EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel
部品番号: EP2S180F1508I4 ⚠ ラストタイムバイ| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2240 | $1,120,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
EP2S180F1508I4 概要
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory and multiplier resources on a single silicon die. FPGAs sit at the apex of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic), and provide ASIC-like density with the in-system reconfigurability of a programmable device. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that breaks from traditional 4-LUT designs, achieving roughly 50 percent higher logic utilization per die area than its Stratix predecessor.
Key features of the EP2S180F1508I4 include 384 maximum user I/O pins (verified datasheet total of 1,170 available pins across all I/O banks), 12 PLLs for multi-domain clock management, up to 717 MHz internal operation, and dedicated high-speed I/O supporting LVDS, LVPECL, and HyperTransport signalling. The embedded TriMatrix memory structure provides true dual-port, simple dual-port, and single-port RAM blocks with parity protection, optimized for high-bandwidth buffering in DSP pipelines and packet processing engines.
The device uses a low-k dielectric 90 nm process and incorporates dedicated hard IP blocks including 18-bit x 18-bit multipliers configurable as 36-bit multipliers, four 3.125 Gbps transceiver-ready I/O structures, and on-chip termination (OCT) to reduce external component count. The die is mounted flip-chip on a high-Tg substrate and capped with a metallic heat spreader, providing the thermal headroom required by the largest Stratix II devices. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional external configuration devices such as the EPC16 or EPCS family.
Typical applications for the EP2S180F1508I4 include high-performance ASIC prototyping, 10 Gbps and 40 Gbps wire-speed packet processing, software-defined radio (SDR) baseband preprocessing, test and measurement instrumentation with deep waveform capture memory, and broadcast video processing for HD-SDI and emerging 3G-SDI standards. The high logic and memory density makes it especially attractive for replacing gate arrays and small-cell ASICs where NRE cost cannot be amortized.
When designing with this part, allocate at least 1 VCCINT decoupling capacitor (0.1 uF X7R) per unique power pin, place VCCIO pins on quiet supply rails isolated from switching converters, and follow the Altera (now Intel) Stratix II Hardware Reference Manual guidelines for PCB stackup and via-in-pad thermal relief. Industrial-temperature screening means the I4 device operates reliably across -40C to +100C ambient; for full military screening, the equivalent EP2S180F1508I4N-grade part is available only through specific authorized distributors and lead times can exceed 12 weeks.
This page synthesizes distributor stock data, datasheet specifications, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single source for the EP2S180F1508I4 lifecycle and replacement information.
ドロップイン代替品: EP2S180F1508I4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S180F1508I4 （同一形状・フットプリント） — 相違点: Process Technology, Package, Speed Grade, Family, Core Voltage.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S180F1508C5N
✅ ドロップイン✓ 在庫あり
$5050 / 個
データシートを見る →EP2S180F1508C4N
✅ ドロップイン✓ 在庫あり
$985 / 個
データシートを見る →EP2S180F1508C3N
✅ ドロップイン✓ 在庫あり
$1200 / 個
データシートを見る →EP2S180F1508I4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$445 / 個
データシートを見る →EP2S130F1508I4
✅ ドロップイン✓ 在庫あり
$3950 / 個
データシートを見る →EP2S130F1508I4N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$1390 / 個
データシートを見る →EP2S180F1508I4 最大定格＆電気的特性
| Family | Stratix II |
| Logic Elements | 179,400 |
| Total RAM Bits | 9,383,040 |
| Logic Array Blocks (LABs) | 8,970 |
| User I/O | 1,170 (verified I/O count across all banks) |
| DSP Blocks | 96 |
| Embedded PLLs | 12 |
| Core Voltage | 1.15 V to 1.25 V (1.2 V nominal) |
| Process Technology | 90 nm CMOS with low-k dielectric |
| パッケージ | 1508-ball FC-FBGA |
| Package Dimensions | 40 mm x 40 mm (Flip-Chip) |
| 動作温度 | -40C to +100C (industrial, I4 grade) |
| Configuration Modes | PS, PPS, PPA, JTAG |
| RoHS ステータス | Compliant (per product page) |
EP2S180F1508I4 40 mm x 40 mm (flip-chip) ピン配置ガイド
EP2S180F1508I4 (40 mm x 40 mm (flip-chip) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S180F1508I4.
詳細は データシート をご参照ください。
主な用途
EP2S180F1508I4 の用途: 7 件s: ASIC Prototyping and Emulation, 10 Gbps Wire-Speed Packet Processing, Software-Defined Radio (SDR) Baseband, Test and Measurement Instrumentation, Broadcast Video Processing (HD-SDI / 3G-SDI), High-Performance Computing Acceleration, Military and Aerospace Avionics.
ASIC Prototyping and Emulation
The EP2S180F1508I4's 179,400 logic elements and 9.38 Mbit of TriMatrix embedded memory make it a strong fit for ASIC and ASSP prototyping, where a single FPGA must emulate an entire multi-million-gate ASIC subsystem. With up to 12 PLLs and 96 DSP blocks, the device can host clock-domain-crossing logic that mirrors ASIC timing closure challenges, giving the verification team early confidence that the ASIC signoff will succeed. Designers typically partition a target ASIC into four or five Stratix II devices using pin-multiplexing to share the 1,170 available I/Os across emulator channels.
おすすめ
10 Gbps Wire-Speed Packet Processing
With dedicated high-speed serial I/O structures supporting LVDS, LVPECL, and rates up to 3.125 Gbps per channel, the EP2S180F1508I4 is well matched to wire-speed packet processing for 10 Gbps and 40 Gbps line cards. The 9.38 Mbit of true dual-port TriMatrix memory provides headroom for packet buffer queues, while the 96 DSP blocks accelerate hash and CRC computations in classification pipelines. Up to 12 PLLs allow precise per-channel clock recovery from SGMII, XAUI, or Interlaken interfaces without external jitter cleaners.
おすすめ
Software-Defined Radio (SDR) Baseband
The EP2S180F1508I4's combination of 96 DSP blocks, 12 PLLs, and 1,170 user I/Os makes it well suited for SDR baseband preprocessing where multi-antenna MIMO streams must be filtered, decimated, and channelized in real time. Designers can implement polyphase filter banks and FFT pipelines that consume 200K to 300K equivalent ASIC gates, fitting comfortably within the 179K LE budget. The industrial temperature grade supports outdoor deployment in military and tactical radio platforms.
おすすめ
Test and Measurement Instrumentation
For deep-memory oscilloscopes, logic analyzers, and protocol analyzers, the EP2S180F1508I4 delivers the deep TriMatrix memory and high I/O count required to capture and time-stamp long record buffers in real time. The 8,970 LABs support custom triggering engines that combine edge, glitch, and pattern detection, while 1,170 user I/Os accept multi-channel probe inputs up to 1 GHz LVDS. Industrial temperature rating enables portable field instruments operating across -40C to +100C ambient.
おすすめ
Broadcast Video Processing (HD-SDI / 3G-SDI)
The EP2S180F1508I4's high-speed LVDS I/O structures support SDI (Serial Digital Interface) rates from 270 Mbps SD-SDI up to 2.97 Gbps 3G-SDI without external serializer/deserializer chips. With 179,400 logic elements, designers can implement multi-channel format conversion, frame synchronization, and picture-in-picture blending for broadcast studio routers and edit suites. The 1508-ball FC-FBGA package provides the fine-pitch I/O density required for 16+ simultaneous SDI channels in a single device.
おすすめ
High-Performance Computing Acceleration
HPC and computational finance workloads map efficiently onto the EP2S180F1508I4's 96 DSP blocks, which deliver up to 96 18-bit x 18-bit multiplications per clock cycle, accelerating Monte Carlo simulations and Monte Carlo option pricing in finance. The 9.38 Mbit of TriMatrix memory supports large lookup tables for credit default swap pricing and risk analytics. Up to 12 PLLs enable precise synchronization of multiple FPGAs across a co-processing cluster via low-jitter LVDS clock distribution.
おすすめ
Military and Aerospace Avionics
The I4 industrial temperature grade of the EP2S180F1508I4 makes it suitable for military avionics subsystems operating in unpressurized bays where ambient temperatures swing from -40C to +100C. Applications include radar signal preprocessing, electronic warfare (EW) jamming pattern generation, and flight-control co-processors. The 1508-ball FC-FBGA package with integrated heat spreader supports the long-term reliability expectations of 20+ year defense program lifecycles when sourced through authorized distributors with full traceability.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S180F1508I4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S180F1508C5N | EP2S180F1508C4N | EP2S180F1508C3N | EP2S130F1508I4 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-FBGA (40x40 mm) | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same |
| Logic Elements | 179,400 LE | 179,400 LE (same) | 179,400 LE (same) | 179,400 LE (same) | 132,540 LE (-26%) |
| Total RAM Bits | 9,383,040 bits | 9,383,040 bits (same) | 9,383,040 bits (same) | 9,383,040 bits (same) | 6,747,840 bits (-28%) |
| User I/O | 1,170 | 1,170 (same) | 1,170 (same) | 1,170 (same) | 1,170 (same) |
| DSP Blocks | 96 | 96 (same) | 96 (same) | 96 (same) | 64 (-33%) |
| Embedded PLLs | 12 | 12 (same) | 12 (same) | 12 (same) | 12 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) - same |
| Speed Grade | I4 (industrial) | C5 (fastest commercial) | C4 (mid commercial) | C3 (slowest commercial) | I4 (same speed, lower density) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) |
主な差別化要因
- Highest-density Stratix II member with 179,400 LE （vs EP2S130F1508I4)
- Industrial temperature grade support across -40C to +100C （vs EP2S180F1508C5N)
- 9.38 Mbit embedded TriMatrix memory for deep packet buffers （vs EP2S130F1508I4)
設計ノート
Estimated: At a 1.2 V core supply drawing approximately 16 A typical dynamic current, the EP2S180F1508I4 requires at least 24 low-inductance VCCINT decoupling capacitors of 0.1 uF X7R plus 4 bulk capacitors of 470 uF polymer placed within 0.5 inch of each power-pin cluster. Use via-in-pad construction with 0.5 mm via drill and 1.0 mm pad to meet Intel's Stratix II Hardware Reference Manual stackup recommendations. A 12-layer PCB with 1 oz copper inner planes and 2 oz copper outer layers is the recommended baseline.
Estimated: At typical operation with 50 percent logic utilization and 100 MHz clock activity, the EP2S180F1508I4 dissipates approximately 18 W to 22 W. With a published theta_JB of approximately 0.5 C/W and the integrated heat spreader, junction-to-ambient thermal resistance depends heavily on airflow and heatsink mounting torque. For industrial -40C to +100C ambient operation in a sealed enclosure, derate junction temperature budget by 15C and consider a 20x20 mm aluminum heatsink with thermal interface material rated at 0.1 C/W-in2.
Place configuration device (EPC16, EPCS64, or compatible) within 2 inches of the FPGA's configuration pins to meet passive-serial and passive-parallel timing. Route the nCONFIG, nSTATUS, CONF_DONE, and DCLK signals on the same PCB layer with matched lengths and 50 ohm controlled impedance. The JTAG chain (TCK, TMS, TDI, TDO) should be series-terminated at the FPGA end and chain integrity verified before power-up to avoid configuration failures on the 1508-ball FC-FBGA.
Do not hot-plug the EP2S180F1508I4 - the Stratix II family does not support live insertion and can suffer latch-up damage if VCCINT ramps before VCCIO. Follow the recommended power sequencing: VCCIO must be within 1.2 V of VCCINT during ramp, otherwise internal ESD diodes forward-bias. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to confirm worst-case junction temperature before PCB commit; the EPE accepts 90 nm process-specific derating factors absent from generic thermal calculators.
コンプライアンス情報
RoHS and REACH compliance per Altera/Intel product page. AEC-Q100 not applicable for FPGAs - this is a logic device, not an automotive analog IC. Industrial temperature grade (-40C to +100C) per I4 suffix.