EP2SGX60CF780C7 - Stratix II GX FPGA, 60K LE, 780-FCBGA | Altera
部品番号: EP2SGX60CF780C7 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $240 | $120,000.00 |
| 1,000 | $215 | $215,000.00 |
EP2SGX60CF780C7 概要
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy a tier in the digital design hierarchy that sits between fixed-function ASICs and software-programmable processors: more flexible than an ASIC, far faster and more parallel than a general-purpose MCU. The Stratix II GX family specifically targets high-speed serial connectivity applications where the integrated transceivers and hardened PCS/PMA blocks dramatically reduce design effort for protocols such as PCI Express, Serial RapidIO, Fibre Channel, and Gigabit Ethernet.
Key differentiating features of the EP2SGX60CF780C7 include up to 364 user I/O pins, 24 DSP blocks (for 18x18 multipliers and accumulators), 12 transceiver channels supporting data rates from 600 Mbps to 6.375 Gbps, and dedicated on-chip termination for AC-coupled and DC-coupled serial links. The Stratix II GX architecture introduced the ALM, which packs eight inputs into a single LUT-based adaptive logic element, providing roughly twice the logic density of the prior Stratix generation. Hot-socketing support, robust SEU mitigation via CRC-driven configuration, and remote upgrade capability round out the feature set.
Typical applications include high-end telecommunications line cards, broadcast video processing, high-performance computing acceleration, and high-speed serial protocol bridging. The integrated transceivers make the device particularly attractive for backplane aggregation, serializer/deserializer (SerDes) replacement, and protocol conversion in routers, switches, and base-station equipment. Designers should note that the 'C7' speed grade is the slowest commercial grade offered; faster 'C5' and 'C6' parts in the same package are drop-in upgrades when timing margins are tight.
When designing the PCB, allocate at least four PCB layers with continuous power and ground planes beneath the BGA, follow Altera's recommended decoupling scheme (typically one bulk capacitor per PLL and one per transceiver channel plus 0.1 uF/0.01 uF pairs near every power pin), and observe the FCBGA's 1.0 mm ball pitch land pattern. The high transceiver data rate requires careful attention to channel loss, return loss, and via-stub compensation on the serial links.
ドロップイン代替品: EP2SGX60CF780C7 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2SGX60CF780C7 （同一形状・フットプリント） — 相違点: Package, Speed Grade, Operating Temperature, RoHS Status, Internal Frequency (max).
クイック比較ツール — 並列比較する代替部品を選択:
EP2SGX60CF780C5N
✅ ドロップイン✓ 在庫あり
$485 / 個
データシートを見る →EP2SGX60CF780C5
✅ ドロップイン✓ 在庫あり
$162 / 個
データシートを見る →EP2SGX60CF780C4N
✅ ドロップイン✓ 在庫あり
$220 / 個
データシートを見る →EP2SGX60CF780C4
✅ ドロップイン✓ 在庫あり
$171 / 個
データシートを見る →EP2SGX60CF780C3N
✅ ドロップイン✓ 在庫あり
$285 / 個
データシートを見る →EP2SGX60CF780C3
✅ ドロップイン✓ 在庫あり
$870 / 個
データシートを見る →EP2SGX60CF780C
✅ ドロップイン✓ 在庫あり
$285 / 個
データシートを見る →EP2SGX60CF780C7 最大定格＆電気的特性
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Embedded Memory Bits | 2,544,192 bits |
| DSP Blocks | 24 (18x18 multipliers) |
| Maximum User I/O | 364 |
| Transceiver Channels | 12 |
| Transceiver Data Rate | 600 Mbps to 6.375 Gbps |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Speed Grade | C7 |
| パッケージ | 780-ball FCBGA |
| Ball Pitch | 1.0 mm |
| 動作温度 | 0C to +85C (commercial) |
| Configuration Scheme | Enhanced Configuration (EPC) |
EP2SGX60CF780C7 780-ball fcbga ピン配置ガイド
EP2SGX60CF780C7 (780-ball fcbga パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2SGX60CF780C7.
詳細は データシート をご参照ください。
主な用途
EP2SGX60CF780C7 の用途: 6 件s: Telecom Line-Card Aggregation, PCI Express Gen1 Endpoint / Root Complex, Broadcast Video Processing, Industrial Protocol Bridging, Aerospace Test & Simulation, High-Performance DSP Co-Processor.
Telecom Line-Card Aggregation
The EP2SGX60CF780C7 fits telecom line-card aggregation because its 12 hardened 6.375 Gbps transceivers directly map onto backplane lanes for 10G Ethernet, OC-192, or stacked 1G/2.5G links. With 60,440 LEs and 2.5 Mbit of embedded memory, it absorbs the framer, MAC, and traffic-management blocks without requiring external companion devices, reducing BOM and board area. The C7 speed grade is sufficient for 156.25 MHz system clocks driving standard telecom protocols.
おすすめ
PCI Express Gen1 Endpoint / Root Complex
The EP2SGX60CF780C7 supports PCI Express Gen 1 (2.5 Gbps) through its integrated transceiver and the hard PCI Express hard IP block available in Quartus II. With 60K LEs and 24 DSP blocks, the device can implement a multi-lane PCIe endpoint plus payload logic for DSP cards, frame grabbers, or protocol analysers. The 780-ball FCBGA exposes enough high-speed I/O for x4 or x8 PCIe lane widths, making it a strong fit for low-volume industrial compute cards.
おすすめ
Broadcast Video Processing
The EP2SGX60CF780C7 is well matched to broadcast video processing because the 24 dedicated DSP blocks accelerate HD-SDI and 3G-SDI physical-layer encoding, scrambling, and CRC calculation at the line rates these protocols demand. Combined with the 12 transceivers, the device can accept and transmit multiple SDI streams simultaneously, perform format conversion (1080i to 720p, de-interlacing, scaling), and pass through to downstream video routing fabric in a single chip.
おすすめ
Industrial Protocol Bridging
For industrial protocol bridging (PROFINET, EtherCAT, SERCOS III, Modbus TCP), the EP2SGX60CF780C7 provides the logic density to implement the full protocol stack plus 2 or 3 physical ports on its 6.375 Gbps transceivers. The on-chip PLL and SERDES flexibility allows reconfiguration for 100 Mbps industrial Ethernet at MII/RGMII, while remaining capable of 1 Gbps on the same pins. Industrial designs benefit from the C7 commercial temperature grade (0 to 85C) and the FCBGA's mechanical robustness.
おすすめ
Aerospace Test & Simulation
In aerospace test and simulation hardware, the EP2SGX60CF780C7 is used to generate and analyse MIL-STD-1553, ARINC 429, or custom serial protocols, and to drive radar-data interfaces such as LVDS or sFPDP at multi-gigabit rates. The device's 60K LEs and DSP blocks allow real-time signal processing (FFT, pulse compression, doppler filtering) on captured waveforms, while the integrated transceivers push results to downstream recorders at 6 Gbps. Note that aerospace applications typically require the industrial (I-grade) variant.
おすすめ
High-Performance DSP Co-Processor
The EP2SGX60CF780C7's 24 DSP blocks each capable of 18x18 multiplication at 370 MHz make it attractive as a co-processor for radar, sonar, or scientific instrumentation applications that offload FFTs, convolutions, and matrix arithmetic from a host CPU. The 2.5 Mbit of embedded RAM provides on-chip line buffers for streaming algorithms, and the 12 transceivers shuttle digitised data into and out of the device at multi-gigabit rates. The C7 speed grade limits DSP clock frequency but is acceptable for many mid-bandwidth DSP tasks.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2SGX60CF780C7 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2SGX60CF780C5N | EP2SGX60CF780C5 | EP2SGX60CF780C4N | EP2SGX60CF780C3N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FCBGA | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C7 | C5 (faster) | C5 (faster) | C4 (faster) | C3 (fastest) |
| Transceiver Channels | 12 | 12 | 12 | 12 | 12 |
| Max Transceiver Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| DSP Blocks | 24 | 24 | 24 | 24 | 24 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
主な差別化要因
- Same-die, same-footprint upgrade path within Stratix II GX family （vs EP2SGX60CF780C5N)
- Lead-free / RoHS compliant variant available （vs EP2SGX60CF780C5)
- Most logic-dense member of the Stratix II GX 780-ball FCBGA family （vs EP2SGX30CF780C7)
設計ノート
The EP2SGX60CF780C7 requires multiple power rails: VCCINT (1.2 V core), VCCIO (1.2/1.5/1.8/2.5/3.3 V depending on I/O standard), VCCA_PLL (1.2 V analog PLL supply), VCCA_TX and VCCA_RX (3.3 V analog transceiver supplies), and VCCPD (3.3 V configuration/pre-drive supply). Each rail must be decoupled with one bulk 47-220 uF capacitor per 6-8 balls plus 0.1 uF and 0.01 uF pairs. Power sequencing should follow Altera's reference design: VCCINT ramps first, then VCCPD, then VCCIO, then analog supplies; failure to sequence can trigger long-term reliability issues on the high-speed transceivers.
Estimated: at full 6.375 Gbps utilisation across 12 channels plus 60K-LE fabric at 50% toggle rate, the EP2SGX60CF780C7 dissipates approximately 12-15 W. The FCBGA package has a published theta_JA around 12-15 C/W with 4-layer JEDEC test board airflow, giving a junction-to-ambient temperature rise of 180 C at 12 W. Designers must include thermal vias under the die, an inner copper pour, and forced airflow if junction temperature must stay below 100 C. Use Quartus II PowerPlay early estimator to refine before board layout commitment.
The 780-ball FCBGA at 1.0 mm pitch requires at minimum a 6-layer PCB stack-up with the top layer reserved for BGA fan-out, two inner solid ground planes beneath the BGA, two inner solid power planes, and the bottom layer for additional signals. Use 8 mil (0.2 mm) via pads with 12 mil (0.3 mm) drilled vias for inner balls; for deep fan-out from inner rows, laser-drilled micro-vias (stacked or staggered) are highly recommended. Follow Altera's Stratix II GX PCB Design Guidelines for trace widths, differential pair impedance (100 ohm +/-10%), and length matching within transceiver channels (max 5 mil mismatch per inch of pair length).
Three common pitfalls with the EP2SGX60CF780C7: (1) failing to provide the dedicated JTAG pull-up resistors on TCK, TMS, TDI, and nCONFIG - USB-Blaster cannot reliably detect the device; (2) selecting I/O standard voltage that exceeds the transceiver reference clock supply, causing configuration failure at power-up; (3) attempting in-system reprogramming without proper CONF_DONE and nSTATUS pull-ups, leading to intermittent boot failures. Also note that Quartus II 13.0sp1 or earlier is required - Quartus Prime 19.1+ no longer supports Stratix II / II GX.
For 6.375 Gbps serial links from the EP2SGX60CF780C7, design the differential channel to maintain 100 ohm differential impedance with 85 ohm common-mode, target 6 dB total channel loss or less at the Nyquist frequency (3.1875 GHz), and use AC-coupled capacitors (0.01 uF) at the transmitter output and receiver input. Via stubs should be back-drilled or eliminated where possible. Use HyperLynx or SiSoft QCD/QSI for pre-layout channel simulation, and verify with eye-diode and BERT measurements at compliance.
コンプライアンス情報
RoHS / REACH / lead-free status not explicitly stated in the verified web data for the EP2SGX60CF780C7 base part. The 'N' suffix on alternatives (e.g. EP2SGX60CF780C5N) denotes lead-free / RoHS-compliant packaging per Altera/Intel ordering nomenclature. AEC-Q100 is not applicable for FPGAs.
