EP2S180F1508I4 - Stratix II 180K LE FPGA 1170 I/O FC-FBGA | Intel
부품 번호: EP2S180F1508I4 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2240 | $1,120,000.00 |
| 1,000 | $2050 | $2,050,000.00 |
EP2S180F1508I4 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory and multiplier resources on a single silicon die. FPGAs sit at the apex of the programmable logic hierarchy, above CPLDs (Complex Programmable Logic Devices) and PALs (Programmable Array Logic), and provide ASIC-like density with the in-system reconfigurability of a programmable device. The Stratix II family specifically introduced an adaptive logic module (ALM) architecture that breaks from traditional 4-LUT designs, achieving roughly 50 percent higher logic utilization per die area than its Stratix predecessor.
Key features of the EP2S180F1508I4 include 384 maximum user I/O pins (verified datasheet total of 1,170 available pins across all I/O banks), 12 PLLs for multi-domain clock management, up to 717 MHz internal operation, and dedicated high-speed I/O supporting LVDS, LVPECL, and HyperTransport signalling. The embedded TriMatrix memory structure provides true dual-port, simple dual-port, and single-port RAM blocks with parity protection, optimized for high-bandwidth buffering in DSP pipelines and packet processing engines.
The device uses a low-k dielectric 90 nm process and incorporates dedicated hard IP blocks including 18-bit x 18-bit multipliers configurable as 36-bit multipliers, four 3.125 Gbps transceiver-ready I/O structures, and on-chip termination (OCT) to reduce external component count. The die is mounted flip-chip on a high-Tg substrate and capped with a metallic heat spreader, providing the thermal headroom required by the largest Stratix II devices. Configuration is supported via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG modes, with optional external configuration devices such as the EPC16 or EPCS family.
Typical applications for the EP2S180F1508I4 include high-performance ASIC prototyping, 10 Gbps and 40 Gbps wire-speed packet processing, software-defined radio (SDR) baseband preprocessing, test and measurement instrumentation with deep waveform capture memory, and broadcast video processing for HD-SDI and emerging 3G-SDI standards. The high logic and memory density makes it especially attractive for replacing gate arrays and small-cell ASICs where NRE cost cannot be amortized.
When designing with this part, allocate at least 1 VCCINT decoupling capacitor (0.1 uF X7R) per unique power pin, place VCCIO pins on quiet supply rails isolated from switching converters, and follow the Altera (now Intel) Stratix II Hardware Reference Manual guidelines for PCB stackup and via-in-pad thermal relief. Industrial-temperature screening means the I4 device operates reliably across -40C to +100C ambient; for full military screening, the equivalent EP2S180F1508I4N-grade part is available only through specific authorized distributors and lead times can exceed 12 weeks.
This page synthesizes distributor stock data, datasheet specifications, drop-in same-family alternatives, and practical design notes that go beyond the manufacturer datasheet, giving procurement and engineering teams a single source for the EP2S180F1508I4 lifecycle and replacement information.
드롭인 대체품: EP2S180F1508I4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S180F1508I4 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Family, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S180F1508C5N
✅ 드롭인✓ 재고 있음
$5050 / 개
데이터시트 보기 →EP2S180F1508C4N
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP2S180F1508C3N
✅ 드롭인✓ 재고 있음
$1200 / 개
데이터시트 보기 →EP2S180F1508I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$445 / 개
데이터시트 보기 →EP2S130F1508I4
✅ 드롭인✓ 재고 있음
$3950 / 개
데이터시트 보기 →EP2S130F1508I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1390 / 개
데이터시트 보기 →EP2S180F1508I4 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 179,400 |
| Total RAM Bits | 9,383,040 |
| Logic Array Blocks (LABs) | 8,970 |
| User I/O | 1,170 (verified I/O count across all banks) |
| DSP Blocks | 96 |
| Embedded PLLs | 12 |
| Core Voltage | 1.15 V to 1.25 V (1.2 V nominal) |
| Process Technology | 90 nm CMOS with low-k dielectric |
| 패키지 | 1508-ball FC-FBGA |
| Package Dimensions | 40 mm x 40 mm (Flip-Chip) |
| 동작 온도 | -40C to +100C (industrial, I4 grade) |
| Configuration Modes | PS, PPS, PPA, JTAG |
| RoHS 상태 | Compliant (per product page) |
EP2S180F1508I4 40 mm x 40 mm (flip-chip) 핀 구성 가이드
EP2S180F1508I4(40 mm x 40 mm (flip-chip) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S180F1508I4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S180F1508I4 적합 용도: 7 애플리케이션s: ASIC Prototyping and Emulation, 10 Gbps Wire-Speed Packet Processing, Software-Defined Radio (SDR) Baseband, Test and Measurement Instrumentation, Broadcast Video Processing (HD-SDI / 3G-SDI), High-Performance Computing Acceleration, Military and Aerospace Avionics.
ASIC Prototyping and Emulation
The EP2S180F1508I4's 179,400 logic elements and 9.38 Mbit of TriMatrix embedded memory make it a strong fit for ASIC and ASSP prototyping, where a single FPGA must emulate an entire multi-million-gate ASIC subsystem. With up to 12 PLLs and 96 DSP blocks, the device can host clock-domain-crossing logic that mirrors ASIC timing closure challenges, giving the verification team early confidence that the ASIC signoff will succeed. Designers typically partition a target ASIC into four or five Stratix II devices using pin-multiplexing to share the 1,170 available I/Os across emulator channels.
추천
10 Gbps Wire-Speed Packet Processing
With dedicated high-speed serial I/O structures supporting LVDS, LVPECL, and rates up to 3.125 Gbps per channel, the EP2S180F1508I4 is well matched to wire-speed packet processing for 10 Gbps and 40 Gbps line cards. The 9.38 Mbit of true dual-port TriMatrix memory provides headroom for packet buffer queues, while the 96 DSP blocks accelerate hash and CRC computations in classification pipelines. Up to 12 PLLs allow precise per-channel clock recovery from SGMII, XAUI, or Interlaken interfaces without external jitter cleaners.
추천
Software-Defined Radio (SDR) Baseband
The EP2S180F1508I4's combination of 96 DSP blocks, 12 PLLs, and 1,170 user I/Os makes it well suited for SDR baseband preprocessing where multi-antenna MIMO streams must be filtered, decimated, and channelized in real time. Designers can implement polyphase filter banks and FFT pipelines that consume 200K to 300K equivalent ASIC gates, fitting comfortably within the 179K LE budget. The industrial temperature grade supports outdoor deployment in military and tactical radio platforms.
추천
Test and Measurement Instrumentation
For deep-memory oscilloscopes, logic analyzers, and protocol analyzers, the EP2S180F1508I4 delivers the deep TriMatrix memory and high I/O count required to capture and time-stamp long record buffers in real time. The 8,970 LABs support custom triggering engines that combine edge, glitch, and pattern detection, while 1,170 user I/Os accept multi-channel probe inputs up to 1 GHz LVDS. Industrial temperature rating enables portable field instruments operating across -40C to +100C ambient.
추천
Broadcast Video Processing (HD-SDI / 3G-SDI)
The EP2S180F1508I4's high-speed LVDS I/O structures support SDI (Serial Digital Interface) rates from 270 Mbps SD-SDI up to 2.97 Gbps 3G-SDI without external serializer/deserializer chips. With 179,400 logic elements, designers can implement multi-channel format conversion, frame synchronization, and picture-in-picture blending for broadcast studio routers and edit suites. The 1508-ball FC-FBGA package provides the fine-pitch I/O density required for 16+ simultaneous SDI channels in a single device.
추천
High-Performance Computing Acceleration
HPC and computational finance workloads map efficiently onto the EP2S180F1508I4's 96 DSP blocks, which deliver up to 96 18-bit x 18-bit multiplications per clock cycle, accelerating Monte Carlo simulations and Monte Carlo option pricing in finance. The 9.38 Mbit of TriMatrix memory supports large lookup tables for credit default swap pricing and risk analytics. Up to 12 PLLs enable precise synchronization of multiple FPGAs across a co-processing cluster via low-jitter LVDS clock distribution.
추천
Military and Aerospace Avionics
The I4 industrial temperature grade of the EP2S180F1508I4 makes it suitable for military avionics subsystems operating in unpressurized bays where ambient temperatures swing from -40C to +100C. Applications include radar signal preprocessing, electronic warfare (EW) jamming pattern generation, and flight-control co-processors. The 1508-ball FC-FBGA package with integrated heat spreader supports the long-term reliability expectations of 20+ year defense program lifecycles when sourced through authorized distributors with full traceability.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S180F1508I4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S180F1508C5N | EP2S180F1508C4N | EP2S180F1508C3N | EP2S130F1508I4 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-FBGA (40x40 mm) | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same | 1508-FBGA (40x40 mm) - same |
| Logic Elements | 179,400 LE | 179,400 LE (same) | 179,400 LE (same) | 179,400 LE (same) | 132,540 LE (-26%) |
| Total RAM Bits | 9,383,040 bits | 9,383,040 bits (same) | 9,383,040 bits (same) | 9,383,040 bits (same) | 6,747,840 bits (-28%) |
| User I/O | 1,170 | 1,170 (same) | 1,170 (same) | 1,170 (same) | 1,170 (same) |
| DSP Blocks | 96 | 96 (same) | 96 (same) | 96 (same) | 64 (-33%) |
| Embedded PLLs | 12 | 12 (same) | 12 (same) | 12 (same) | 12 (same) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) - same |
| Speed Grade | I4 (industrial) | C5 (fastest commercial) | C4 (mid commercial) | C3 (slowest commercial) | I4 (same speed, lower density) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) |
주요 차별점
- Highest-density Stratix II member with 179,400 LE (vs EP2S130F1508I4)
- Industrial temperature grade support across -40C to +100C (vs EP2S180F1508C5N)
- 9.38 Mbit embedded TriMatrix memory for deep packet buffers (vs EP2S130F1508I4)
설계 노트
Estimated: At a 1.2 V core supply drawing approximately 16 A typical dynamic current, the EP2S180F1508I4 requires at least 24 low-inductance VCCINT decoupling capacitors of 0.1 uF X7R plus 4 bulk capacitors of 470 uF polymer placed within 0.5 inch of each power-pin cluster. Use via-in-pad construction with 0.5 mm via drill and 1.0 mm pad to meet Intel's Stratix II Hardware Reference Manual stackup recommendations. A 12-layer PCB with 1 oz copper inner planes and 2 oz copper outer layers is the recommended baseline.
Estimated: At typical operation with 50 percent logic utilization and 100 MHz clock activity, the EP2S180F1508I4 dissipates approximately 18 W to 22 W. With a published theta_JB of approximately 0.5 C/W and the integrated heat spreader, junction-to-ambient thermal resistance depends heavily on airflow and heatsink mounting torque. For industrial -40C to +100C ambient operation in a sealed enclosure, derate junction temperature budget by 15C and consider a 20x20 mm aluminum heatsink with thermal interface material rated at 0.1 C/W-in2.
Place configuration device (EPC16, EPCS64, or compatible) within 2 inches of the FPGA's configuration pins to meet passive-serial and passive-parallel timing. Route the nCONFIG, nSTATUS, CONF_DONE, and DCLK signals on the same PCB layer with matched lengths and 50 ohm controlled impedance. The JTAG chain (TCK, TMS, TDI, TDO) should be series-terminated at the FPGA end and chain integrity verified before power-up to avoid configuration failures on the 1508-ball FC-FBGA.
Do not hot-plug the EP2S180F1508I4 - the Stratix II family does not support live insertion and can suffer latch-up damage if VCCINT ramps before VCCIO. Follow the recommended power sequencing: VCCIO must be within 1.2 V of VCCINT during ramp, otherwise internal ESD diodes forward-bias. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to confirm worst-case junction temperature before PCB commit; the EPE accepts 90 nm process-specific derating factors absent from generic thermal calculators.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel product page. AEC-Q100 not applicable for FPGAs - this is a logic device, not an automotive analog IC. Industrial temperature grade (-40C to +100C) per I4 suffix.