EP1S80F1508C6 - Stratix 79K LE FPGA, 1508-BGA | Intel | Altera
部品番号: EP1S80F1508C6 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $218.5 | $2,185.00 |
| 100 | $189 | $18,900.00 |
| 500 | $165.75 | $82,875.00 |
| 1,000 | $148.2 | $148,200.00 |
EP1S80F1508C6 概要
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP blocks such as RAM, DSP multipliers, PLLs, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), are a subclass of digital logic ICs, and are used wherever designers need hardware-level parallelism with the flexibility of firmware-based reconfiguration. The Stratix family targets high-performance applications such as ASIC prototyping, signal processing, and high-bandwidth communications.
Key features of the EP1S80F1508C6 include up to 12 embedded DSP blocks, multiple PLLs, dedicated high-speed memory interfaces (DDR SDRAM, FCRAM, QDR SRAM, RLDRAM), and embedded RAM blocks arranged in TriMatrix memory structures of 512-bit M512, 4-Kbit M4K, and 512-Kbit M-RAM blocks. The 1508-BGA package provides abundant routing resources, allowing the device to support large numbers of LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards simultaneously.
Architecturally, the device incorporates the Stratix logic structure with each LE consisting of a 4-input look-up table (LUT), a programmable register, and a carry chain for arithmetic operations. MultiTrack interconnect provides predictable routing delay, while the embedded DSP blocks implement 9-bit × 9-bit multipliers that can be cascaded to support higher-precision signal-processing functions. The TriMatrix memory architecture gives designers a flexible trade-off between memory depth and width.
Typical applications for the EP1S80F1508C6 include ASIC prototyping and emulation, digital video and image processing, telecom and datacom line cards, high-speed test and measurement equipment, and DSP co-processing. Its high logic density and abundant I/O also make it suitable for industrial control, military/aerospace subsystems, and pre-silicon validation of complex SoC designs.
When designing with this device, pay close attention to power-rail sequencing for the core, I/O banks, and PLL analog supplies, and use the Quartus II design software for synthesis, place-and-route, and timing closure. The FC-FBGA package requires controlled-impedance PCB routing with matched-length traces for high-speed LVDS and DDR interfaces.
This page synthesizes distributor stock, pricing tiers, and Stratix drop-in alternatives into a single engineering reference that complements the official Stratix Device Family Data Sheet. Information is current as of 2026-09-07.
ドロップイン代替品: EP1S80F1508C6 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP1S80F1508C6 （同一形状・フットプリント） — 相違点: Package, Process Technology, DSP Blocks, Maximum User I/O, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP1S80F1508C6N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1S80F1508C5
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1S80F1508C7
✅ ドロップイン✓ 在庫あり
$108.4 / 個
データシートを見る →EP1S80F1508I7
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1S80F1508I7N
✅ ドロップイン📋 参考代替品（カタログ未掲載）
EP1S80F1508C6 最大定格＆電気的特性
| Family | Stratix |
| Logic Elements (LEs) | 79,040 |
| Logic Array Blocks (LABs) | 7,904 |
| Total RAM Bits | 7,427,520 |
| Maximum User I/O | 1,203 |
| Process Technology | 0.13 µm all-layer copper SRAM |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 450.05 MHz |
| Operating Temperature Grade | Commercial (0C to 85C) |
| パッケージ | 1508-ball FC-FBGA |
| Package Pitch | 1.0 mm |
| Package Body Size | 33 mm x 33 mm |
| Embedded DSP Blocks | 12 (9-bit x 9-bit multipliers) |
| PLLs | Multiple (per datasheet) |
| Embedded Memory Architecture | TriMatrix (M512, M4K, M-RAM) |
| RoHS ステータス | Compliant per distributor listings |
EP1S80F1508C6 33 mm x 33 mm ピン配置ガイド
EP1S80F1508C6 (33 mm x 33 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP1S80F1508C6.
詳細は データシート をご参照ください。
主な用途
EP1S80F1508C6 の用途: 6 件s: ASIC Prototyping and Emulation, Telecom and Datacom Line Cards, High-Speed DSP and Video Processing, Industrial Control and Automation, Test and Measurement Instrumentation, Military and Aerospace Subsystems.
ASIC Prototyping and Emulation
The EP1S80F1508C6's 79,040 logic elements and 7,427,520 RAM bits make it well suited for ASIC and SoC prototyping, where engineers partition a large design across one or more Stratix devices and verify real-world timing before tape-out. The 1508-ball FC-FBGA package exposes up to 1,203 user I/O, enough to map wide ASIC buses and external memory interfaces onto the FPGA prototyping board. Its 1.5 V core and 0.13 µm process deliver predictable timing closure with Quartus II synthesis. Compared with smaller Cyclone devices, the Stratix-1 family offers the embedded TriMatrix memory and 12 DSP blocks required to model ASIC functions at full throughput.
おすすめ
Telecom and Datacom Line Cards
Stratix devices like the EP1S80F1508C6 were widely adopted in telecom line cards that aggregate TDM, ATM, or Ethernet traffic. The 12 embedded DSP blocks support channelized voice processing, scrambling/descrambling, and FEC algorithms, while dedicated high-speed interfaces accept DDR SDRAM and QDR SRAM for packet buffering. The 1,203 available user I/O enable connection to multiple SFP/GBIC optical transceivers and backplane SERDES. At 450 MHz core frequency, the device sustains multi-gigabit data planes without external co-processors. Industrial-grade I-suffix variants of the same die extend the design into outdoor base-station deployments.
おすすめ
High-Speed DSP and Video Processing
The 12 DSP blocks in the EP1S80F1508C6 each implement 9-bit x 9-bit multipliers with cascading for higher-precision FIR filters and FFT butterfly operations, giving the device a usable DSP throughput of several GMACS for real-time video and radar processing. Its 7,427,520 RAM bits host line buffers and FFT working memory on-chip, eliminating external SRAM accesses and reducing latency in pipelined DSP kernels. The FC-FBGA-1508 package supports LVDS I/O to camera sensors and DVI/HDMI bridges, while the 1.5 V core minimizes power at high clock rates. Quartus II's DSP Builder accelerates model-based design of these pipelines.
おすすめ
Industrial Control and Automation
The EP1S80F1508C6's combination of high logic density, abundant LVTTL/LVCMOS I/O, and embedded DSP makes it well suited to programmable logic controllers (PLCs), motion controllers, and machine-vision systems. Engineers can integrate motor-control loops, encoder decoding, EtherCAT or Profibus protocol stacks, and safety logic on a single Stratix device, simplifying BOM and improving deterministic response. Industrial-temperature I-suffix variants such as EP1S80F1508I7N operate from -40C to 100C, covering factory-floor deployments. The 1508-ball FC-FBGA footprint gives enough I/O to drive dozens of sensors and actuators in parallel.
おすすめ
Test and Measurement Instrumentation
Test equipment designers use the EP1S80F1508C6 for arbitrary waveform generators, protocol analyzers, and high-speed data-acquisition backends. The 12 DSP blocks enable real-time FIR, CIC, and Hilbert filters, while the 7,427,520 RAM bits store deep capture buffers for protocol analysis. The 450 MHz internal frequency supports multi-gigasample-per-second equivalent processing when paired with external ADC front ends. The 1508-ball FC-FBGA exposes enough LVDS pairs to interface modern ADCs and DACs directly, and Quartus II's SignalTap II logic analyzer provides on-chip debug visibility critical for validation labs.
おすすめ
Military and Aerospace Subsystems
Defense and aerospace programs adopted the EP1S80F1508C6 for radar front-end processing, electronic warfare subsystems, and secure communications where high logic density and DSP throughput are mandatory. Its 1508-ball FC-FBGA package with controlled-impedance LVDS lanes interfaces directly to RF ADCs and DACs, while the embedded TriMatrix memory stores beamforming weights and FFT working data. Industrial-temperature variants extend operation into unconditioned enclosures, and the Stratix logic architecture is supported by long-lifecycle defense programs. Program updates via JTAG enable in-field reconfiguration of mission firmware.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP1S80F1508C6 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP1S80F1508C6N | EP1S80F1508C5 | EP1S80F1508C7 | EP1S80F1508I7 | EP1S80F1508I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 | 79,040 |
| RAM Bits | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 | 7,427,520 |
| Maximum User I/O | 1,203 | 1,203 | 1,203 | 1,203 | 1,203 | 1,203 |
| Speed Grade | C6 | C6 | C5 (slower) | C7 (faster) | I7 (faster industrial) | I7 (faster, lead-free) |
| Temperature Grade | Commercial 0C to 85C | Commercial | Commercial | Commercial | Industrial -40C to 100C | Industrial -40C to 100C |
| Terminal Finish | SnPb (non-N suffix) | Lead-free (N suffix) | SnPb | SnPb | SnPb | Lead-free (N suffix) |
主な差別化要因
- Lead-free drop-in replacement available with identical silicon （vs EP1S80F1508C6N)
- Higher Fmax speed grades available in same footprint （vs EP1S80F1508C7)
- Industrial temperature variant available in same footprint （vs EP1S80F1508I7N)
設計ノート
Estimated: The EP1S80F1508C6 requires multi-rail power sequencing for VCCINT (1.5 V core), VCCIO (per-bank, 1.5 V/1.8 V/2.5 V/3.3 V), VCCA_PLL (analog PLL supply), and VCCPD (pre-driver). Power-on sequencing must follow the Stratix Device Family Data Sheet order to avoid latch-up. Use the Quartus II PowerPlay analyzer with realistic toggle rates to estimate worst-case current; a 79K-LE design with high DSP utilization can draw 3 A to 5 A on VCCINT.
The 1508-ball FC-FBGA package has theta_JA around 14 C/W (typical 4-layer JEDEC test board), so a 5 W dissipation yields a 70C junction temperature rise above ambient. For industrial or sealed enclosures, attach a heatsink or thermal interface material to the package lid and ensure adequate airflow. Avoid placing the FPGA directly above heat-generating components.
The 1.0 mm pitch FC-FBGA requires microvia or via-in-pad PCB technology, with matched-length routing for LVDS pairs and DDR address/control buses. Use at least 8 layers with dedicated ground and power planes. Decoupling: place 0.1 µF and 0.01 µF X7R ceramics close to every VCCINT and VCCIO pin, plus bulk tantalum or polymer capacitors on the board edges.
Do not assume that any Stratix -1 speed grade migrates seamlessly - speed-grade C5/C6/C7 differ in Fmax by approximately 10 percent each and may require re-running TimeQuest timing analysis. Industrial I-suffix variants share the same silicon but tighten the operating range to -40C to 100C, affecting timing closure. The N suffix only changes terminal finish to lead-free; performance is identical.
コンプライアンス情報
RoHS compliance per distributor listings; the standard EP1S80F1508C6 (without N suffix) typically uses SnPb finish. Choose EP1S80F1508C6N for explicit lead-free assembly. AEC-Q100 not applicable - this is a high-density FPGA, not an automotive-grade qualified IC.