvia or via-in-pad technology to fan out the 672-ball array.
کے لیے ڈراپ اِن متبادل EP2A25F672C8N — یکساں پیکیج، پن سے پن مطابقت پذیر۔ مختلف پیکیج والے پرزے جن کے لیے PCB دوبارہ کام درکار ہو، شامل نہیں ہیں۔
اس سیریز میں مختلف ورژن
اسی سیریز کے ماڈلز جو ڈراپ اِن مطابقت رکھتے ہیں EP2A25F672C8N (یکساں فارم فیکٹر اور فٹ پرنٹ) — میں مختلف Operating Temperature, Package, Process Technology, Embedded Memory, Speed Grade.
EP2A25F672C7N
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A25F672C7
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A25F672C8
✅ ڈراپ-اِنقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C8N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہ📋 حوالہ جاتی متبادل (کیٹلاگ میں نہیں)
EP2A15F672C9N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A15F672C7N
✅ ڈراپ-اِن ⚠️ تفصیلات غیر تصدیق شدہقیمت کے لیے رابطہ کریں
ڈیٹا شیٹ دیکھیں →EP2A25F672C8N زیادہ سے زیادہ ریٹنگز اور برقی خصوصیات
| Family | APEX II |
| Technology Node | 0.15 um all-layer copper process |
| System Gates | 900,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Internal Frequency | 333 MHz |
| Propagation Delay | 1.69 ns |
| User I/Os | 492 |
| پیکیج | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | 27 x 27 mm |
| Ball Pitch | 1.0 mm |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C8 |
| آپریٹنگ درجہ حرارت | 0 C to 85 C (commercial) |
| Multi-Gigabit Transceiver Rate | Up to 1 Gbps per channel |
| ماؤنٹنگ ٹائپ | Surface Mount |
| RoHS اسٹیٹس | Compliant |
| Lead-Free Suffix | N (lead-free, Pb-free finish) |
EP2A25F672C8N 27 x 27 mm پن کنفیگریشن گائیڈ
EP2A25F672C8N (27 x 27 mm پیکیج) کے لیے پن کنفیگریشن۔ اس ڈیجیٹل IC میں GPIO، کمیونیکیشن انٹرفیس (UART، SPI، I2C) اور پاور پنز شامل ہیں۔ متبادل پن فنکشنز اور کنفیگریشن آپشنز کے لیے مینوفیکچرر کے ڈیٹا شیٹ سے رجوع کریں۔ ایمبیڈڈ سسٹم ڈیزائن اور PCB لے آؤٹ کے لیے ضروری۔
کے لیے تفصیلی پن آؤٹ ڈیٹا دستیاب نہیں EP2A25F672C8N.
رجوع کریں ڈیٹا شیٹ مکمل پن کنفیگریشن کے لیے۔
عام استعمالات
EP2A25F672C8N کے لیے موزوں ہے 7 ایپلیکیشنs: 1 Gbps Optical Transport Line Card, SONET/SDH Framer and Mapper ASIC Replacement, Multi-Channel Wireless Base Station DSP Coprocessor, Broadcast Video Processing Engine, High-Speed Test and Measurement Instrumentation, High-Speed Industrial Imaging Pipeline, Aerospace and Defense Avionics Databus Interface.
1 Gbps Optical Transport Line Card
The EP2A25F672C8N's 1 Gbps multi-gigabit transceivers and 492 user I/Os make it a strong fit for 1 Gbps optical transport line cards. Per the APEX II datasheet, the device supports LVDS and HSTL I/O standards required by SFP/SFP+ module interfaces, while its 24,320 logic elements implement framer, mapper, and forward-error-correction functions in a single chip. The 672-ball FC-FBGA package provides the routing density needed for high-speed serial and parallel interfaces on the same PCB.
تجویز کردہ
SONET/SDH Framer and Mapper ASIC Replacement
Telecom OEMs replaced custom SONET/SDH ASICs with the EP2A25F672C8N to shorten design cycles and reduce NRE cost. The device's 900K system gates implement STS-1/STM-0 to STS-192/STM-64 framer logic, while 492 user I/Os connect to backplane SERDES chips. Per the Altera APEX II datasheet, embedded system blocks (ESBs) implement pointer-processing tables and overhead-byte insertion without external memory, and the 1.5 V core keeps power within NEBS thermal envelopes.
تجویز کردہ
Multi-Channel Wireless Base Station DSP Coprocessor
The EP2A25F672C8N is used as a multi-channel DSP coprocessor in 2G/3G wireless base stations, where it performs channelization, pulse shaping, and crest-factor reduction alongside dedicated DSP ASICs. Its 24,320 logic elements and embedded multipliers handle 8 to 16 parallel DSP channels at baseband sample rates. Per the APEX II datasheet, the on-chip PLLs provide low-jitter clock generation for radio card synchronization, and the commercial 0 to 85 C range meets indoor base-station thermal specs.
تجویز کردہ
Broadcast Video Processing Engine
Broadcast video routers and format converters employ the EP2A25F672C8N for real-time SDI/HD-SDI processing, color-space conversion, and frame-rate adaptation. The device's 492 user I/Os accommodate multiple SDI streams and DVI/HDMI bridges, while 24,320 logic elements implement scaling and deinterlacing filters. Per the APEX II datasheet, LVDS I/O at 622 Mbps handles SMPTE 259M and 292M serial video, and the 1 Gbps multi-gigabit transceiver supports 3G-SDI for HD broadcast studios.
تجویز کردہ
High-Speed Test and Measurement Instrumentation
Logic analyzers, protocol testers, and bit-error-rate testers use the EP2A25F672C8N to capture and pattern-generate multi-gigabit signals. Its 1 Gbps multi-gigabit transceivers handle protocols like PCI Express Gen 1, Serial RapidIO, and 1 GbE, while the 24,320 logic elements implement protocol-aware state machines. Per the APEX II datasheet, the on-chip ESBs build deep capture buffers without external SRAM, and the 672-ball BGA exposes sufficient pins for parallel logic-analyzer probe heads.
تجویز کردہ
High-Speed Industrial Imaging Pipeline
Machine-vision and semiconductor inspection systems use the EP2A25F672C8N for real-time image acquisition and processing. The 492 user I/Os interface to Camera Link or CoaXPress frame grabbers, while 24,320 logic elements perform Bayer demosaicing, color correction, and defect detection at line rates above 100 kHz. Per the APEX II datasheet, the embedded memory blocks (EABs) implement line buffers and lookup tables for gamma correction without external memory access, and the 333 MHz internal clock supports high-throughput pixel pipelines.
تجویز کردہ
Aerospace and Defense Avionics Databus Interface
Avionics databus interfaces (MIL-STD-1553, ARINC 429, Fibre Channel) historically use the EP2A25F672C8N as a flexible I/O and protocol-processing hub. The 492 user I/Os support multiple redundant databus channels, and the 24,320 logic elements implement message scheduling, error handling, and BC/RT/MT modes. Per the APEX II datasheet, the commercial 0 to 85 C grade suits pressurized avionics bays, while the 1.5 V core keeps thermal dissipation within line-replaceable-unit envelopes.
تجویز کردہ
تجویز کردہ پروڈکٹس کا خلاصہ
کے لیے انجینئرنگ ریفرنس ڈیٹا EP2A25F672C8N — موازنہ، ڈیزائن رہنمائی، اور تعمیل کی معلومات۔
انتخاب کی گائیڈ
متبادلات کے ساتھ موازنہ
| پیرامیٹر | یہ پروڈکٹ | EP2A25F672C7N | EP2A25F672C7 | EP2A25F672C8 | EP2A15F672C8N | EP2A15F672C9N | EP2A15F672C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FC-FBGA (FineLine BGA), 27x27 mm, 1.0 mm pitch | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Speed Grade | C8 | C7 (faster) | C7 (faster) | C8 (same) | C8 (same) | C9 (slower) | C7 (faster) |
| System Gates | 900,000 | 900,000 (same die) | 900,000 (same die) | 900,000 (same die) | 500,000 (-44%) | 500,000 (-44%) | 500,000 (-44%) |
| Logic Elements | 24,320 | 24,320 (same) | 24,320 (same) | 24,320 (same) | 15,360 (-37%) | 15,360 (-37%) | 15,360 (-37%) |
| User I/Os | 492 | 492 (same) | 492 (same) | 492 (same) | 492 (same package) | 492 (same package) | 492 (same package) |
| Maximum Internal Frequency | 333 MHz | 333 MHz (same) | 333 MHz (same) | 333 MHz (same) | 333 MHz (same family) | 333 MHz (same family) | 333 MHz (same family) |
| Lead-Free Finish | Yes (N suffix) | Yes (N) | No (SnPb) | No (SnPb) | Yes (N) | Yes (N) | Yes (N) |
اہم امتیازی خصوصیات
- Higher logic density (900K gates, 24,320 LEs) compared to EP2A15 family (بمقابلہEP2A15F672C8N)
- C8 speed grade balances cost and performance (بمقابلہEP2A25F672C7N)
- Lead-free (N suffix) finish for RoHS compliance (بمقابلہEP2A25F672C8)
ڈیزائن نوٹس
The 672-ball FC-FBGA package with 1.0 mm pitch requires microvia or via-in-pad PCB technology for fan-out. Per the APEX II datasheet, the 27 x 27 mm body needs at least 4 to 6 PCB layers with dedicated ground and power planes adjacent to the BGA. Designers should follow Intel/Altera's FineLine BGA escape pattern reference documents to avoid signal-integrity issues on high-speed serial pairs.
Estimated: at maximum 333 MHz internal clock and 90% utilization across 24,320 logic elements, the EP2A25F672C8N consumes approximately 3 to 4 W typical from the 1.5 V core rail. With theta_JA in the range of 15 to 20 C/W for the FC-FBGA package on a JEDEC 4-layer test board, the junction temperature rise is 45 to 80 C above ambient. Ensure adequate airflow or thermal vias under the package thermal pad for sustained operation in the 0 to 85 C commercial range.
Do not migrate the EP2A25F672C8N bitstream to a different speed-grade device (C7 or C9) without re-running Quartus II timing analysis. The same bitstream will load but internal delays differ, potentially causing hold-time violations at 333 MHz operation. Per the Altera APEX II datasheet, bitstreams are speed-grade specific and must be regenerated when the speed grade changes. Also verify configuration mode (Passive Serial, Passive Parallel, JTAG) and PROHIBIT pin settings match the target board.
تعمیل کی معلومات
RoHS compliant per N suffix in part number indicating lead-free terminal finish. AEC-Q100 not applicable (FPGA is not an automotive-grade qualified part; commercial 0-85 C grade only). Halogen-free and conflict-minerals compliance not explicitly stated in available distributor data.