EP2AGZ225FF35I4N - 224K LE Arria II GZ FPGA, 1152-FCBGA | Intel
部品番号: EP2AGZ225FF35I4N ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1390 | $1,390,000.00 |
EP2AGZ225FF35I4N 概要
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) interconnected by a programmable routing fabric, with embedded memory, DSP blocks, and high-speed transceiver/IO resources. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) under digital integrated circuits, and the Arria II GZ family specifically targets mid-to-high-end applications that need transceivers, parallel memory interfaces, and signal-processing throughput but do not require the very latest transceiver data rates.
Key features of the EP2AGZ225FF35I4N include 554 user I/Os, 12 transceivers capable of multi-gigabit operation, dedicated DSP blocks, embedded memory organized as M9K/M144K blocks, and support for external memory interfaces including DDR3. The device operates across an industrial temperature range of -40C to +100C, supports configuration via fast passive parallel (FPP) and active serial (AS) modes, and provides JTAG (IEEE 1149.1) and SignalTap embedded logic analysis.
Architecturally, the Arria II GZ uses a logic fabric of 8-input adaptive logic modules (ALMs) and an 8.96 Mbit distributed+block memory hierarchy. The 40 nm low-power process yields high DSP throughput while keeping the static power low for high-density designs such as high-definition video processing, multi-channel baseband aggregation, and radar pre-processing.
Typical applications include high-definition video broadcasting infrastructure, wireless baseband processing, military radar and signal intelligence, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, CPRI), and ASIC prototyping. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well suited to data-pump designs that previously required a discrete DSP + memory + ASIC combination.
When designing with this device, ensure that the PCB footprint matches the 35 mm x 35 mm, 1.0 mm pitch FC-FBGA-1152 land pattern and that the board provides all required decoupling per Intel's pin connection guidelines. Power sequencing for the 0.9 V core and 1.5 V/2.5 V/3.0 V auxiliary rails must follow the datasheet power-on-reset (POR) requirements to avoid configuration failure.
This page synthesizes distributor pricing, drop-in alternatives (same brand, then cross-brand), pin-level design guidance, and application notes not found in the manufacturer datasheet alone, helping procurement and hardware engineers evaluate this FPGA quickly for new builds or legacy board refresh.
ドロップイン代替品: EP2AGZ225FF35I4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2AGZ225FF35I4N （同一形状・フットプリント） — 相違点: Package, Speed Grade, Embedded Memory, RoHS Status, Process Technology.
クイック比較ツール — 並列比較する代替部品を選択:
EP2AGZ225FF35I4G
✅ ドロップイン✓ 在庫あり
$1450 / 個
データシートを見る →EP2AGZ225FF35I3N
✅ ドロップイン✓ 在庫あり
$2655 / 個
データシートを見る →EP2AGZ225FF35I3G
✅ ドロップイン✓ 在庫あり
$4400 / 個
データシートを見る →EP2AGZ225FF35C4N
✅ ドロップイン✓ 在庫あり
$1750 / 個
データシートを見る →EP2AGZ225FF35C4G
✅ ドロップイン✓ 在庫あり
価格はお問い合わせください
データシートを見る →EP2AGZ225FF35I4N 最大定格＆電気的特性
| Family | Arria II GZ |
| Logic Elements (LEs) | 224000 |
| Number of LABs/CLBs | 8960 |
| Total Memory Bits | 14248960 |
| Number of I/O | 554 |
| Supply Voltage - Core | 0.9 V |
| Process Technology | 40 nm |
| Maximum Operating Frequency | 500 MHz |
| 動作温度 | -40C to +100C (Industrial) |
| パッケージ / ケース | 1152-BBGA, FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| 実装タイプ | Surface Mount |
| Lead Free / RoHS | Lead Free / RoHS Compliant |
| Temperature Grade | Industrial (I4) |
EP2AGZ225FF35I4N 35 mm x 35 mm ピン配置ガイド
EP2AGZ225FF35I4N (35 mm x 35 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2AGZ225FF35I4N.
詳細は データシート をご参照ください。
主な用途
EP2AGZ225FF35I4N の用途: 6 件s: HD Video Broadcast Infrastructure, Wireless Baseband Processing, Military Radar and Signal Intelligence, High-Speed Serial Protocol Bridging, ASIC Prototyping, Industrial Machine Vision.
HD Video Broadcast Infrastructure
The EP2AGZ225FF35I4N suits HD video broadcast infrastructure because its 224,000 logic elements and 14,248,960 bits of embedded memory handle multi-channel SD/HD-SDI processing, frame buffering, and on-the-fly video scaling without external SRAM. The 12 embedded transceivers run at multi-gigabit rates to drive SDI, HDMI, and DisplayPort output links concurrently. Its 1152-FCBGA package exposes 554 user I/Os, providing enough parallel LVDS/CMOS pins to interface with video DACs, audio embedders, and front-panel controls. Designers typically pair it with external DDR3 for line/frame buffers and instantiate IP cores such as SDI framer/deframer, color-space converter, and JPEG2000 codec directly in the fabric.
おすすめ
Wireless Baseband Processing
The EP2AGZ225FF35I4N fits wireless baseband cards for LTE small cells and proprietary point-to-point radios because its DSP blocks deliver hundreds of GMACs, and the 14.2 Mbit embedded memory absorbs symbol-rate FFT/IFFT intermediate buffers. The 12 multi-gigabit transceivers support CPRI, OBSAI, and JESD204B links to RFICs, while 554 I/Os interface with analog front ends, timing ICs, and CPRI backhaul. Industrial -40C to +100C grading allows outdoor radio unit deployment. Quartus II DSP Builder and the FFT IP core map LTE 20 MHz and 5G NR sub-6 numerologies onto the fabric within timing closure on the I4 speed grade.
おすすめ
Military Radar and Signal Intelligence
The EP2AGZ225FF35I4N is qualified for military radar preprocessing and SIGINT collection because its high DSP throughput, large on-chip memory, and industrial -40C to +100C temperature range cover ruggedized enclosures. Designers implement pulse compression, MTI filtering, and digital beamforming in the fabric, using the embedded memory to stage range-Doppler maps before transferring to a host CPU. The 12 transceivers accept direct ADC sampling outputs (JESD204B) from RF downconverters, eliminating external deserializer parts. The 1152-FCBGA exposes enough LVDS pairs to capture 16+ ADC channels at 250 MSPS without multiplexer bottlenecks.
おすすめ
High-Speed Serial Protocol Bridging
The EP2AGZ225FF35I4N serves as a multi-protocol bridge for PCIe Gen2, Serial RapidIO, and 10 Gigabit Ethernet aggregation because the 12 embedded transceivers operate at data rates compatible with all three standards simultaneously. The 224K LE fabric implements protocol stack logic, DMA engines, and packet classification without external ASICs. With 554 user I/Os the device maintains wide parallel buses to legacy ASICs and memory, while the transceivers aggregate north-bound links. Industrial temperature grading and lead-free compliance allow deployment in carrier-grade and industrial Ethernet switches, where board space savings versus discrete PHY + ASSP designs are significant.
おすすめ
ASIC Prototyping
The EP2AGZ225FF35I4N works as an ASIC prototyping vehicle for chips originally targeted at 180 nm to 65 nm process nodes because its 224K LE roughly maps to 2-3 million ASIC gates. Multi-FPGA partitioning uses the 12 transceivers as chip-to-chip links at 3-6 Gbps, and the 14.2 Mbit embedded memory substitutes for embedded SRAM macros during bring-up. Quartus II synthesis accepts unmodified Verilog or VHDL from ASIC flows via Synopsys Design Compiler or Cadence Genus. The 1152-FCBGA provides enough package pins to break out full ASIC pad rings for verification.
おすすめ
Industrial Machine Vision
The EP2AGZ225FF35I4N powers high-speed industrial machine vision controllers because its DSP blocks deliver real-time Bayer demosaicing, color matrix conversion, and edge-detection at multi-megapixel rates up to 250 frames per second. The 14.2 Mbit embedded memory buffers raw sensor frames before compression, while the 12 transceivers aggregate Camera Link HS, CoaXPress, or 10 GigE Vision uplinks. Industrial -40C to +100C temperature grading and lead-free compliance support factory-floor deployments. The 554 user I/Os trigger lighting strobes, accept encoder feedback, and drive motor controllers, consolidating functions previously split across FPGA + MCU.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2AGZ225FF35I4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2AGZ225FF35I4G | EP2AGZ225FF35I3N | EP2AGZ225FF35I3G | EP2AGZ225FF35C4N | EP2AGZ225FF35C4G |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35mm) | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same | 1152-FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 224000 | 224000 | 224000 | 224000 | 224000 | 224000 |
| Embedded Memory (bits) | 14248960 | 14248960 | 14248960 | 14248960 | 14248960 | 14248960 |
| User I/Os | 554 | 554 | 554 | 554 | 554 | 554 |
| Speed Grade | I4 (industrial, mid) | I4 | I3 (faster) | I3 (faster) | C4 (commercial) | C4 (commercial) |
| Temperature Grade | -40C to +100C Industrial | -40C to +100C Industrial | -40C to +100C Industrial | -40C to +100C Industrial | 0C to +85C Commercial | 0C to +85C Commercial |
| Lead-Free / RoHS | Lead-Free | Lead-Free / RoHS (G suffix) | Lead-Free (N suffix) | Lead-Free / RoHS | Lead-Free (N suffix) | Lead-Free / RoHS |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
主な差別化要因
- Largest embedded memory in the Arria II GZ family at 1152-FCBGA tier （vs EP2AGX260FF35I5N (Arria II GX))
- Industrial -40C to +100C temperature grade （vs EP2AGZ225FF35C4N (commercial 0C-85C))
- Mid-tier I4 speed grade balances power and timing margin （vs EP2AGZ225FF35I3N (faster I3 speed grade))
- Identical 224K-LE fabric with multiple drop-in same-brand variants （vs EP2AGZ225FF35I4G (lead-free RoHS variant))
設計ノート
Estimated: the EP2AGZ225FF35I4N 1152-ball FC-FBGA at 35 mm x 35 mm with 1.0 mm ball pitch requires a PCB with microvia stack-up (laser-drilled microvias from BGA pad to inner layer) because 0.4 mm-0.5 mm dog-bone fan-out is impractical at this pitch. Use 1-2-1 or 1-2-2-1 layer stack with high-Tg FR-4 or low-loss mid-loss laminate, and route all transceiver differential pairs on the top or adjacent stripline layer with reference plane intact. Provide at least 1 oz copper on outer layers and 0.5 oz on inner layers for adequate thermal spreading.
The Arria II GZ EP2AGZ225FF35I4N requires sequenced power on the 0.9 V core, 1.5 V/2.5 V/3.0 V auxiliary rails, and transceiver supply rails per the device handbook POR table. Use a power management IC with monotonic ramp capability (such as the LTM4644 or Intel's recommended sequencer) to avoid configuration failure. Place 0.1 uF X7R and 10 uF X5R decoupling within 50 mil of every supply ball, and add bulk 220 uF polymer caps at the regulator outputs to absorb load-step transients during transceiver toggling.
Estimated: at 0.9 V core with typical 224K LE utilization around 70-80% and full transceiver activity, the EP2AGZ225FF35I4N can dissipate 6-10 W. The FC-FBGA-1152 package has a junction-to-ambient thermal resistance around 8-12 C/W with a properly designed thermal via array under the exposed die pad. Thermal vias should be 0.3 mm pitch, plugged and capped on the inner layers, and tied to a continuous ground plane. Forced-air cooling at 1-2 m/s is recommended for industrial chassis above 60 C ambient.
Route the 12 multi-gigabit transceiver channels with 100 ohm differential impedance, length-matched within 5 mil for TX and RX pairs on the same channel, and isolated from noisy digital signals by ground-fence vias. The reference plane under transceiver lanes must be continuous - any split or via stub longer than 100 mil will degrade eye margins at 6 Gbps and above. Use Saturn PCB Toolkit or Si9000 to verify impedance before fab release, and validate with post-layout simulation in HyperLynx or ANSYS SIwave.
Do not connect MSEL[2:0] to an unselected mode - the EP2AGZ225FF35I4N configures based on these pins at power-up, and an invalid combination leaves the device unconfigured. Always include JTAG header (TCK, TMS, TDI, TDO) for debug access even if configuration is via AS mode, because SignalTap and the Quartus II programmer need JTAG for in-system bring-up. For multi-rail systems, ensure the configuration flash (EPCS64 or compatible) is on a dedicated 3.3 V rail that ramps before or simultaneously with the core voltage.
コンプライアンス情報
Lead-free per manufacturer datasheet. RoHS and REACH compliance confirmed by manufacturer product page. AEC-Q100 not applicable as this is an FPGA rather than an automotive-grade IC; for AEC-Q100 qualified PLD alternatives consult manufacturer cross-reference. Halogen-free status not explicitly stated in verified data - marked unknown.